JP6562518B2 - high−k、金属ゲートCMOSプロセスフローへのメモリトランジスタの集積 - Google Patents
high−k、金属ゲートCMOSプロセスフローへのメモリトランジスタの集積 Download PDFInfo
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- JP6562518B2 JP6562518B2 JP2016545744A JP2016545744A JP6562518B2 JP 6562518 B2 JP6562518 B2 JP 6562518B2 JP 2016545744 A JP2016545744 A JP 2016545744A JP 2016545744 A JP2016545744 A JP 2016545744A JP 6562518 B2 JP6562518 B2 JP 6562518B2
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- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
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- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
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- H01L29/66545—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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Description
本出願は、35 U.S.C. 119(e)の下、2013年9月27日に出願された、米国仮特許出願シリアル番号61/883,873号の優先権を主張するものであり、当該出願の開示全体は、参照によりここに組み込まれる。
本開示は、概して、半導体デバイスに関するものであり、より具体的には、埋め込まれた又は集積して形成されたSONOSベースの不揮発性メモリ(NVM)トランジスタ、及び、high−k誘電体及び金属ゲートを含む金属酸化膜半導体(MOS)トランジスタを含むメモリセル及びその製造方法に関する。
Claims (12)
- 不揮発性メモリ(NVM)領域及び複数の金属酸化物半導体(MOS)領域を含む基板のNVM領域にNVMトランジスタのゲートスタックを形成するステップと、
前記NVMトランジスタのゲートスタックのhigh―k誘電体材料を含むブロッキング誘電体と、前記複数のMOS領域のhigh−kゲート誘電体とを同時に形成するように、前記ゲートスタック及び前記複数のMOS領域の上方にhigh−k誘電体材料を堆積するステップと、
を含み、
前記high−k誘電体材料を堆積するステップの前に、
前記NVMトランジスタのゲートスタックと、前記複数のMOSトランジスタの少なくとも1つの入力/出力電界効果トランジスタ(I/O FET)の厚いゲート酸化物の上方に高温酸化物(HTO)を同時に形成するように、酸化プロセスを実行するステップと、
NVMトランジスタの前記ゲートスタックと前記I/O FETの厚いゲート酸化物との上方にマスクを形成するステップと、
残りの複数のMOS領域の上方に形成された前記ゲート酸化物を除去するステップと、
前記マスクを除去するステップと、をさらに含む方法。 - 請求項1に記載の方法において、前記NVMトランジスタの前記ゲートスタックの上方に金属ゲートと、前記複数のMOS領域の第1のMOS領域の低電圧電界効果トランジスタ(LVFET)の第1の種類の金属ゲートとを同時に形成するように、high−k誘電体材料の上方に第1の金属層を堆積させ、かつ該第1の金属層をパターニングするステップをさらに含む、方法。
- 請求項2に記載の方法において、前記複数のMOS領域の第2のMOS領域のLVFETの第2の種類の金属ゲートと、前記複数のMOS領域の第3のMOS領域の入力/出力電界効果トランジスタ(I/O FET)とを同時に形成するように、第2の金属層を堆積させ、かつパターニングするステップをさらに含む、方法。
- 請求項1に記載の方法において、前記NVMトランジスタの前記ゲートスタックの上方に複数層の金属ポリシリコンゲートと、前記複数のMOS領域の少なくとも1つのMOSトランジスタとを同時に形成するように、前記high−k誘電体材料の上方に金属層及びポリシリコン層を堆積させ、かつ該金属層及び該ポリシリコン層をパターニングするステップをさらに含む、方法。
- 請求項4に記載の方法において、前記金属層は、前記NVMトランジスタ及び第1の種類のLVFETの、高仕事関数の複数層の金属ポリシリコンゲートを形成するP+金属層を含む、方法。
- 請求項4に記載の方法において、前記金属層は、前記NVMトランジスタ及び第1の種類のLVFETの、低仕事関数の複数層の金属ポリシリコンゲートを形成するN+金属層を含む、方法。
- 請求項1に記載の方法において、前記NVMトランジスタの前記ゲートスタックを形成する前に、前記NVMトランジスタ及び少なくとも1つのMOSトランジスタのウェルを同時に形成するように、前記NVM領域及び前記複数のMOS領域の少なくとも1つに、第1の種類のイオンを注入するステップをさらに含む、方法。
- 不揮発性メモリ(NVM)領域及び複数の金属酸化物半導体(MOS)領域を含む基板のNVM領域にNVMトランジスタのゲートスタックを形成するステップと、
前記NVMトランジスタの前記ゲートスタックの上方にダミーポリシリコンゲートと、前記複数のMOS領域のダミーポリシリコンゲートとを同時に形成するように、前記NVM領域及び前記複数のMOS領域の上方にポリシリコン層を堆積させ、ポリシリコン層をパターニングするステップと、
前記ダミーポリシリコンゲートに隣接する側壁スペーサを形成するステップと、
前記ダミーポリシリコンゲートを除去するステップと、
