JP2017022215A5 - - Google Patents

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Publication number
JP2017022215A5
JP2017022215A5 JP2015137364A JP2015137364A JP2017022215A5 JP 2017022215 A5 JP2017022215 A5 JP 2017022215A5 JP 2015137364 A JP2015137364 A JP 2015137364A JP 2015137364 A JP2015137364 A JP 2015137364A JP 2017022215 A5 JP2017022215 A5 JP 2017022215A5
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JP
Japan
Prior art keywords
lock chamber
vacuum
chamber
pressure
processing apparatus
Prior art date
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Application number
JP2015137364A
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English (en)
Japanese (ja)
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JP2017022215A (ja
JP6552894B2 (ja
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Priority to JP2015137364A priority Critical patent/JP6552894B2/ja
Priority claimed from JP2015137364A external-priority patent/JP6552894B2/ja
Publication of JP2017022215A publication Critical patent/JP2017022215A/ja
Publication of JP2017022215A5 publication Critical patent/JP2017022215A5/ja
Application granted granted Critical
Publication of JP6552894B2 publication Critical patent/JP6552894B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015137364A 2015-07-09 2015-07-09 真空処理装置 Expired - Fee Related JP6552894B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015137364A JP6552894B2 (ja) 2015-07-09 2015-07-09 真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015137364A JP6552894B2 (ja) 2015-07-09 2015-07-09 真空処理装置

Publications (3)

Publication Number Publication Date
JP2017022215A JP2017022215A (ja) 2017-01-26
JP2017022215A5 true JP2017022215A5 (enExample) 2018-08-16
JP6552894B2 JP6552894B2 (ja) 2019-07-31

Family

ID=57888440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015137364A Expired - Fee Related JP6552894B2 (ja) 2015-07-09 2015-07-09 真空処理装置

Country Status (1)

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JP (1) JP6552894B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230048337A1 (en) * 2021-08-16 2023-02-16 Applied Materials, Inc. Prevention of contamination of substrates during pressure changes in processing systems

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3172627B2 (ja) * 1992-09-03 2001-06-04 東京エレクトロン株式会社 真空形成方法および真空形成装置
JPH09306972A (ja) * 1996-05-17 1997-11-28 C Bui Res:Kk 半導体製造装置
JPH10163177A (ja) * 1996-12-03 1998-06-19 Matsushita Electric Ind Co Ltd 基板のプラズマクリーニング装置およびプラズマクリーニング方法
JP2001102281A (ja) * 1999-09-28 2001-04-13 Canon Inc ロードロック室、チャンバ、半導体製造装置およびデバイス製造方法
JP2009252953A (ja) * 2008-04-04 2009-10-29 Hitachi High-Technologies Corp 真空処理装置
JP5318533B2 (ja) * 2008-11-04 2013-10-16 コバレントマテリアル株式会社 減圧排気弁

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