JP6552383B2 - 自動化されたtem試料調製 - Google Patents

自動化されたtem試料調製 Download PDF

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Publication number
JP6552383B2
JP6552383B2 JP2015215353A JP2015215353A JP6552383B2 JP 6552383 B2 JP6552383 B2 JP 6552383B2 JP 2015215353 A JP2015215353 A JP 2015215353A JP 2015215353 A JP2015215353 A JP 2015215353A JP 6552383 B2 JP6552383 B2 JP 6552383B2
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probe
sample
image
tip
charged particle
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Japanese (ja)
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JP2016105077A5 (enExample
JP2016105077A (ja
Inventor
ヴァレリー・ブローデン
ジェフリー・ブラックウッド
マイケル・シュミット
ドゥルティ・トリヴェディ
リチャード・ジェイ・ヤング
トーマス・ジー・ミラー
ブライアン・ロバーツ・ルース・ジュニア
ステーシー・ストーン
トッド・テンプルトン
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エフ・イ−・アイ・カンパニー
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/302Controlling tubes by external information, e.g. programme control
    • H01J37/3023Programme control
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/285Emission microscopes, e.g. field-emission microscopes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045Object or beam position registration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/31Electron-beam or ion-beam tubes for localised treatment of objects for cutting or drilling
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G01N2001/2873Cutting or cleaving
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/208Elements or methods for movement independent of sample stage for influencing or moving or contacting or transferring the sample or parts thereof, e.g. prober needles or transfer needles in FIB/SEM systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/3174Etching microareas
    • H01J2237/31745Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
JP2015215353A 2014-11-07 2015-11-01 自動化されたtem試料調製 Active JP6552383B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462077148P 2014-11-07 2014-11-07
US62/077,148 2014-11-07

Publications (3)

Publication Number Publication Date
JP2016105077A JP2016105077A (ja) 2016-06-09
JP2016105077A5 JP2016105077A5 (enExample) 2018-12-13
JP6552383B2 true JP6552383B2 (ja) 2019-07-31

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Family Applications (1)

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JP2015215353A Active JP6552383B2 (ja) 2014-11-07 2015-11-01 自動化されたtem試料調製

Country Status (5)

