JP6552894B2 - 真空処理装置 - Google Patents

真空処理装置 Download PDF

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Publication number
JP6552894B2
JP6552894B2 JP2015137364A JP2015137364A JP6552894B2 JP 6552894 B2 JP6552894 B2 JP 6552894B2 JP 2015137364 A JP2015137364 A JP 2015137364A JP 2015137364 A JP2015137364 A JP 2015137364A JP 6552894 B2 JP6552894 B2 JP 6552894B2
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Japan
Prior art keywords
vacuum
lock chamber
pressure
chamber
exhaust
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Expired - Fee Related
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JP2015137364A
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Japanese (ja)
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JP2017022215A (ja
JP2017022215A5 (enExample
Inventor
勉 松芳
勉 松芳
恵太郎 小川
恵太郎 小川
満知明 小林
満知明 小林
一幸 廣實
一幸 廣實
優也 溝部
優也 溝部
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2015137364A priority Critical patent/JP6552894B2/ja
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JP2015137364A 2015-07-09 2015-07-09 真空処理装置 Expired - Fee Related JP6552894B2 (ja)

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JP2015137364A JP6552894B2 (ja) 2015-07-09 2015-07-09 真空処理装置

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JP2015137364A JP6552894B2 (ja) 2015-07-09 2015-07-09 真空処理装置

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JP2017022215A JP2017022215A (ja) 2017-01-26
JP2017022215A5 JP2017022215A5 (enExample) 2018-08-16
JP6552894B2 true JP6552894B2 (ja) 2019-07-31

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JP2015137364A Expired - Fee Related JP6552894B2 (ja) 2015-07-09 2015-07-09 真空処理装置

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JP (1) JP6552894B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230048337A1 (en) * 2021-08-16 2023-02-16 Applied Materials, Inc. Prevention of contamination of substrates during pressure changes in processing systems

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3172627B2 (ja) * 1992-09-03 2001-06-04 東京エレクトロン株式会社 真空形成方法および真空形成装置
JPH09306972A (ja) * 1996-05-17 1997-11-28 C Bui Res:Kk 半導体製造装置
JPH10163177A (ja) * 1996-12-03 1998-06-19 Matsushita Electric Ind Co Ltd 基板のプラズマクリーニング装置およびプラズマクリーニング方法
JP2001102281A (ja) * 1999-09-28 2001-04-13 Canon Inc ロードロック室、チャンバ、半導体製造装置およびデバイス製造方法
JP2009252953A (ja) * 2008-04-04 2009-10-29 Hitachi High-Technologies Corp 真空処理装置
JP5318533B2 (ja) * 2008-11-04 2013-10-16 コバレントマテリアル株式会社 減圧排気弁

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