SG11202007897UA - Sputtering target material - Google Patents
Sputtering target materialInfo
- Publication number
- SG11202007897UA SG11202007897UA SG11202007897UA SG11202007897UA SG11202007897UA SG 11202007897U A SG11202007897U A SG 11202007897UA SG 11202007897U A SG11202007897U A SG 11202007897UA SG 11202007897U A SG11202007897U A SG 11202007897UA SG 11202007897U A SG11202007897U A SG 11202007897UA
- Authority
- SG
- Singapore
- Prior art keywords
- target material
- sputtering target
- sputtering
- target
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/02—Alloys based on vanadium, niobium, or tantalum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/06—Alloys based on chromium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018026578A JP6814758B2 (en) | 2018-02-19 | 2018-02-19 | Sputtering target |
PCT/JP2019/004750 WO2019159856A1 (en) | 2018-02-19 | 2019-02-08 | Sputtering target material |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202007897UA true SG11202007897UA (en) | 2020-09-29 |
Family
ID=67619052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202007897UA SG11202007897UA (en) | 2018-02-19 | 2019-02-08 | Sputtering target material |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6814758B2 (en) |
CN (1) | CN111712587A (en) |
SG (1) | SG11202007897UA (en) |
TW (1) | TW201936938A (en) |
WO (1) | WO2019159856A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT15220U1 (en) * | 2016-03-07 | 2017-03-15 | Ceratizit Austria Gmbh | Process for producing a hard material layer on a substrate, hard material layer, cutting tool and coating source |
CN112404443A (en) * | 2020-11-25 | 2021-02-26 | 河南东微电子材料有限公司 | Preparation method of chromium-tantalum-boron alloy powder |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04308080A (en) * | 1991-04-02 | 1992-10-30 | Hitachi Metals Ltd | Co-cr-ta alloy target and production thereof |
JP2911675B2 (en) * | 1992-04-07 | 1999-06-23 | 功二 橋本 | High temperature corrosion resistant amorphous alloy |
JP2000057554A (en) * | 1998-08-18 | 2000-02-25 | Mitsubishi Chemicals Corp | Magnetic disk |
JP2000232206A (en) * | 1999-02-09 | 2000-08-22 | Oki Electric Ind Co Ltd | Ferroelectric memory |
JP2001131673A (en) * | 1999-11-05 | 2001-05-15 | Sony Corp | Electronic thin film material, dielectric capacitor and nonvolatile memory |
JP2002260218A (en) * | 2001-03-05 | 2002-09-13 | Anelva Corp | Magnetic recording disk and its manufacturing method and device |
JP2004039196A (en) * | 2002-07-08 | 2004-02-05 | Showa Denko Kk | Magnetic recording medium, its manufacturing method, and magnetic recording/reproducing device |
JP4331182B2 (en) * | 2006-04-14 | 2009-09-16 | 山陽特殊製鋼株式会社 | Soft magnetic target material |
JP6180755B2 (en) * | 2013-02-25 | 2017-08-16 | 山陽特殊製鋼株式会社 | Cr alloy for magnetic recording, target material for sputtering, and perpendicular magnetic recording medium using them |
CN105473758B (en) * | 2013-10-07 | 2018-02-27 | 三菱综合材料株式会社 | Sputtering target and its manufacture method |
JPWO2016052371A1 (en) * | 2014-09-30 | 2017-06-08 | Jx金属株式会社 | Mother alloy for sputtering target and method for producing sputtering target |
AT15220U1 (en) * | 2016-03-07 | 2017-03-15 | Ceratizit Austria Gmbh | Process for producing a hard material layer on a substrate, hard material layer, cutting tool and coating source |
-
2018
- 2018-02-19 JP JP2018026578A patent/JP6814758B2/en active Active
-
2019
- 2019-02-08 CN CN201980013051.9A patent/CN111712587A/en active Pending
- 2019-02-08 WO PCT/JP2019/004750 patent/WO2019159856A1/en active Application Filing
- 2019-02-08 SG SG11202007897UA patent/SG11202007897UA/en unknown
- 2019-02-18 TW TW108105226A patent/TW201936938A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201936938A (en) | 2019-09-16 |
CN111712587A (en) | 2020-09-25 |
JP2019143179A (en) | 2019-08-29 |
WO2019159856A1 (en) | 2019-08-22 |
JP6814758B2 (en) | 2021-01-20 |
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