JP6548537B2 - はんだ合金及びはんだ組成物 - Google Patents
はんだ合金及びはんだ組成物 Download PDFInfo
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- JP6548537B2 JP6548537B2 JP2015178403A JP2015178403A JP6548537B2 JP 6548537 B2 JP6548537 B2 JP 6548537B2 JP 2015178403 A JP2015178403 A JP 2015178403A JP 2015178403 A JP2015178403 A JP 2015178403A JP 6548537 B2 JP6548537 B2 JP 6548537B2
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- mass
- solder
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- solder alloy
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- 229910000679 solder Inorganic materials 0.000 title claims description 100
- 229910045601 alloy Inorganic materials 0.000 title claims description 78
- 239000000956 alloy Substances 0.000 title claims description 78
- 239000000203 mixture Substances 0.000 title claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 52
- 239000002184 metal Substances 0.000 claims description 52
- 229910052797 bismuth Inorganic materials 0.000 claims description 14
- 230000004907 flux Effects 0.000 claims description 14
- 229910052718 tin Inorganic materials 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 8
- 229910052787 antimony Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 description 18
- 238000002844 melting Methods 0.000 description 12
- 230000008018 melting Effects 0.000 description 12
- 229910020830 Sn-Bi Inorganic materials 0.000 description 7
- 229910018728 Sn—Bi Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229910052736 halogen Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 150000002367 halogens Chemical class 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000879 optical micrograph Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015178403A JP6548537B2 (ja) | 2015-09-10 | 2015-09-10 | はんだ合金及びはんだ組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015178403A JP6548537B2 (ja) | 2015-09-10 | 2015-09-10 | はんだ合金及びはんだ組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017051984A JP2017051984A (ja) | 2017-03-16 |
| JP2017051984A5 JP2017051984A5 (es) | 2018-07-05 |
| JP6548537B2 true JP6548537B2 (ja) | 2019-07-24 |
Family
ID=58320268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015178403A Active JP6548537B2 (ja) | 2015-09-10 | 2015-09-10 | はんだ合金及びはんだ組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6548537B2 (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11479835B2 (en) * | 2016-08-11 | 2022-10-25 | Beijing Compo Advanced Technology Co., Ltd. | SnBiSb series low-temperature lead-free solder and its preparation method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6477965B1 (ja) * | 2018-03-08 | 2019-03-06 | 千住金属工業株式会社 | はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手 |
| JP7262695B1 (ja) * | 2023-01-24 | 2023-04-21 | 株式会社タムラ製作所 | はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 |
| JP7406052B1 (ja) | 2023-09-14 | 2023-12-26 | 株式会社タムラ製作所 | はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5569433A (en) * | 1994-11-08 | 1996-10-29 | Lucent Technologies Inc. | Lead-free low melting solder with improved mechanical properties |
| DE4443459C2 (de) * | 1994-12-07 | 1996-11-21 | Wieland Werke Ag | Bleifreies Weichlot und seine Verwendung |
| JP3347512B2 (ja) * | 1995-03-17 | 2002-11-20 | 富士通株式会社 | 低温接合用はんだ合金、これを用いた電子機器およびその製造方法 |
| US5833921A (en) * | 1997-09-26 | 1998-11-10 | Ford Motor Company | Lead-free, low-temperature solder compositions |
| JP3592054B2 (ja) * | 1997-12-15 | 2004-11-24 | 富士通株式会社 | 電子回路及びその製造方法 |
| JP2001334386A (ja) * | 2000-05-19 | 2001-12-04 | Hitachi Ltd | 電子機器用Ｓｎ−Ａｇ−Ｂｉ系はんだ |
| JP2004034134A (ja) * | 2002-07-08 | 2004-02-05 | Hitachi Ltd | 線はんだおよび電子機器の製造方法 |
| US20050069725A1 (en) * | 2003-07-03 | 2005-03-31 | Boaz Premakaran T. | Lead-free solder composition for substrates |
| JP2007090407A (ja) * | 2005-09-30 | 2007-04-12 | Toshiba Corp | 電子部品の接合材料、プリント回路配線基板、及び電子機器 |
| JP6021906B2 (ja) * | 2011-07-04 | 2016-11-09 | サン−ゴバン グラス フランスＳａｉｎｔ−Ｇｏｂａｉｎ Ｇｌａｓｓ Ｆｒａｎｃｅ | 電気接続部材を有するウィンドウガラスの製造方法 |
| CN110142528A (zh) * | 2011-08-02 | 2019-08-20 | 阿尔法金属公司 | 高冲击韧性的焊料合金 |
-
2015
- 2015-09-10 JP JP2015178403A patent/JP6548537B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11479835B2 (en) * | 2016-08-11 | 2022-10-25 | Beijing Compo Advanced Technology Co., Ltd. | SnBiSb series low-temperature lead-free solder and its preparation method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017051984A (ja) | 2017-03-16 |
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