JP6519794B2 - 電着液、およびメタルコア基板の製造方法 - Google Patents

電着液、およびメタルコア基板の製造方法 Download PDF

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JP6519794B2
JP6519794B2 JP2015186098A JP2015186098A JP6519794B2 JP 6519794 B2 JP6519794 B2 JP 6519794B2 JP 2015186098 A JP2015186098 A JP 2015186098A JP 2015186098 A JP2015186098 A JP 2015186098A JP 6519794 B2 JP6519794 B2 JP 6519794B2
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electrodeposition
film
pdms
substrate
metal core
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JP2016065234A5 (enExample
JP2016065234A (ja
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裕介 青木
裕介 青木
幹人 狩野
幹人 狩野
和彦 笠野
和彦 笠野
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Mie University NUC
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4419—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained otherwise than by polymerisation reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
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    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
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    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/448—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications characterised by the additives used
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    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
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    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/20—Electrolytic after-treatment
    • C—CHEMISTRY; METALLURGY
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    • C25D13/02—Electrophoretic coating characterised by the process with inorganic material
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    • C25D13/12—Electrophoretic coating characterised by the process characterised by the article coated
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    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
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    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
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    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
JP2015186098A 2014-09-19 2015-09-18 電着液、およびメタルコア基板の製造方法 Active JP6519794B2 (ja)

Applications Claiming Priority (2)

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JP2014192033 2014-09-19
JP2014192033 2014-09-19

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JP2016065234A JP2016065234A (ja) 2016-04-28
JP2016065234A5 JP2016065234A5 (enExample) 2018-10-25
JP6519794B2 true JP6519794B2 (ja) 2019-05-29

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US (1) US20170292029A1 (enExample)
EP (1) EP3196263B1 (enExample)
JP (1) JP6519794B2 (enExample)
KR (1) KR102494877B1 (enExample)
WO (1) WO2016043331A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6722568B2 (ja) * 2016-11-17 2020-07-15 サンコール株式会社 半導体素子取付用基板端子板の製造方法
JP6414260B2 (ja) 2017-03-23 2018-10-31 三菱マテリアル株式会社 放熱回路基板
JP6902266B2 (ja) * 2017-07-13 2021-07-14 国立大学法人三重大学 セラミック基板の製造方法、及びパワーモジュールの製造方法
JP7011303B2 (ja) * 2017-10-02 2022-01-26 国立大学法人三重大学 反射基板の製造方法および電着液
US10790731B2 (en) * 2018-05-30 2020-09-29 General Electric Company Methods of depositing coatings on electrical machine components
CN111172578B (zh) * 2020-01-17 2021-07-06 深圳市裕展精密科技有限公司 金属制品及其制备方法
CN113861693B (zh) * 2021-10-24 2022-07-19 扬州晨化新材料股份有限公司 一种汽车用过电泳耐高温密封胶及其制备方法
KR102691123B1 (ko) * 2021-10-29 2024-08-05 주식회사 에프엠에스 금속 배선 구조체의 제조 방법

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JPS60207392A (ja) * 1984-03-30 1985-10-18 三菱電線工業株式会社 回路用基板
JPS6320374A (ja) * 1986-07-11 1988-01-28 Ube Ind Ltd 電着樹脂組成物
JPS6353296A (ja) * 1986-08-25 1988-03-07 Toyota Motor Corp 電気泳動法による絶縁粉末層の形成方法
JP3274154B2 (ja) * 1991-09-26 2002-04-15 株式会社シミズ カチオン性官能基含有ポリシロキサン樹脂組成物、それを用いた塗料組成物およびカチオン性官能基含有ポリシロキサン樹脂組成物の製造方法
JP2000345370A (ja) * 1999-06-07 2000-12-12 Ueda Alumite Kogyo Kk マグネシウム又はマグネシウム合金の表面処理方法
JP3980887B2 (ja) * 2002-01-11 2007-09-26 株式会社タイカ 配線板用基板
JP2005154587A (ja) 2003-11-26 2005-06-16 Dainippon Ink & Chem Inc 水性硬化性樹脂組成物、水性塗料及び塗装物
JP2009043914A (ja) * 2007-08-08 2009-02-26 Ishida Yukio 配線板の製造法および配線板
WO2010143357A1 (ja) * 2009-06-10 2010-12-16 国立大学法人信州大学 ポリオルガノシロキサン組成物およびその硬化体
WO2012157225A1 (ja) * 2011-05-13 2012-11-22 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
US20160032148A1 (en) * 2013-03-15 2016-02-04 Dow Corning Corporation A method for making an optical assembly comprising depositing a solid silicone-containing hot melt composition in powder form and forming an encapsulant thereof

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EP3196263B1 (en) 2021-09-01
US20170292029A1 (en) 2017-10-12
WO2016043331A1 (ja) 2016-03-24
EP3196263A4 (en) 2018-04-18
KR20170056548A (ko) 2017-05-23
EP3196263A1 (en) 2017-07-26
KR102494877B1 (ko) 2023-02-02
JP2016065234A (ja) 2016-04-28

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