MY170253A - Sintered body, and sputtering target for magnetic recording film formation use which comprises said sintered body - Google Patents

Sintered body, and sputtering target for magnetic recording film formation use which comprises said sintered body

Info

Publication number
MY170253A
MY170253A MYPI2015702803A MYPI2015702803A MY170253A MY 170253 A MY170253 A MY 170253A MY PI2015702803 A MYPI2015702803 A MY PI2015702803A MY PI2015702803 A MYPI2015702803 A MY PI2015702803A MY 170253 A MY170253 A MY 170253A
Authority
MY
Malaysia
Prior art keywords
sintered body
magnetic recording
recording film
film formation
sputtering target
Prior art date
Application number
MYPI2015702803A
Inventor
Hideo Takami
Yuichiro Nakamura
Yuki Ikeda
Shin-Ichi Ogino
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY170253A publication Critical patent/MY170253A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Powder Metallurgy (AREA)
  • Hard Magnetic Materials (AREA)
  • Thin Magnetic Films (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Magnetic Record Carriers (AREA)

Abstract

A sintered body is made from one or more types of metal or alloy which contains at least cobalt as a metal and which is selected from boron and/or platinum group elements, and oxides, wherein a phase composed of the oxide contains at least one or more types of oxides selected from Cr(BO3), Co2B2O5, and Co3B2O6. A sintered body in which a compound selected from Cr(BO3), Co2B2O5, and Co3B2O6 is present in a target can maintain a fine structure, and the present invention can provide a sintered body for forming a magnetic recording film in which the sintered body is stable against water.
MYPI2015702803A 2013-04-30 2014-04-23 Sintered body, and sputtering target for magnetic recording film formation use which comprises said sintered body MY170253A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013095486 2013-04-30

Publications (1)

Publication Number Publication Date
MY170253A true MY170253A (en) 2019-07-13

Family

ID=51843443

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015702803A MY170253A (en) 2013-04-30 2014-04-23 Sintered body, and sputtering target for magnetic recording film formation use which comprises said sintered body

Country Status (6)

Country Link
JP (1) JP5878242B2 (en)
CN (1) CN105026589B (en)
MY (1) MY170253A (en)
SG (1) SG11201506155PA (en)
TW (1) TWI615479B (en)
WO (1) WO2014178310A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201706389UA (en) * 2015-02-19 2017-09-28 Jx Nippon Mining & Metals Corp Sputtering target for forming magnetic thin film
JP2016160530A (en) * 2015-03-05 2016-09-05 光洋應用材料科技股▲分▼有限公司 Magnetic alloy sputtering target and recording layer for magnetic recording media
JP6504605B2 (en) * 2015-11-27 2019-04-24 田中貴金属工業株式会社 Sputtering target
JP7072664B2 (en) * 2018-09-25 2022-05-20 Ｊｘ金属株式会社 Sputtering target and manufacturing method of sputtering target
JP6885981B2 (en) * 2019-03-29 2021-06-16 Ｊｘ金属株式会社 How to make and transport the packaging of the sputtering target
SG11202110634VA (en) * 2019-03-29 2021-10-28 Jx Nippon Mining & Metals Corp Sputtering target and method for manufacturing sputtering target

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469506A (en) * 1983-01-24 1984-09-04 Mitsui Toatsu Chemicals, Incorporated Production process of ferromagnetic iron powder
JPH11158607A (en) * 1997-11-28 1999-06-15 Sumitomo Metal Mining Co Ltd Zno sintered compact and its production
US20060286414A1 (en) * 2005-06-15 2006-12-21 Heraeus, Inc. Enhanced oxide-containing sputter target alloy compositions
MY146996A (en) * 2009-03-03 2012-10-15 Jx Nippon Mining & Metals Corp Sputtering target and process for producing same
MY149640A (en) * 2009-12-11 2013-09-13 Jx Nippon Mining & Metals Corp Sputtering target comprising oxide phase dispersed in co or co alloy phase, magnetic thin film made of co or co alloy phase and oxide phase, and magnetic recording medium using the said thin film
SG175953A1 (en) * 2010-01-21 2011-12-29 Jx Nippon Mining & Metals Corp Ferromagnetic-material sputtering target
SG185768A1 (en) * 2010-07-20 2013-01-30 Jx Nippon Mining & Metals Corp Sputtering target of ferromagnetic material with low generation of particles
JP2012117147A (en) * 2010-11-12 2012-06-21 Jx Nippon Mining & Metals Corp Sputtering target with remained cobalt oxide
US8590717B2 (en) * 2011-05-16 2013-11-26 Miner Enterprises, Inc. Railroad freight car draft gear

Also Published As

Publication number Publication date
TW201510232A (en) 2015-03-16
CN105026589A (en) 2015-11-04
CN105026589B (en) 2017-07-18
JPWO2014178310A1 (en) 2017-02-23
SG11201506155PA (en) 2015-09-29
WO2014178310A1 (en) 2014-11-06
JP5878242B2 (en) 2016-03-08
TWI615479B (en) 2018-02-21

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