CN105588742A - 自动化tem样本制备 - Google Patents

自动化tem样本制备 Download PDF

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Publication number
CN105588742A
CN105588742A CN201510749549.5A CN201510749549A CN105588742A CN 105588742 A CN105588742 A CN 105588742A CN 201510749549 A CN201510749549 A CN 201510749549A CN 105588742 A CN105588742 A CN 105588742A
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CN
China
Prior art keywords
probe
sample
image
thin slice
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510749549.5A
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English (en)
Chinese (zh)
Inventor
V.布罗登
J.布莱克伍德
M.施米德特
D.特里维迪
R.J.杨
T.G.米勒
B.R.小劳思
S.斯通
T.滕普莱顿
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FEI Co
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FEI Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FEI Co filed Critical FEI Co
Publication of CN105588742A publication Critical patent/CN105588742A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/302—Controlling tubes by external information, e.g. program control
    • H01J37/3023—Program control
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/285—Emission microscopes, e.g. field-emission microscopes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045—Object or beam position registration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/31—Electron-beam or ion-beam tubes for localised treatment of objects for cutting or drilling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G01N2001/2873—Cutting or cleaving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/208—Elements or methods for movement independent of sample stage for influencing or moving or contacting or transferring the sample or parts thereof, e.g. prober needles or transfer needles in FIB/SEM systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3174—Etching microareas
    • H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers

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  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Engineering & Computer Science (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Drying Of Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN201510749549.5A 2014-11-07 2015-11-06 自动化tem样本制备 Pending CN105588742A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462077148P 2014-11-07 2014-11-07
US62/077148 2014-11-07

Publications (1)

Publication Number Publication Date
CN105588742A true CN105588742A (zh) 2016-05-18

Family

ID=54476768

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510749549.5A Pending CN105588742A (zh) 2014-11-07 2015-11-06 自动化tem样本制备

Country Status (5)

Country Link
US (3) US9601313B2 (enExample)
EP (1) EP3018693B1 (enExample)
JP (1) JP6552383B2 (enExample)
KR (1) KR101970478B1 (enExample)
CN (1) CN105588742A (enExample)

Cited By (6)

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Publication number Priority date Publication date Assignee Title
CN109011030A (zh) * 2018-08-08 2018-12-18 长沙理工大学 自动注射仪器针头的位置检测矫正方法及装置
CN110335800A (zh) * 2018-03-30 2019-10-15 日本株式会社日立高新技术科学 带电粒子束装置
CN110514679A (zh) * 2019-09-16 2019-11-29 南京大学 一种带有活动拉曼针尖探头的透射电镜原位反应舱芯片及其使用方法
CN110554063A (zh) * 2019-10-21 2019-12-10 长江存储科技有限责任公司 一种tem样品以及制备tem样品的方法
CN112712473A (zh) * 2019-10-08 2021-04-27 Fei 公司 通过机器学习对对象定位进行低kev离子束图像恢复
JP2023538970A (ja) * 2020-08-28 2023-09-12 オックスフォード インストルメンツ ナノテクノロジー ツールス リミテッド 試料作製方法及び装置

