JP6548537B2 - はんだ合金及びはんだ組成物 - Google Patents

はんだ合金及びはんだ組成物 Download PDF

Info

Publication number
JP6548537B2
JP6548537B2 JP2015178403A JP2015178403A JP6548537B2 JP 6548537 B2 JP6548537 B2 JP 6548537B2 JP 2015178403 A JP2015178403 A JP 2015178403A JP 2015178403 A JP2015178403 A JP 2015178403A JP 6548537 B2 JP6548537 B2 JP 6548537B2
Authority
JP
Japan
Prior art keywords
mass
solder
content
solder alloy
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015178403A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017051984A (ja
JP2017051984A5 (enExample
Inventor
剛優 和田
剛優 和田
公章 森
公章 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koki Co Ltd
Original Assignee
Koki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koki Co Ltd filed Critical Koki Co Ltd
Priority to JP2015178403A priority Critical patent/JP6548537B2/ja
Publication of JP2017051984A publication Critical patent/JP2017051984A/ja
Publication of JP2017051984A5 publication Critical patent/JP2017051984A5/ja
Application granted granted Critical
Publication of JP6548537B2 publication Critical patent/JP6548537B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2015178403A 2015-09-10 2015-09-10 はんだ合金及びはんだ組成物 Active JP6548537B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015178403A JP6548537B2 (ja) 2015-09-10 2015-09-10 はんだ合金及びはんだ組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015178403A JP6548537B2 (ja) 2015-09-10 2015-09-10 はんだ合金及びはんだ組成物

Publications (3)

Publication Number Publication Date
JP2017051984A JP2017051984A (ja) 2017-03-16
JP2017051984A5 JP2017051984A5 (enExample) 2018-07-05
JP6548537B2 true JP6548537B2 (ja) 2019-07-24

Family

ID=58320268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015178403A Active JP6548537B2 (ja) 2015-09-10 2015-09-10 はんだ合金及びはんだ組成物

Country Status (1)

Country Link
JP (1) JP6548537B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11479835B2 (en) * 2016-08-11 2022-10-25 Beijing Compo Advanced Technology Co., Ltd. SnBiSb series low-temperature lead-free solder and its preparation method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6477965B1 (ja) * 2018-03-08 2019-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
CN118748957A (zh) * 2023-01-24 2024-10-08 株式会社田村制作所 软钎料合金、接合部、接合材料、焊膏、接合结构体和电子控制装置
JP7406052B1 (ja) * 2023-09-14 2023-12-26 株式会社タムラ製作所 はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5569433A (en) * 1994-11-08 1996-10-29 Lucent Technologies Inc. Lead-free low melting solder with improved mechanical properties
DE4443459C2 (de) * 1994-12-07 1996-11-21 Wieland Werke Ag Bleifreies Weichlot und seine Verwendung
JP3347512B2 (ja) * 1995-03-17 2002-11-20 富士通株式会社 低温接合用はんだ合金、これを用いた電子機器およびその製造方法
US5833921A (en) * 1997-09-26 1998-11-10 Ford Motor Company Lead-free, low-temperature solder compositions
JP3592054B2 (ja) * 1997-12-15 2004-11-24 富士通株式会社 電子回路及びその製造方法
JP2001334386A (ja) * 2000-05-19 2001-12-04 Hitachi Ltd 電子機器用Ｓｎ−Ａｇ−Ｂｉ系はんだ
JP2004034134A (ja) * 2002-07-08 2004-02-05 Hitachi Ltd 線はんだおよび電子機器の製造方法
US20050069725A1 (en) * 2003-07-03 2005-03-31 Boaz Premakaran T. Lead-free solder composition for substrates
JP2007090407A (ja) * 2005-09-30 2007-04-12 Toshiba Corp 電子部品の接合材料、プリント回路配線基板、及び電子機器
US9425517B2 (en) * 2011-07-04 2016-08-23 Saint-Gobain Glass France Method for producing a pane having an electrical connection element
MY186516A (en) * 2011-08-02 2021-07-23 Alpha Assembly Solutions Inc High impact toughness solder alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11479835B2 (en) * 2016-08-11 2022-10-25 Beijing Compo Advanced Technology Co., Ltd. SnBiSb series low-temperature lead-free solder and its preparation method

Also Published As

Publication number Publication date
JP2017051984A (ja) 2017-03-16

Similar Documents

Publication Publication Date Title
JP5533876B2 (ja) ソルダペースト、それを用いた接合方法、および接合構造
JP5287852B2 (ja) 引け巣が抑制された鉛フリーはんだ合金
JP5872114B1 (ja) 鉛フリーはんだ合金
JP5924852B2 (ja) はんだ継手
JP5664664B2 (ja) 接合方法、電子装置の製造方法、および電子部品
JP6548537B2 (ja) はんだ合金及びはんだ組成物
JP6828880B2 (ja) はんだペースト、はんだ合金粉
US20160368104A1 (en) Lead-Free Solder Alloy, Solder Material and Joined Structure
JP2011156558A (ja) 鉛フリーはんだ合金
JP6004253B2 (ja) ペースト用はんだ合金粉末、ペースト及びこれを用いたはんだバンプ
CN101716705B (zh) 多元合金无镉无磷铜基钎料
WO2020067307A1 (ja) 鉛フリーはんだ合金
JP6688417B2 (ja) はんだ接合方法
JP5773444B2 (ja) アルミニウム接合用はんだ合金
JP5966449B2 (ja) バンプ用はんだ合金粉末、バンプ用はんだペースト及びはんだバンプ
US10888960B2 (en) Solder alloy and resin flux cored solder
JP5051633B2 (ja) はんだ合金
JP3992107B2 (ja) 無鉛はんだ合金
JP2018144076A (ja) はんだバンプ製造用金属粉末、はんだバンプ製造用ペーストおよびはんだバンプの製造方法
JP2013248664A (ja) 鉛フリーはんだ合金およびはんだペースト
KR100327767B1 (ko) 납땜용 무연합금
JP6221912B2 (ja) はんだ接合用銅合金
JP2005153010A (ja) 無鉛はんだ合金
CN102848097A (zh) 含Nd、Ga、Se的Sn-Zn无铅钎料
JP2010005692A (ja) 改良Ｓｎ−０．７ｗｔ％Ｃｕ無鉛はんだ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180412

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180521

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180521

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20180521

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20180529

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20180615

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180910

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180914

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181029

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20181214

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20190208

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190411

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190607

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190625

R150 Certificate of patent or registration of utility model

Ref document number: 6548537

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250