前記NVMトランジスタの前記ゲートスタックにおけるhigh−k誘電体材料を含むブロッキング誘電体と、前記複数のMOS領域のhigh−kゲート誘電体とを同時に形成するように、前記ダミーポリシリコンゲートの除去で形成される開口部において、前記NVMトランジスタの前記ゲートスタック及び複数のMOS領域の上方にhigh−k誘電体材料を堆積させるステップと、
前記NVMトランジスタ及び前記複数のMOS領域における少なくとも1つのMOSトランジスタの複数層の金属ゲートの第1の層を同時に形成するように、前記high−k誘電体材料の上方に金属層を堆積させるステップと、を含み、
前記金属層は、NVMトランジスタ及び第1の種類のLVFETの、高仕事関数の複数層の金属ポリシリコンゲートを形成するP+金属層を含むか、又は、NVMトランジスタ及び第1の種類のLVFETの、低仕事関数の複数層の金属ポリシリコンゲートを形成するN+金属層を含む、方法。 - 不揮発性メモリ(NVM)領域及び複数の金属酸化物半導体(MOS)領域を含む基板のNVM領域にNVMトランジスタのゲートスタックを形成するステップであって、該ゲートスタックは、該基板の表面上に形成されるトンネル誘電体と該トンネル誘電体上に形成される電荷トラップ層とを含む、形成するステップと、
前記NVMトランジスタの前記ゲートスタックの前記電荷トラップ層のhigh−k誘電体材料を含む複数層の電荷トラップ層と、前記複数のMOS領域のhigh−kゲート誘電体とを同時に形成するように、前記NVMトランジスタの前記ゲートスタック及び前記複数のMOS領域の上方にhigh−k誘電体材料を堆積させるステップと、
ブロッキング誘電体を形成するように、前記NVMトランジスタの前記ゲートスタックにおける前記high−k誘電体材料の上方に酸化物を堆積させるステップと、
前記NVMトランジスタの前記ゲートスタック及び前記複数のMOS領域の少なくとも1つのMOSトランジスタの上方に複数層の金属ポリシリコンゲートを同時に形成するように、前記ブロッキング誘電体及び前記複数のMOS領域の前記high−kゲート誘電体の上方に金属層及びポリシリコン層を堆積させ、かつ前記金属層及びポリシリコン層をパターニングするステップと、
を含み、
前記金属層は、前記NVMトランジスタ及び第1の種類のLVFETの、高仕事関数の複数層の金属ポリシリコンゲートを形成するP+金属層を含むか、又は、前記NVMトランジスタ及び第1の種類のLVFETの、低仕事関数の複数層の金属ポリシリコンゲートを形成するN+金属層を含む、方法。 - 不揮発性メモリ(NVM)領域及び複数の金属酸化物半導体(MOS)領域を含む基板のNVM領域にNVMトランジスタのゲートスタックを形成するステップであって、該ゲートスタックは、該基板の表面上に形成されるトンネル誘電体と該トンネル誘電体上に形成される電荷トラップ層とを含む、形成するステップと、
前記NVMトランジスタの前記ゲートスタックの前記電荷トラップ層のhigh−k誘電体材料を含む複数層の電荷トラップ層と、前記複数のMOS領域のhigh−kゲート誘電体とを同時に形成するように、前記NVMトランジスタの前記ゲートスタック及び前記複数のMOS領域の上方にhigh−k誘電体材料を堆積させるステップと、
ブロッキング誘電体を形成するように、前記NVMトランジスタの前記ゲートスタックにおける前記high−k誘電体材料の上方に酸化物を堆積させるステップと、
前記NVMトランジスタの前記ゲートスタックの上方にダミーポリシリコンゲートと、前記複数のMOS領域のダミーポリシリコンゲートとを同時に形成するように、前記ブロッキング誘電体及び前記複数のMOS領域の前記high−kゲート誘電体の上方にポリシリコン層を堆積させ、かつ該ポリシリコン層をパターニングするステップと、
前記ダミーポリシリコンゲートに隣接する側壁スペーサを形成するステップと、
前記ダミーポリシリコンゲートを除去するステップと、
を含む方法。 - 請求項10に記載の方法において、前記NVMトランジスタのゲートスタック及び前記複数のMOS領域の少なくとも1つのMOSトランジスタの上方に複数層の金属ゲートを同時に形成するように、前記ブロッキング誘電体及び前記ダミーポリシリコンゲートの除去で形成される開口部の前記high−kゲート誘電体の上方に第1の金属層及び第2の金属層を堆積させるステップをさらに含む、方法。
- 請求項11に記載の方法において、前記第1の金属層は、前記NVMトランジスタ及び第1の種類のLVFETの、高仕事関数の複数層の金属ゲートを形成するP+金属層を含む、方法。
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US14/229,594 | 2014-03-28 | ||
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US20170278853A1 (en) | 2017-09-28 |
KR20160064041A (ko) | 2016-06-07 |
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CN108493101A (zh) | 2018-09-04 |
US20180166452A1 (en) | 2018-06-14 |
US9721962B1 (en) | 2017-08-01 |
US10784277B2 (en) | 2020-09-22 |
JP2019204964A (ja) | 2019-11-28 |
US9911746B1 (en) | 2018-03-06 |
TW201513311A (zh) | 2015-04-01 |
TWI637486B (zh) | 2018-10-01 |
CN105340068A (zh) | 2016-02-17 |
TWI697100B (zh) | 2020-06-21 |
CN105340068B (zh) | 2018-03-27 |
US8883624B1 (en) | 2014-11-11 |
WO2015047701A1 (en) | 2015-04-02 |
CN108493101B (zh) | 2022-11-18 |
TW201843812A (zh) | 2018-12-16 |
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