SG11201800871SA - Ferromagnetic material sputtering target - Google Patents

Ferromagnetic material sputtering target

Info

Publication number
SG11201800871SA
SG11201800871SA SG11201800871SA SG11201800871SA SG11201800871SA SG 11201800871S A SG11201800871S A SG 11201800871SA SG 11201800871S A SG11201800871S A SG 11201800871SA SG 11201800871S A SG11201800871S A SG 11201800871SA SG 11201800871S A SG11201800871S A SG 11201800871SA
Authority
SG
Singapore
Prior art keywords
sputtering target
ferromagnetic material
material sputtering
ferromagnetic
target
Prior art date
Application number
SG11201800871SA
Inventor
Atsushi Sato
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of SG11201800871SA publication Critical patent/SG11201800871SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/05—Mixtures of metal powder with non-metallic powder
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0005—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with at least one oxide and at least one of carbides, nitrides, borides or silicides as the main non-metallic constituents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
    • C22C32/0068—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only nitrides
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C33/00—Making ferrous alloys
    • C22C33/02—Making ferrous alloys by powder metallurgy
    • C22C33/0207—Using a mixture of prealloyed powders or a master alloy
    • C22C33/0228—Using a mixture of prealloyed powders or a master alloy comprising other non-metallic compounds or more than 5% of graphite
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C33/00—Making ferrous alloys
    • C22C33/02—Making ferrous alloys by powder metallurgy
    • C22C33/0257—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements
    • C22C33/0278—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements with at least one alloying element having a minimum content above 5%
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/001—Ferrous alloys, e.g. steel alloys containing N
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/002—Ferrous alloys, e.g. steel alloys containing In, Mg, or other elements not provided for in one single group C22C38/001 - C22C38/60
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/10—Ferrous alloys, e.g. steel alloys containing cobalt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0688—Cermets, e.g. mixtures of metal and one or more of carbides, nitrides, oxides or borides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
SG11201800871SA 2016-09-12 2017-09-12 Ferromagnetic material sputtering target SG11201800871SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016178008 2016-09-12
PCT/JP2017/032932 WO2018047978A1 (en) 2016-09-12 2017-09-12 Ferromagnetic material sputtering target

Publications (1)

Publication Number Publication Date
SG11201800871SA true SG11201800871SA (en) 2018-05-30

Family

ID=61561834

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201800871SA SG11201800871SA (en) 2016-09-12 2017-09-12 Ferromagnetic material sputtering target

Country Status (7)

Country Link
US (1) US11060180B2 (en)
JP (1) JP6526837B2 (en)
CN (1) CN108076646B (en)
MY (1) MY186238A (en)
SG (1) SG11201800871SA (en)
TW (1) TWI636149B (en)
WO (1) WO2018047978A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7057692B2 (en) * 2018-03-20 2022-04-20 田中貴金属工業株式会社 Fe-Pt-Oxide-BN-based sintered body for sputtering target
US20200234730A1 (en) * 2018-03-27 2020-07-23 Jx Nippon Mining & Metals Corporation Sputtering target and method for producing same, and method for producing magnetic recording medium
CN110557941B (en) * 2018-03-30 2023-04-11 旭化成株式会社 Catalyst, method for producing catalyst, and method for producing acrylonitrile
JP7130447B2 (en) * 2018-06-07 2022-09-05 株式会社神戸製鋼所 Recording layer for optical information recording medium, optical information recording medium, and sputtering target
TWI702294B (en) * 2018-07-31 2020-08-21 日商田中貴金屬工業股份有限公司 Sputtering target for magnetic recording media
US11591688B2 (en) 2018-08-09 2023-02-28 Jx Nippon Mining & Metals Corporation Sputtering target, granular film and perpendicular magnetic recording medium
JP7385370B2 (en) * 2019-05-07 2023-11-22 山陽特殊製鋼株式会社 Ni-based sputtering target and magnetic recording medium
JP7104001B2 (en) * 2019-06-28 2022-07-20 田中貴金属工業株式会社 Fe-Pt-BN-based sputtering target and its manufacturing method
WO2021010019A1 (en) * 2019-07-12 2021-01-21 田中貴金属工業株式会社 Fe-pt-bn-based sputtering target and production method therefor
TWI752655B (en) * 2020-09-25 2022-01-11 光洋應用材料科技股份有限公司 Fe-pt based sputtering target and method of preparing the same
JP2023039187A (en) * 2021-09-08 2023-03-20 田中貴金属工業株式会社 Sputtering target including hard nitride
WO2023173139A2 (en) * 2022-03-11 2023-09-14 Georgetown University Boron-based and high-entropy magnetic materials

