SG11201606737UA - Sputtering target - Google Patents

Sputtering target

Info

Publication number
SG11201606737UA
SG11201606737UA SG11201606737UA SG11201606737UA SG11201606737UA SG 11201606737U A SG11201606737U A SG 11201606737UA SG 11201606737U A SG11201606737U A SG 11201606737UA SG 11201606737U A SG11201606737U A SG 11201606737UA SG 11201606737U A SG11201606737U A SG 11201606737UA
Authority
SG
Singapore
Prior art keywords
sputtering target
sputtering
target
Prior art date
Application number
SG11201606737UA
Inventor
Atsutoshi Arakawa
Yuto MORISHITA
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of SG11201606737UA publication Critical patent/SG11201606737UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Powder Metallurgy (AREA)
  • Thin Magnetic Films (AREA)
SG11201606737UA 2014-09-04 2015-06-16 Sputtering target SG11201606737UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014179783 2014-09-04
PCT/JP2015/067226 WO2016035415A1 (en) 2014-09-04 2015-06-16 Sputtering target

Publications (1)

Publication Number Publication Date
SG11201606737UA true SG11201606737UA (en) 2016-09-29

Family

ID=55439486

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201606737UA SG11201606737UA (en) 2014-09-04 2015-06-16 Sputtering target

Country Status (5)

Country Link
JP (1) JP5946974B1 (en)
CN (1) CN106029943B (en)
MY (1) MY179241A (en)
SG (1) SG11201606737UA (en)
WO (1) WO2016035415A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10837101B2 (en) * 2016-03-31 2020-11-17 Jx Nippon Mining & Metals Corporation Ferromagnetic material sputtering target
WO2018123500A1 (en) * 2016-12-28 2018-07-05 Ｊｘ金属株式会社 Magnetic material sputtering target and method for manufacturing same
JP7072664B2 (en) * 2018-09-25 2022-05-20 Ｊｘ金属株式会社 Sputtering target and manufacturing method of sputtering target

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63276728A (en) * 1987-05-08 1988-11-15 Hitachi Ltd Magneto-optical recording medium
JPH07232926A (en) * 1993-12-27 1995-09-05 Alps Electric Co Ltd Fine-grained ferrite and its production
US20050277002A1 (en) * 2004-06-15 2005-12-15 Heraeus, Inc. Enhanced sputter target alloy compositions
US8679268B2 (en) * 2010-07-20 2014-03-25 Jx Nippon Mining & Metals Corporation Sputtering target of ferromagnetic material with low generation of particles
JP5698023B2 (en) * 2011-02-16 2015-04-08 山陽特殊製鋼株式会社 Soft magnetic alloy for magnetic recording, sputtering target material, and magnetic recording medium
JP5917045B2 (en) * 2011-08-17 2016-05-11 山陽特殊製鋼株式会社 Alloy and sputtering target material for soft magnetic thin film layer in perpendicular magnetic recording medium

Also Published As

Publication number Publication date
MY179241A (en) 2020-11-02
WO2016035415A1 (en) 2016-03-10
JPWO2016035415A1 (en) 2017-04-27
JP5946974B1 (en) 2016-07-06
CN106029943B (en) 2018-08-31
CN106029943A (en) 2016-10-12

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