JP6550761B2 - 半導体集積回路の寿命予測装置 - Google Patents
半導体集積回路の寿命予測装置 Download PDFInfo
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- JP6550761B2 JP6550761B2 JP2015013214A JP2015013214A JP6550761B2 JP 6550761 B2 JP6550761 B2 JP 6550761B2 JP 2015013214 A JP2015013214 A JP 2015013214A JP 2015013214 A JP2015013214 A JP 2015013214A JP 6550761 B2 JP6550761 B2 JP 6550761B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
- H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
- H01L2224/48479—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Tests Of Electronic Circuits (AREA)
- Wire Bonding (AREA)
Description
本発明の第1実施形態を説明する。図1は、第1実施形態にかかる寿命予測装置4を備えた半導体集積回路2の側面図である。この半導体集積回路2は、2つ以上のチップ10(図1では2つのチップ10A,10Bを示す)が、ワイヤで接続され、これを樹脂14によりモールド成形して形成されている。
次に、本発明にかかる第2実施形態を説明する。なお、第1実施形態と同一構成については、同一符号を用い説明を適宜省略する。
4 寿命予測装置
10(10A,10B) チップ
11 チップ間ワイヤ
12 リードワイヤ
13 リード
15(15A,15B),21(21A,21B) 電極パッド
16A ファーストボール
16B セカンドボール
20 状態探知部
22 ワイヤ
30 予測部
31 測定器
32 記憶器
33 予測器
K1 金属間化合物
K2 カーケンダルボイド
Claims (4)
- 複数のチップがチップ間ワイヤによりボンディング接続されてなる半導体集積回路の寿命を予測する寿命予測装置であって、
前記半導体集積回路の内部に設けられ、前記チップ間ワイヤと同一構成により形成されて、当該チップ間ワイヤの接続形態を模擬する状態探知部と、
前記半導体集積回路の外部に設けられ、前記状態探知部の抵抗値を計測して、該抵抗値の時間変化から前記半導体集積回路の寿命を予測する予測部と、
を備え、
前記状態探知部は、最初に圧着された位置をファーストボンディング位置とし、次に圧着された位置をセカンドボンディング位置とした際に、少なくとも前記セカンドボンディング位置は、当該セカンドボンディングが行われた前記チップ内で、他の場所より温度の高い場所であることを特徴とする寿命予測装置。 - 請求項1に記載の寿命予測装置であって、
前記状態探知部は、前記チップに設けられ、かつ、外部との接続端子をなすリードに接続されたアルミニュームの電極パッドに、金のワイヤを圧着して形成されて、前記リードを介して電気抵抗が測定可能に形成されていることを特徴とする寿命予測装置。 - 請求項1または2に記載の寿命予測装置であって、
前記状態探知部は、複数設けられていることを特徴とする寿命予測装置。 - 請求項1から3のいずれか一項に記載の寿命予測装置であって、
前記状態探知部に模擬電流が流せるようにしたことを特徴とする寿命予測装置。
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JP2016138784A JP2016138784A (ja) | 2016-08-04 |
JP6550761B2 true JP6550761B2 (ja) | 2019-07-31 |
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IL266002B2 (en) * | 2016-10-19 | 2023-09-01 | Smartkable Llc | A method and system for predicting fusion lifetime |
JP2021125547A (ja) * | 2020-02-05 | 2021-08-30 | 富士電機株式会社 | 電力用半導体モジュール |
JP7305587B2 (ja) | 2020-03-17 | 2023-07-10 | 株式会社東芝 | 半導体装置および検査装置 |
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JPS6225431A (ja) * | 1985-07-26 | 1987-02-03 | Hitachi Ltd | 半導体装置 |
JPH05121645A (ja) * | 1991-10-25 | 1993-05-18 | Nec Corp | 半導体装置 |
JPH07235575A (ja) * | 1994-02-22 | 1995-09-05 | Nippon Steel Corp | 半導体素子およびその検定方法 |
US6993446B2 (en) * | 2003-03-17 | 2006-01-31 | Schlumberger Technology Corporation | Method and apparatus for predicting the time to failure of electronic devices at high temperatures |
JP4605996B2 (ja) * | 2003-05-29 | 2011-01-05 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
AU2003304509A1 (en) * | 2003-10-15 | 2005-05-05 | Hitachi, Ltd. | Power semiconductor module, power converter employing it and mobile unit |
JP4091562B2 (ja) * | 2004-03-29 | 2008-05-28 | ファナック株式会社 | モータ駆動装置 |
JP2012018025A (ja) * | 2010-07-07 | 2012-01-26 | Fuji Electric Co Ltd | 半導体パワーモジュールの劣化診断方法及び劣化診断装置 |
JP5568586B2 (ja) * | 2012-03-27 | 2014-08-06 | 株式会社東芝 | 電子装置、故障判定方法、寿命推定方法 |
JP6037464B2 (ja) * | 2014-05-29 | 2016-12-07 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 電気機器の寿命を予測する装置及び方法 |
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