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4333902A (en) * 1977-01-24 1982-06-08 Sumitomo Electric Industries, Ltd. Process of producing a sintered compact
EP0429993B1 (en) * 1989-11-17 1995-08-02 Nissin Electric Company, Limited Method of forming thin film containing boron nitride, magnetic head and method of preparing said magnetic head
JPH07111221A (en) * 1993-10-12 1995-04-25 Toshiba Corp Magnetic sputter target and magnetic thin film using it, and thin film magnetic head
US5398639A (en) * 1993-11-12 1995-03-21 General Motors Corporation Solid state conversion of hexagonal to cubic-like boron nitride
EP1322793A2 (en) * 2000-10-06 2003-07-02 Element Six (PTY) Ltd Abrasive and wear resistant material
US6797137B2 (en) * 2001-04-11 2004-09-28 Heraeus, Inc. Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidfied alloy powders and elemental Pt metal
JP4175829B2 (en) * 2002-04-22 2008-11-05 株式会社東芝 Sputtering target for recording medium and magnetic recording medium
US20080210555A1 (en) * 2007-03-01 2008-09-04 Heraeus Inc. High density ceramic and cermet sputtering targets by microwave sintering
WO2014034390A1 (en) * 2012-08-31 2014-03-06 Jx日鉱日石金属株式会社 Fe-BASED MAGNETIC MATERIAL SINTERED BODY
US10755737B2 (en) * 2012-09-21 2020-08-25 Jx Nippon Mining & Metals Corporation Fe-Pt based magnetic material sintered compact
SG11201500762SA (en) * 2012-10-23 2015-05-28 Jx Nippon Mining & Metals Corp Fe-Pt-BASED SINTERED COMPACT SPUTTERING TARGET AND MANUFACTURING METHOD THEREFOR
WO2014064995A1 (en) * 2012-10-25 2014-05-01 Jx日鉱日石金属株式会社 Fe-Pt-BASED SPUTTERING TARGET HAVING NON-MAGNETIC SUBSTANCE DISPERSED THEREIN
JP5969120B2 (en) * 2013-05-13 2016-08-17 Ｊｘ金属株式会社 Sputtering target for magnetic thin film formation
WO2016047236A1 (en) * 2014-09-22 2016-03-31 Ｊｘ金属株式会社 Sputtering target for magnetic recording film formation and production method therefor
CN114959599A (en) * 2014-09-26 2022-08-30 捷客斯金属株式会社 Sputtering target for forming magnetic recording film and method for producing same
JP6113817B2 (en) * 2015-11-30 2017-04-12 山陽特殊製鋼株式会社 An alloy for a soft magnetic thin film layer and a sputtering target material in a perpendicular magnetic recording medium, and a perpendicular magnetic recording medium having a soft magnetic thin film layer.

Also Published As

Publication number Publication date
CN108076646B (en) 2019-12-13
JPWO2018047978A1 (en) 2018-10-18
US20200216945A1 (en) 2020-07-09
TWI636149B (en) 2018-09-21
JP6526837B2 (en) 2019-06-05
CN108076646A (en) 2018-05-25
US11060180B2 (en) 2021-07-13
MY186238A (en) 2021-06-30
WO2018047978A1 (en) 2018-03-15
TW201812063A (en) 2018-04-01

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