JP6527947B2 - ウェハ剥離装置 - Google Patents
ウェハ剥離装置 Download PDFInfo
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- JP6527947B2 JP6527947B2 JP2017537281A JP2017537281A JP6527947B2 JP 6527947 B2 JP6527947 B2 JP 6527947B2 JP 2017537281 A JP2017537281 A JP 2017537281A JP 2017537281 A JP2017537281 A JP 2017537281A JP 6527947 B2 JP6527947 B2 JP 6527947B2
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- H—ELECTRICITY
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
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- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
- Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T156/1184—Piercing layer during delaminating [e.g., cutting, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T156/19—Delaminating means
- Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
- Y10T156/1967—Cutting delaminating means
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Description
2 工具
2.1 工具先端部
2.2 ガス出口
2.3 ガス入口
2.4 テーパ状スロット
3 ロボットアーム
3.1 吸盤
3.2 変位機構
4 光源
5 キャビネット
Claims (7)
- 接合されたデバイスウェハおよびキャリアウェハを保持するためのステージ部と;
ガス出口を有する工具であって、前記ステージ部の方向または前記ステージ部とは反対方向への前記工具の移動を制御する調節装置によって前記ステージ部に近接して配置されている工具と、を備え、
前記工具は、接合された前記デバイスウェハと前記キャリアウェハとの間の接合箇所における膜または接着層に貫入して切欠き部を形成する先端部を有し、前記ガス出口は、前記工具の前記先端部に設けられ、前記工具は、前記ガス出口と連通しているガス入口をさらに有し、前記ガス入口は、前記ステージ部上の接合された前記デバイスウェハおよび前記キャリアウェハの間の前記接合箇所に向けてガスジェットを射出するためにガスジェット発生器に接続されており、
前記ステージ部に近接して設けられた画像取得装置および光源をさらに備え、前記画像取得装置は、前記接合された両ウェハの前記接合箇所に接近する前記工具の前記先端部の画像を取得するために設けられ、前記光源は、前記画像をより鮮明にするための照明を提供するために設けられ、
前記光源は、前記ステージ部上の前記接合された両ウェハに或る角度で光を放射し、前記光の色は、前記画像取得装置によって検知可能であり、また、前記光は、前記デバイスウェハおよび前記キャリアウェハを透過し、前記接合された両ウェハの前記接合箇所における前記膜によって反射される、
ウェハ剥離装置。 - 前記画像取得装置は、前記工具の前記先端部に向けられた画像取得端部を有する、
請求項1に記載のウェハ剥離装置。 - 吸盤を具備したロボットアームをさらに備え、前記ロボットアームは前記吸盤によって、前記ステージ部上の前記接合されたデバイスウェハおよびキャリアウェハの上側のウェハに吸い付きかつ、前記上側のウェハが前記接合されたデバイスウェハおよびキャリアウェハの下側のウェハから前記ガスジェットによって分離されるときに前記上側のウェハを取り外す、
請求項1に記載のウェハ剥離装置。 - 前記画像取得装置および前記調節装置と通信する制御部をさらに備え、前記制御部は、前記接合された両ウェハの間の前記接合箇所の、前記画像取得装置によって撮影された前記画像を加工および分析することによって、前記接合された両ウェハの間の前記接合箇所に前記工具の前記先端部が自動的に位置合わせされるように前記調節装置によって前記工具の位置を調節するように構成されている、
請求項2に記載のウェハ剥離装置。 - 前記ガス出口から出力される前記ガスジェットの温度調節のために前記ガスジェット発生器と前記ガス入口との間に設けられたガス温度調節装置をさらに備える、
請求項1に記載のウェハ剥離装置。 - 前記ガス出口は、前記工具の前記先端部の上面に配置されている、
請求項1に記載のウェハ剥離装置。 - 前記工具の前記先端部は、前記工具の前記先端部の上面に設けられた2つのガス出口を有し、また、前記工具は、前記工具の側面に設けられたテーパ状スロットを有する、
請求項1に記載のウェハ剥離装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510404757.1 | 2015-07-08 | ||
CN201510404757.1A CN105047589B (zh) | 2015-07-08 | 2015-07-08 | 晶圆解键合装置 |
PCT/CN2015/084182 WO2017004843A1 (zh) | 2015-07-08 | 2015-07-16 | 晶圆解键合装置 |
Publications (2)
Publication Number | Publication Date |
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JP2018507543A JP2018507543A (ja) | 2018-03-15 |
JP6527947B2 true JP6527947B2 (ja) | 2019-06-12 |
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Application Number | Title | Priority Date | Filing Date |
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JP2017537281A Expired - Fee Related JP6527947B2 (ja) | 2015-07-08 | 2015-07-16 | ウェハ剥離装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10204813B2 (ja) |
EP (1) | EP3321955B1 (ja) |
JP (1) | JP6527947B2 (ja) |
KR (1) | KR101990413B1 (ja) |
CN (1) | CN105047589B (ja) |
WO (1) | WO2017004843A1 (ja) |
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US10074178B2 (en) * | 2015-01-30 | 2018-09-11 | Dental Imaging Technologies Corporation | Intra-oral image acquisition alignment |
CN107665848B (zh) * | 2016-07-29 | 2020-08-25 | 上海微电子装备(集团)股份有限公司 | 一种解键合调平装置及解键合方法 |
CN106816405B (zh) * | 2017-01-20 | 2020-03-27 | 中国科学院微电子研究所 | 一种晶圆临时键合方法 |
CN108511351B (zh) * | 2017-02-28 | 2020-05-01 | 上海微电子装备(集团)股份有限公司 | 一种解键合装置及控制方法 |
CN107200301B (zh) * | 2017-05-23 | 2019-02-12 | 中国科学院微电子研究所 | 一种mems晶片的贴膜对准装置 |
US10374161B2 (en) * | 2017-08-16 | 2019-08-06 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Glass substrate separation method and glass substrate separation device |
US11462432B2 (en) * | 2018-03-15 | 2022-10-04 | Intel Corporation | Dual side de-bonding in component carriers using photoablation |
TW202015144A (zh) * | 2018-10-01 | 2020-04-16 | 巨擘科技股份有限公司 | 基板分離系統及方法 |
CN110034050B (zh) * | 2019-04-17 | 2021-07-20 | 大族激光科技产业集团股份有限公司 | 解键合装置及其穿刺机构 |
CN110098140B (zh) * | 2019-05-16 | 2021-03-09 | 芯盟科技有限公司 | 低温晶圆直接键合机台和晶圆键合方法 |
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WO2017004843A1 (zh) | 2017-01-12 |
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