MY170590A - Sputtering target for magnetic recording medium - Google Patents

Sputtering target for magnetic recording medium

Info

Publication number
MY170590A
MY170590A MYPI2015702785A MYPI2015702785A MY170590A MY 170590 A MY170590 A MY 170590A MY PI2015702785 A MYPI2015702785 A MY PI2015702785A MY PI2015702785 A MYPI2015702785 A MY PI2015702785A MY 170590 A MY170590 A MY 170590A
Authority
MY
Malaysia
Prior art keywords
sputtering target
recording medium
magnetic recording
amount
nonmagnetic material
Prior art date
Application number
MYPI2015702785A
Inventor
Atsushi Sato
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY170590A publication Critical patent/MY170590A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0466—Alloys based on noble metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C33/00—Making ferrous alloys
    • C22C33/02—Making ferrous alloys by powder metallurgy
    • C22C33/0257—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements
    • C22C33/0278—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements with at least one alloying element having a minimum content above 5%

Abstract

A sintered sputtering target having an L10-type ordered lattice Fe-Pt alloy and a nonmagnetic material as its main components, wherein the sputtering target contains Co and/or Ni in an amount of 0.05 to 0.5%, expressed as an atomic ratio in the metal components of the sputtering target. The present invention aims to provide a sputtering target made from an Fe-Pt-based alloy and a nonmagnetic material in which the amount of particles that are generated during sputtering is considerably reduced.
MYPI2015702785A 2013-05-20 2014-05-14 Sputtering target for magnetic recording medium MY170590A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013106170 2013-05-20

Publications (1)

Publication Number Publication Date
MY170590A true MY170590A (en) 2019-08-19

Family

ID=51933477

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015702785A MY170590A (en) 2013-05-20 2014-05-14 Sputtering target for magnetic recording medium

Country Status (5)

Country Link
JP (1) JP5826945B2 (en)
MY (1) MY170590A (en)
SG (1) SG11201506142YA (en)
TW (1) TWI593808B (en)
WO (1) WO2014188916A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6692724B2 (en) * 2016-09-02 2020-05-13 Ｊｘ金属株式会社 Non-magnetic material dispersed Fe-Pt based sputtering target
CN109985623B (en) * 2019-04-28 2022-02-08 中国烟草总公司郑州烟草研究院 Catalyst for preparing gamma-valerolactone by hydrogenation of levulinic acid and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04366441A (en) * 1991-06-13 1992-12-18 Mitsui Petrochem Ind Ltd Manufacture of magneto optical recording medium
JP2006161082A (en) * 2004-12-03 2006-06-22 Ishifuku Metal Ind Co Ltd Sputtering target manufacturing method
JP4810360B2 (en) * 2006-08-31 2011-11-09 石福金属興業株式会社 Magnetic thin film
JP2008252037A (en) * 2007-03-30 2008-10-16 Toshiba Corp Magnetoresistive element, and magnetic memory
JP4903277B2 (en) * 2010-01-26 2012-03-28 株式会社日立製作所 Magnetoresistive element, magnetic memory cell using the same, and random access memory
US9683284B2 (en) * 2011-03-30 2017-06-20 Jx Nippon Mining & Metals Corporation Sputtering target for magnetic recording film
JP5912559B2 (en) * 2011-03-30 2016-04-27 田中貴金属工業株式会社 Method for producing FePt-C sputtering target
WO2013046882A1 (en) * 2011-09-26 2013-04-04 Jx日鉱日石金属株式会社 Iron/platinum/carbon sputtering target

Also Published As

Publication number Publication date
TW201510238A (en) 2015-03-16
JP5826945B2 (en) 2015-12-02
JPWO2014188916A1 (en) 2017-02-23
TWI593808B (en) 2017-08-01
WO2014188916A1 (en) 2014-11-27
SG11201506142YA (en) 2015-09-29

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