Country Link
US (3) US9601313B2 (enExample)
EP (1) EP3018693B1 (enExample)
JP (1) JP6552383B2 (enExample)
KR (1) KR101970478B1 (enExample)
CN (1) CN105588742A (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102383571B1 (ko) * 2014-06-30 2022-04-06 가부시키가이샤 히다치 하이테크 사이언스 자동 시료 제작 장치
JP6552383B2 (ja) * 2014-11-07 2019-07-31 エフ・イ−・アイ・カンパニー 自動化されたtem試料調製
US9837246B1 (en) 2016-07-22 2017-12-05 Fei Company Reinforced sample for transmission electron microscope
JP7113613B2 (ja) 2016-12-21 2022-08-05 エフ イー アイ カンパニ 欠陥分析
JP6931214B2 (ja) * 2017-01-19 2021-09-01 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
JP6885576B2 (ja) * 2017-01-19 2021-06-16 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
DE102017202339B3 (de) 2017-02-14 2018-05-24 Carl Zeiss Microscopy Gmbh Strahlsystem mit geladenen Teilchen und Verfahren dafür
US10303829B2 (en) 2017-05-31 2019-05-28 International Business Machines Corporation Automated method for integrated analysis of back end of the line yield, line resistance/capacitance and process performance
DE102017212020B3 (de) 2017-07-13 2018-05-30 Carl Zeiss Microscopy Gmbh Verfahren zur In-situ-Präparation und zum Transfer mikroskopischer Proben, Computerprogrammprodukt sowie mikroskopische Probe
JP7109051B2 (ja) * 2018-03-30 2022-07-29 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
DE102018108974B3 (de) 2018-04-16 2019-05-09 Carl Zeiss Microscopy Gmbh Verfahren zum Herstellen einer TEM-Probe
DE102018206278A1 (de) 2018-04-24 2019-10-24 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Entfernen eines Partikels von einer photolithographischen Maske
DE102018010436B4 (de) 2018-06-21 2025-01-23 Carl Zeiss Smt Gmbh Vorrichtung zum Untersuchen und/oder zum Bearbeiten einer Probe
DE102018210098B4 (de) 2018-06-21 2022-02-03 Carl Zeiss Smt Gmbh Vorrichtung und Verfahren zum Untersuchen und/oder zum Bearbeiten einer Probe
CN109011030B (zh) * 2018-08-08 2021-02-09 长沙理工大学 自动注射仪器针头的位置检测矫正方法及装置
CN110514679B (zh) * 2019-09-16 2021-04-30 南京大学 一种带有活动拉曼针尖探头的透射电镜原位反应舱芯片及其使用方法
US11355305B2 (en) * 2019-10-08 2022-06-07 Fei Company Low keV ion beam image restoration by machine learning for object localization
CN110554063B (zh) * 2019-10-21 2021-10-12 长江存储科技有限责任公司 一种tem样品以及制备tem样品的方法
CN111537533B (zh) * 2020-03-24 2023-06-30 天津华慧芯科技集团有限公司 一种尖晶石微米颗粒的球差矫正tem样品制备方法
DE102020112220B9 (de) * 2020-05-06 2022-05-25 Carl Zeiss Microscopy Gmbh Teilchenstrahlgerät zum Abtragen mindestens eines Materials von einer Materialeinheit und Anordnen des Materials an einem Objekt
GB202013591D0 (en) * 2020-08-28 2020-10-14 Oxford Instr Nanotechnology Ltd Sample preparation and method aparatus
EP4068333A1 (en) * 2021-03-31 2022-10-05 FEI Company Sample carrier for use in a charged particle microscope, and a method of using such a sample carrier in a charged particle microscope
DE102021205001B4 (de) * 2021-05-18 2023-07-27 Carl Zeiss Microscopy Gmbh Verfahren zum Positionieren von Objekten in einem Teilchenstrahlmikroskop mithilfe einer flexiblen Teilchenstrahlschranke sowie Computerprogrammprodukt
CN114858828A (zh) * 2022-02-23 2022-08-05 厦门士兰集科微电子有限公司 透射电子显微镜样品的制备方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0542524Y2 (enExample) * 1987-11-18 1993-10-26
JPH03230696A (ja) * 1990-02-05 1991-10-14 Nec Corp 移動体速度検知装置
JP2774884B2 (ja) * 1991-08-22 1998-07-09 株式会社日立製作所 試料の分離方法及びこの分離方法で得た分離試料の分析方法
JP3613039B2 (ja) * 1998-12-02 2005-01-26 株式会社日立製作所 試料作製装置
US6405584B1 (en) * 1999-10-05 2002-06-18 Agere Systems Guardian Corp. Probe for scanning probe microscopy and related methods
WO2002095378A1 (en) * 2000-05-22 2002-11-28 Moore Thomas M Method for sample separation and lift-out
EP1425729B1 (en) 2001-08-23 2014-06-11 Fei Company Graphical automated machine control and metrology
JP2003156539A (ja) * 2001-11-26 2003-05-30 Hitachi Ltd 評価装置および評価方法
KR100984608B1 (ko) * 2003-09-23 2010-09-30 지벡스 인스투르먼츠, 엘엘시 집속 이온빔으로 준비한 샘플을 파지하는 파지 요소를 사용한 현미경 검사 방법, 시스템 및 장치
JP2005147671A (ja) * 2003-11-11 2005-06-09 Hitachi Ltd 荷電粒子線調整方法および装置
JP4130798B2 (ja) * 2003-12-05 2008-08-06 株式会社日立ハイテクノロジーズ プローブ付き複合顕微鏡及びプローブ駆動方法
US20090138995A1 (en) * 2005-06-16 2009-05-28 Kelly Thomas F Atom probe component treatments
JP2007018935A (ja) * 2005-07-08 2007-01-25 Hitachi High-Technologies Corp プローブ付き顕微鏡及びプローブ接触方法
EP2095134B1 (en) * 2006-10-20 2017-02-22 FEI Company Method and apparatus for sample extraction and handling
JP5959139B2 (ja) 2006-10-20 2016-08-02 エフ・イ−・アイ・カンパニー S/temのサンプルを分析する方法
JP2008210732A (ja) * 2007-02-28 2008-09-11 Hitachi High-Technologies Corp 荷電粒子ビーム装置
US7834315B2 (en) * 2007-04-23 2010-11-16 Omniprobe, Inc. Method for STEM sample inspection in a charged particle beam instrument
JP5537058B2 (ja) * 2009-03-30 2014-07-02 株式会社日立ハイテクノロジーズ 試料作製装置、及び試料作製装置における制御方法
JP5537653B2 (ja) * 2010-04-16 2014-07-02 株式会社日立ハイテクノロジーズ イオンビーム装置およびイオンビーム加工方法
WO2013082496A1 (en) * 2011-12-01 2013-06-06 Fei Company High throughput tem preparation processes and hardware for backside thinning of cross-sectional view lamella
US10465293B2 (en) * 2012-08-31 2019-11-05 Fei Company Dose-based end-pointing for low-kV FIB milling TEM sample preparation
KR102383571B1 (ko) * 2014-06-30 2022-04-06 가부시키가이샤 히다치 하이테크 사이언스 자동 시료 제작 장치
JP6552383B2 (ja) * 2014-11-07 2019-07-31 エフ・イ−・アイ・カンパニー 自動化されたtem試料調製

Also Published As

Publication number Publication date
KR101970478B1 (ko) 2019-04-19
EP3018693B1 (en) 2018-12-26
US20160141147A1 (en) 2016-05-19
KR20160055076A (ko) 2016-05-17
US9601313B2 (en) 2017-03-21
US20190272975A1 (en) 2019-09-05
US20170256380A1 (en) 2017-09-07
CN105588742A (zh) 2016-05-18
EP3018693A1 (en) 2016-05-11
US10340119B2 (en) 2019-07-02
US10825651B2 (en) 2020-11-03
JP2016105077A (ja) 2016-06-09

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