KR101970478B1 - 자동화된 tem 샘플 준비 - Google Patents

자동화된 tem 샘플 준비 Download PDF

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KR101970478B1
KR101970478B1 KR1020150155516A KR20150155516A KR101970478B1 KR 101970478 B1 KR101970478 B1 KR 101970478B1 KR 1020150155516 A KR1020150155516 A KR 1020150155516A KR 20150155516 A KR20150155516 A KR 20150155516A KR 101970478 B1 KR101970478 B1 KR 101970478B1
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probe
sample
tip
delete delete
thin film
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KR20160055076A (ko
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발레리 브로그덴
제프리 블랙우드
마이클 슈미트
드루티 트리베디
리차드 제이. 영
토마스 쥐. 밀러
브라이언 로버츠 주니어 루스
스테이시 스톤
토드 템플턴
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에프이아이 컴파니
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/302—Controlling tubes by external information, e.g. programme control
    • H01J37/3023—Programme control
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/285—Emission microscopes, e.g. field-emission microscopes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045—Object or beam position registration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/31—Electron-beam or ion-beam tubes for localised treatment of objects for cutting or drilling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G01N2001/2873—Cutting or cleaving
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/10—Different kinds of radiation or particles
    • G01N2223/102—Different kinds of radiation or particles beta or electrons
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/30—Accessories, mechanical or electrical features
    • G01N2223/309—Accessories, mechanical or electrical features support of sample holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/208—Elements or methods for movement independent of sample stage for influencing or moving or contacting or transferring the sample or parts thereof, e.g. prober needles or transfer needles in FIB/SEM systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3174—Etching microareas
    • H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
KR1020150155516A 2014-11-07 2015-11-06 자동화된 tem 샘플 준비 Active KR101970478B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462077148P 2014-11-07 2014-11-07
US62/077,148 2014-11-07

Publications (2)

Publication Number Publication Date
KR20160055076A KR20160055076A (ko) 2016-05-17
KR101970478B1 true KR101970478B1 (ko) 2019-04-19

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US (3) US9601313B2 (enExample)
EP (1) EP3018693B1 (enExample)
JP (1) JP6552383B2 (enExample)
KR (1) KR101970478B1 (enExample)
CN (1) CN105588742A (enExample)

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KR102383571B1 (ko) * 2014-06-30 2022-04-06 가부시키가이샤 히다치 하이테크 사이언스 자동 시료 제작 장치
JP6552383B2 (ja) * 2014-11-07 2019-07-31 エフ・イ−・アイ・カンパニー 自動化されたｔｅｍ試料調製
US9837246B1 (en) 2016-07-22 2017-12-05 Fei Company Reinforced sample for transmission electron microscope
JP7113613B2 (ja) 2016-12-21 2022-08-05 エフ イー アイ カンパニ 欠陥分析
JP6931214B2 (ja) * 2017-01-19 2021-09-01 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
JP6885576B2 (ja) * 2017-01-19 2021-06-16 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
DE102017202339B3 (de) 2017-02-14 2018-05-24 Carl Zeiss Microscopy Gmbh Strahlsystem mit geladenen Teilchen und Verfahren dafür
US10303829B2 (en) 2017-05-31 2019-05-28 International Business Machines Corporation Automated method for integrated analysis of back end of the line yield, line resistance/capacitance and process performance
DE102017212020B3 (de) 2017-07-13 2018-05-30 Carl Zeiss Microscopy Gmbh Verfahren zur In-situ-Präparation und zum Transfer mikroskopischer Proben, Computerprogrammprodukt sowie mikroskopische Probe
JP7109051B2 (ja) * 2018-03-30 2022-07-29 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
DE102018108974B3 (de) 2018-04-16 2019-05-09 Carl Zeiss Microscopy Gmbh Verfahren zum Herstellen einer TEM-Probe
DE102018206278A1 (de) 2018-04-24 2019-10-24 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Entfernen eines Partikels von einer photolithographischen Maske
DE102018010436B4 (de) 2018-06-21 2025-01-23 Carl Zeiss Smt Gmbh Vorrichtung zum Untersuchen und/oder zum Bearbeiten einer Probe
DE102018210098B4 (de) 2018-06-21 2022-02-03 Carl Zeiss Smt Gmbh Vorrichtung und Verfahren zum Untersuchen und/oder zum Bearbeiten einer Probe
CN109011030B (zh) * 2018-08-08 2021-02-09 长沙理工大学 自动注射仪器针头的位置检测矫正方法及装置
CN110514679B (zh) * 2019-09-16 2021-04-30 南京大学 一种带有活动拉曼针尖探头的透射电镜原位反应舱芯片及其使用方法
US11355305B2 (en) 2019-10-08 2022-06-07 Fei Company Low keV ion beam image restoration by machine learning for object localization
CN110554063B (zh) * 2019-10-21 2021-10-12 长江存储科技有限责任公司 一种tem样品以及制备tem样品的方法
CN111537533B (zh) * 2020-03-24 2023-06-30 天津华慧芯科技集团有限公司 一种尖晶石微米颗粒的球差矫正tem样品制备方法
DE102020112220B9 (de) * 2020-05-06 2022-05-25 Carl Zeiss Microscopy Gmbh Teilchenstrahlgerät zum Abtragen mindestens eines Materials von einer Materialeinheit und Anordnen des Materials an einem Objekt
GB202013591D0 (en) * 2020-08-28 2020-10-14 Oxford Instr Nanotechnology Ltd Sample preparation and method aparatus
EP4068333A1 (en) * 2021-03-31 2022-10-05 FEI Company Sample carrier for use in a charged particle microscope, and a method of using such a sample carrier in a charged particle microscope
DE102021205001B4 (de) * 2021-05-18 2023-07-27 Carl Zeiss Microscopy Gmbh Verfahren zum Positionieren von Objekten in einem Teilchenstrahlmikroskop mithilfe einer flexiblen Teilchenstrahlschranke sowie Computerprogrammprodukt
CN114858828A (zh) * 2022-02-23 2022-08-05 厦门士兰集科微电子有限公司 透射电子显微镜样品的制备方法

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Publication number Publication date
JP2016105077A (ja) 2016-06-09
US9601313B2 (en) 2017-03-21
US20160141147A1 (en) 2016-05-19
US10825651B2 (en) 2020-11-03
US10340119B2 (en) 2019-07-02
US20190272975A1 (en) 2019-09-05
US20170256380A1 (en) 2017-09-07
KR20160055076A (ko) 2016-05-17
CN105588742A (zh) 2016-05-18
EP3018693A1 (en) 2016-05-11
JP6552383B2 (ja) 2019-07-31
EP3018693B1 (en) 2018-12-26

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