JP2017095790A5 - - Google Patents

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Publication number
JP2017095790A5
JP2017095790A5 JP2015232446A JP2015232446A JP2017095790A5 JP 2017095790 A5 JP2017095790 A5 JP 2017095790A5 JP 2015232446 A JP2015232446 A JP 2015232446A JP 2015232446 A JP2015232446 A JP 2015232446A JP 2017095790 A5 JP2017095790 A5 JP 2017095790A5
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JP
Japan
Prior art keywords
sputtering target
vol
oxide
metal
50vol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015232446A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017095790A (ja
JP6504605B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2015232446A external-priority patent/JP6504605B2/ja
Priority to JP2015232446A priority Critical patent/JP6504605B2/ja
Priority to MYPI2018701946A priority patent/MY187547A/en
Priority to CN201680069144.XA priority patent/CN108291294B/zh
Priority to PCT/JP2016/083777 priority patent/WO2017090481A1/ja
Priority to US15/779,012 priority patent/US11072851B2/en
Priority to SG11201804080RA priority patent/SG11201804080RA/en
Priority to TW105138105A priority patent/TWI642798B/zh
Publication of JP2017095790A publication Critical patent/JP2017095790A/ja
Publication of JP2017095790A5 publication Critical patent/JP2017095790A5/ja
Publication of JP6504605B2 publication Critical patent/JP6504605B2/ja
Application granted granted Critical
Priority to US17/319,375 priority patent/US20210269911A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015232446A 2015-11-27 2015-11-27 スパッタリングターゲット Active JP6504605B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2015232446A JP6504605B2 (ja) 2015-11-27 2015-11-27 スパッタリングターゲット
MYPI2018701946A MY187547A (en) 2015-11-27 2016-11-15 Sputtering target
CN201680069144.XA CN108291294B (zh) 2015-11-27 2016-11-15 溅射靶
PCT/JP2016/083777 WO2017090481A1 (ja) 2015-11-27 2016-11-15 スパッタリングターゲット
US15/779,012 US11072851B2 (en) 2015-11-27 2016-11-15 Sputtering target
SG11201804080RA SG11201804080RA (en) 2015-11-27 2016-11-15 Sputtering target
TW105138105A TWI642798B (zh) 2015-11-27 2016-11-21 濺鍍靶
US17/319,375 US20210269911A1 (en) 2015-11-27 2021-05-13 Sputtering target

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015232446A JP6504605B2 (ja) 2015-11-27 2015-11-27 スパッタリングターゲット

Publications (3)

Publication Number Publication Date
JP2017095790A JP2017095790A (ja) 2017-06-01
JP2017095790A5 true JP2017095790A5 (enExample) 2018-11-01
JP6504605B2 JP6504605B2 (ja) 2019-04-24

Family

ID=58764151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015232446A Active JP6504605B2 (ja) 2015-11-27 2015-11-27 スパッタリングターゲット

Country Status (7)

Country Link
US (2) US11072851B2 (enExample)
JP (1) JP6504605B2 (enExample)
CN (1) CN108291294B (enExample)
MY (1) MY187547A (enExample)
SG (1) SG11201804080RA (enExample)
TW (1) TWI642798B (enExample)
WO (1) WO2017090481A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6504605B2 (ja) * 2015-11-27 2019-04-24 田中貴金属工業株式会社 スパッタリングターゲット
TWI679291B (zh) 2017-09-21 2019-12-11 日商Ｊｘ金屬股份有限公司 濺鍍靶、積層膜之製造方法、積層膜及磁記錄媒體
TWI702294B (zh) * 2018-07-31 2020-08-21 日商田中貴金屬工業股份有限公司 磁氣記錄媒體用濺鍍靶
MY209580A (en) * 2019-11-01 2025-07-23 Univ Tohoku Sputtering target for heat-assisted magnetic recording medium

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060289294A1 (en) 2005-06-24 2006-12-28 Heraeus, Inc. Enhanced oxygen non-stoichiometry compensation for thin films
JP5204460B2 (ja) * 2007-10-24 2013-06-05 三井金属鉱業株式会社 磁気記録膜用スパッタリングターゲットおよびその製造方法
JPWO2010074171A1 (ja) * 2008-12-26 2012-06-21 三井金属鉱業株式会社 スパッタリングターゲットおよび膜の形成方法
JP2012117147A (ja) * 2010-11-12 2012-06-21 Jx Nippon Mining & Metals Corp コバルト酸化物が残留したスパッタリングターゲット
WO2013125469A1 (ja) * 2012-02-22 2013-08-29 Jx日鉱日石金属株式会社 磁性材スパッタリングターゲット及びその製造方法
CN104379801A (zh) * 2012-09-18 2015-02-25 吉坤日矿日石金属株式会社 溅射靶
CN105026589B (zh) * 2013-04-30 2017-07-18 吉坤日矿日石金属株式会社 烧结体、包含该烧结体的磁记录膜形成用溅射靶
JP6073194B2 (ja) * 2013-07-03 2017-02-01 昭和電工株式会社 磁気記録媒体、磁気記憶装置
JP6416497B2 (ja) 2014-05-02 2018-10-31 田中貴金属工業株式会社 スパッタリングターゲットおよびその製造方法
JP6504605B2 (ja) * 2015-11-27 2019-04-24 田中貴金属工業株式会社 スパッタリングターゲット

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