SG11201706389UA - Sputtering target for forming magnetic thin film - Google Patents

Sputtering target for forming magnetic thin film

Info

Publication number
SG11201706389UA
SG11201706389UA SG11201706389UA SG11201706389UA SG11201706389UA SG 11201706389U A SG11201706389U A SG 11201706389UA SG 11201706389U A SG11201706389U A SG 11201706389UA SG 11201706389U A SG11201706389U A SG 11201706389UA SG 11201706389U A SG11201706389U A SG 11201706389UA
Authority
SG
Singapore
Prior art keywords
thin film
sputtering target
magnetic thin
forming magnetic
forming
Prior art date
Application number
SG11201706389UA
Inventor
Yuto MORISHITA
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of SG11201706389UA publication Critical patent/SG11201706389UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/12—Metallic powder containing non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
SG11201706389UA 2015-02-19 2016-02-15 Sputtering target for forming magnetic thin film SG11201706389UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015031027 2015-02-19
PCT/JP2016/054300 WO2016133047A1 (en) 2015-02-19 2016-02-15 Sputtering target for forming magnetic thin film

Publications (1)

Publication Number Publication Date
SG11201706389UA true SG11201706389UA (en) 2017-09-28

Family

ID=56688870

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201706389UA SG11201706389UA (en) 2015-02-19 2016-02-15 Sputtering target for forming magnetic thin film

Country Status (5)

Country Link
JP (1) JP6445126B2 (en)
CN (1) CN108026631B (en)
MY (1) MY184033A (en)
SG (1) SG11201706389UA (en)
WO (1) WO2016133047A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY192454A (en) * 2016-11-01 2022-08-21 Tanaka Precious Metal Ind Sputtering target for magnetic recording media
JP7072664B2 (en) * 2018-09-25 2022-05-20 Ｊｘ金属株式会社 Sputtering target and manufacturing method of sputtering target
CN110171972B (en) * 2019-01-04 2021-10-22 南京汇聚新材料科技有限公司 Low-temperature sintered ceramic material

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11158607A (en) * 1997-11-28 1999-06-15 Sumitomo Metal Mining Co Ltd Zno sintered compact and its production
US20060286414A1 (en) * 2005-06-15 2006-12-21 Heraeus, Inc. Enhanced oxide-containing sputter target alloy compositions
JP2012117147A (en) * 2010-11-12 2012-06-21 Jx Nippon Mining & Metals Corp Sputtering target with remained cobalt oxide
WO2014178310A1 (en) * 2013-04-30 2014-11-06 Jx日鉱日石金属株式会社 Sintered body, and sputtering target for magnetic recording film formation use which comprises said sintered body

Also Published As

Publication number Publication date
JPWO2016133047A1 (en) 2017-11-09
CN108026631B (en) 2020-02-28
JP6445126B2 (en) 2018-12-26
MY184033A (en) 2021-03-17
CN108026631A (en) 2018-05-11
WO2016133047A1 (en) 2016-08-25

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