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JP6708547B2 (ja) * 2014-06-30 2020-06-10 株式会社日立ハイテクサイエンス 自動試料作製装置
JP6552383B2 (ja) * 2014-11-07 2019-07-31 エフ・イ−・アイ・カンパニー 自動化されたｔｅｍ試料調製
US9837246B1 (en) 2016-07-22 2017-12-05 Fei Company Reinforced sample for transmission electron microscope
JP7113613B2 (ja) 2016-12-21 2022-08-05 エフ イー アイ カンパニ 欠陥分析
JP6931214B2 (ja) * 2017-01-19 2021-09-01 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
JP6885576B2 (ja) * 2017-01-19 2021-06-16 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
DE102017202339B3 (de) 2017-02-14 2018-05-24 Carl Zeiss Microscopy Gmbh Strahlsystem mit geladenen Teilchen und Verfahren dafür
US10303829B2 (en) 2017-05-31 2019-05-28 International Business Machines Corporation Automated method for integrated analysis of back end of the line yield, line resistance/capacitance and process performance
DE102017212020B3 (de) 2017-07-13 2018-05-30 Carl Zeiss Microscopy Gmbh Verfahren zur In-situ-Präparation und zum Transfer mikroskopischer Proben, Computerprogrammprodukt sowie mikroskopische Probe
DE102018108974B3 (de) 2018-04-16 2019-05-09 Carl Zeiss Microscopy Gmbh Verfahren zum Herstellen einer TEM-Probe
DE102018206278B4 (de) 2018-04-24 2026-02-19 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Entfernen eines Partikels von einer photolithographischen Maske
DE102018210098B4 (de) 2018-06-21 2022-02-03 Carl Zeiss Smt Gmbh Vorrichtung und Verfahren zum Untersuchen und/oder zum Bearbeiten einer Probe
DE102018010436B4 (de) 2018-06-21 2025-01-23 Carl Zeiss Smt Gmbh Vorrichtung zum Untersuchen und/oder zum Bearbeiten einer Probe
CN111537533B (zh) * 2020-03-24 2023-06-30 天津华慧芯科技集团有限公司 一种尖晶石微米颗粒的球差矫正tem样品制备方法
DE102020112220B9 (de) * 2020-05-06 2022-05-25 Carl Zeiss Microscopy Gmbh Teilchenstrahlgerät zum Abtragen mindestens eines Materials von einer Materialeinheit und Anordnen des Materials an einem Objekt
EP4068333A1 (en) * 2021-03-31 2022-10-05 FEI Company Sample carrier for use in a charged particle microscope, and a method of using such a sample carrier in a charged particle microscope
DE102021205001B4 (de) 2021-05-18 2023-07-27 Carl Zeiss Microscopy Gmbh Verfahren zum Positionieren von Objekten in einem Teilchenstrahlmikroskop mithilfe einer flexiblen Teilchenstrahlschranke sowie Computerprogrammprodukt
CN114858828A (zh) * 2022-02-23 2022-08-05 厦门士兰集科微电子有限公司 透射电子显微镜样品的制备方法
TW202447185A (zh) * 2023-01-19 2024-12-01 美商Fei公司 用於高ｒｏｉ的倒置層狀物之支撐結構
CZ2024342A3 (cs) * 2024-09-02 2026-03-11 Tescan Group, A.S. Způsob nalezení pozice špičky manipulátoru

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JP3613039B2 (ja) * 1998-12-02 2005-01-26 株式会社日立製作所 試料作製装置
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JP2005147671A (ja) * 2003-11-11 2005-06-09 Hitachi Ltd 荷電粒子線調整方法および装置
JP4130798B2 (ja) * 2003-12-05 2008-08-06 株式会社日立ハイテクノロジーズ プローブ付き複合顕微鏡及びプローブ駆動方法
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US8357913B2 (en) * 2006-10-20 2013-01-22 Fei Company Method and apparatus for sample extraction and handling
JP5270558B2 (ja) * 2006-10-20 2013-08-21 エフ・イ−・アイ・カンパニー Ｓ／ｔｅｍのサンプルを作成する方法およびサンプル構造
JP2008210732A (ja) * 2007-02-28 2008-09-11 Hitachi High-Technologies Corp 荷電粒子ビーム装置
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JP6552383B2 (ja) * 2014-11-07 2019-07-31 エフ・イ−・アイ・カンパニー 自動化されたｔｅｍ試料調製

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110335800A (zh) * 2018-03-30 2019-10-15 日本株式会社日立高新技术科学 带电粒子束装置
CN110335800B (zh) * 2018-03-30 2024-04-16 日本株式会社日立高新技术科学 带电粒子束装置
CN109011030A (zh) * 2018-08-08 2018-12-18 长沙理工大学 自动注射仪器针头的位置检测矫正方法及装置
CN110514679A (zh) * 2019-09-16 2019-11-29 南京大学 一种带有活动拉曼针尖探头的透射电镜原位反应舱芯片及其使用方法
CN110514679B (zh) * 2019-09-16 2021-04-30 南京大学 一种带有活动拉曼针尖探头的透射电镜原位反应舱芯片及其使用方法
CN112712473A (zh) * 2019-10-08 2021-04-27 Fei 公司 通过机器学习对对象定位进行低kev离子束图像恢复
CN110554063A (zh) * 2019-10-21 2019-12-10 长江存储科技有限责任公司 一种tem样品以及制备tem样品的方法
JP2023538970A (ja) * 2020-08-28 2023-09-12 オックスフォード インストルメンツ ナノテクノロジー ツールス リミテッド 試料作製方法及び装置
US12529629B2 (en) 2020-08-28 2026-01-20 Oxford Instruments Nanotechnology Tools Limited Sample preparation method and apparatus

Also Published As

Publication number Publication date
JP2016105077A (ja) 2016-06-09
JP6552383B2 (ja) 2019-07-31
US10825651B2 (en) 2020-11-03
US20160141147A1 (en) 2016-05-19
US20170256380A1 (en) 2017-09-07
US20190272975A1 (en) 2019-09-05
EP3018693B1 (en) 2018-12-26
EP3018693A1 (en) 2016-05-11
KR101970478B1 (ko) 2019-04-19
US9601313B2 (en) 2017-03-21
KR20160055076A (ko) 2016-05-17
US10340119B2 (en) 2019-07-02

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Application publication date: 20160518

RJ01 Rejection of invention patent application after publication