JP6483565B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6483565B2 JP6483565B2 JP2015154483A JP2015154483A JP6483565B2 JP 6483565 B2 JP6483565 B2 JP 6483565B2 JP 2015154483 A JP2015154483 A JP 2015154483A JP 2015154483 A JP2015154483 A JP 2015154483A JP 6483565 B2 JP6483565 B2 JP 6483565B2
- Authority
- JP
- Japan
- Prior art keywords
- grease
- heat sink
- groove
- power card
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
3:冷却器
6、6a、6b:絶縁板
7a、7b、7c:電極端子
9:グリス
10、110:パワーカード
11a、11b:トランジスタ
13:パッケージ
16a、16b、17:放熱板
31:ケース
32:板バネ
46:ツールマーク
46a:素子直上ツールマーク群
46b:残りツールマーク群
47:溝
47a:突条
Claims (1)
- 半導体素子を収容しており、側面に金属放熱板が露出している半導体モジュールと、
前記半導体モジュールの前記金属放熱板にグリスを挟んで当接している冷却部材と、
を備えており、
前記金属放熱板の表面に、平行な複数のツールマークが形成されており、
前記金属放熱板の法線方向から前記半導体モジュールを平面視したときに、前記半導体素子と前記金属放熱板は重なっており、前記複数のツールマークのうち、前記金属放熱板の前記半導体素子と重なる範囲を通る素子直上ツールマーク群の当該重なる範囲の両外側に、前記素子直上ツールマーク群を横断する溝が設けられており、
前記金属放熱板には、前記重なる範囲を通らない残りツールマーク群を横切る溝は存在しないことを特徴とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015154483A JP6483565B2 (ja) | 2015-08-04 | 2015-08-04 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015154483A JP6483565B2 (ja) | 2015-08-04 | 2015-08-04 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017034167A JP2017034167A (ja) | 2017-02-09 |
JP6483565B2 true JP6483565B2 (ja) | 2019-03-13 |
Family
ID=57989394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015154483A Expired - Fee Related JP6483565B2 (ja) | 2015-08-04 | 2015-08-04 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6483565B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111868900A (zh) | 2018-03-23 | 2020-10-30 | 三菱综合材料株式会社 | 电子组件安装模块的制造方法 |
CN112805827B (zh) | 2018-10-09 | 2023-12-12 | 罗姆股份有限公司 | 半导体装置以及半导体装置的制造方法 |
JP7302670B2 (ja) * | 2019-11-12 | 2023-07-04 | 株式会社デンソー | 半導体装置 |
CN114747304B (zh) * | 2019-12-02 | 2022-11-18 | 三菱电机株式会社 | 散热器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007096191A (ja) * | 2005-09-30 | 2007-04-12 | Mitsubishi Electric Corp | 半導体装置および放熱機構付き半導体装置 |
WO2014097561A1 (ja) * | 2012-12-21 | 2014-06-26 | 株式会社デンソー | 放熱シート、放熱装置、放熱装置の製造方法 |
JP6024838B2 (ja) * | 2013-12-27 | 2016-11-16 | 三菱電機株式会社 | 半導体装置 |
-
2015
- 2015-08-04 JP JP2015154483A patent/JP6483565B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2017034167A (ja) | 2017-02-09 |
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Legal Events
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