JP2017051984A5 - - Google Patents

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Publication number
JP2017051984A5
JP2017051984A5 JP2015178403A JP2015178403A JP2017051984A5 JP 2017051984 A5 JP2017051984 A5 JP 2017051984A5 JP 2015178403 A JP2015178403 A JP 2015178403A JP 2015178403 A JP2015178403 A JP 2015178403A JP 2017051984 A5 JP2017051984 A5 JP 2017051984A5
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Japan
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mass
content
solder alloy
metal
less
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JP2015178403A
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English (en)
Japanese (ja)
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JP2017051984A (ja
JP6548537B2 (ja
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Publication of JP2017051984A5 publication Critical patent/JP2017051984A5/ja
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JP2015178403A 2015-09-10 2015-09-10 はんだ合金及びはんだ組成物 Active JP6548537B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015178403A JP6548537B2 (ja) 2015-09-10 2015-09-10 はんだ合金及びはんだ組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015178403A JP6548537B2 (ja) 2015-09-10 2015-09-10 はんだ合金及びはんだ組成物

Publications (3)

Publication Number Publication Date
JP2017051984A JP2017051984A (ja) 2017-03-16
JP2017051984A5 true JP2017051984A5 (enExample) 2018-07-05
JP6548537B2 JP6548537B2 (ja) 2019-07-24

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JP2015178403A Active JP6548537B2 (ja) 2015-09-10 2015-09-10 はんだ合金及びはんだ組成物

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JP (1) JP6548537B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106216872B (zh) * 2016-08-11 2019-03-12 北京康普锡威科技有限公司 一种SnBiSb系低温无铅焊料及其制备方法
JP6477965B1 (ja) * 2018-03-08 2019-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
CN118748957A (zh) * 2023-01-24 2024-10-08 株式会社田村制作所 软钎料合金、接合部、接合材料、焊膏、接合结构体和电子控制装置
JP7406052B1 (ja) * 2023-09-14 2023-12-26 株式会社タムラ製作所 はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5569433A (en) * 1994-11-08 1996-10-29 Lucent Technologies Inc. Lead-free low melting solder with improved mechanical properties
DE4443459C2 (de) * 1994-12-07 1996-11-21 Wieland Werke Ag Bleifreies Weichlot und seine Verwendung
JP3347512B2 (ja) * 1995-03-17 2002-11-20 富士通株式会社 低温接合用はんだ合金、これを用いた電子機器およびその製造方法
US5833921A (en) * 1997-09-26 1998-11-10 Ford Motor Company Lead-free, low-temperature solder compositions
JP3592054B2 (ja) * 1997-12-15 2004-11-24 富士通株式会社 電子回路及びその製造方法
JP2001334386A (ja) * 2000-05-19 2001-12-04 Hitachi Ltd 電子機器用Ｓｎ−Ａｇ−Ｂｉ系はんだ
JP2004034134A (ja) * 2002-07-08 2004-02-05 Hitachi Ltd 線はんだおよび電子機器の製造方法
US20050069725A1 (en) * 2003-07-03 2005-03-31 Boaz Premakaran T. Lead-free solder composition for substrates
JP2007090407A (ja) * 2005-09-30 2007-04-12 Toshiba Corp 電子部品の接合材料、プリント回路配線基板、及び電子機器
US9425517B2 (en) * 2011-07-04 2016-08-23 Saint-Gobain Glass France Method for producing a pane having an electrical connection element
MY186516A (en) * 2011-08-02 2021-07-23 Alpha Assembly Solutions Inc High impact toughness solder alloy

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