JP6474018B2 - セラミック配線基板、セラミック配線基板用セラミックグリーンシート及びセラミック配線基板用ガラスセラミックス粉末 - Google Patents
セラミック配線基板、セラミック配線基板用セラミックグリーンシート及びセラミック配線基板用ガラスセラミックス粉末 Download PDFInfo
- Publication number
- JP6474018B2 JP6474018B2 JP2014175340A JP2014175340A JP6474018B2 JP 6474018 B2 JP6474018 B2 JP 6474018B2 JP 2014175340 A JP2014175340 A JP 2014175340A JP 2014175340 A JP2014175340 A JP 2014175340A JP 6474018 B2 JP6474018 B2 JP 6474018B2
- Authority
- JP
- Japan
- Prior art keywords
- filler
- ceramic
- glass
- willemite
- alumina
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
- C04B35/18—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay rich in aluminium oxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/638—Removal thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3427—Silicates other than clay, e.g. water glass
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
- C04B2235/365—Borosilicate glass
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5463—Particle size distributions
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/602—Making the green bodies or pre-forms by moulding
- C04B2235/6025—Tape casting, e.g. with a doctor blade
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/56—Using constraining layers before or during sintering
- C04B2237/562—Using constraining layers before or during sintering made of alumina or aluminates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Glass Compositions (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
プローブカードは、通常、半導体ウェハーに接触するテストヘッドと、テスターに接続されるプリントセラミック配線基板と、プリントセラミック配線基板とテストヘッドとを接続するインターポーザ基板と呼ばれるセラミック配線基板とを有している。
さらに、インターポーザ基板の機械的強度を確保したいという要望もある。
本発明の主な目的は、低温焼成可能なセラミック配線基板であって、熱膨張係数を低く調節することが可能であり、かつ、機械的強度の高いセラミック配線基板を提供することにある。
セラミックフィラーとして、−40℃〜+125℃の温度範囲における熱膨張係数が低い第1のセラミックフィラー、及びセラミックフィラーの3点曲げ強度が高い第2のセラミックフィラーを含むため、ガラスとこれらのセラミックフィラーの質量比を調整することによりセラミック基板10の熱膨張係数を好適に調節することができるとともに、セラミック基板10としての機械的強度を担保することができる。つまり、第1のセラミックフィラーにより、セラミック基板10の−40℃〜+125℃の温度範囲における熱膨張係数を小さくすることができるとともに、第2のセラミックフィラーにより、セラミック基板10の機械的強度を向上させることができる。
質量百分率表示で、SiO2 70%、B2O3 28%、K2O 2%となるように、ガラス原料を調合し、白金るつぼにガラス原料を投入し、1600℃で溶融することで溶融ガラスを得た。溶融ガラスを、水冷した2つの回転ロール間に供給し、溶融ガラスを延伸することにより、フィルム状のガラスを得た。
以下の点を除いては、実施例1と同様にしてセラミック配線基板を作製した。
以下の点を除いては、実施例1と同様にしてセラミック配線基板を作製した。
10:セラミック基板
10a:第1の主面
10b:第2の主面
11:セラミック層
20:内部導体
21:層間電極
22:ビアホール電極
31,32:電極パッド
Claims (9)
- セラミック基板と、
前記セラミック基板内に配された内部導体と、
を備え、
前記セラミック基板は、ガラス、ウイレマイトフィラー及びアルミナフィラーからなる、
セラミック配線基板。 - セラミック基板と、
前記セラミック基板内に配された内部導体と、
を備え、
前記セラミック基板は、ガラス、ウイレマイトフィラー及びアルミナフィラーを含み、
前記ガラスと前記アルミナフィラー及び前記ウイレマイトフィラーとの質量比(前記ガラス:前記アルミナフィラー及び前記ウイレマイトフィラー)は30:70〜65:35の範囲内にあり、前記アルミナフィラーと前記ウイレマイトフィラーとの質量比(前記アルミナフィラー:前記ウイレマイトフィラー)は20:80〜60:40の範囲内にあり、
前記ウイレマイトフィラーの平均粒子径は、前記アルミナフィラーの平均粒子径よりも小さい、
セラミック配線基板。 - セラミック基板と、
前記セラミック基板内に配された内部導体と、
を備え、
前記セラミック基板は、ガラス、ウイレマイトフィラー及びアルミナフィラーを含み、
前記セラミック基板は、ガラス、ウイレマイトフィラー及びアルミナフィラーを含み、
前記ガラスと前記アルミナフィラー及び前記ウイレマイトフィラーとの質量比(前記ガラス:前記アルミナフィラー及び前記ウイレマイトフィラー)は30:70〜65:35の範囲内にあり、前記アルミナフィラーと前記ウイレマイトフィラーとの質量比(前記アルミナフィラー:前記ウイレマイトフィラー)は20:80〜60:40の範囲内にあり、
−40℃〜+125℃の温度範囲における熱膨張係数は4ppm/℃以下である、
セラミック配線基板。 - 前記ガラスはホウケイ酸ガラスである、請求項1〜3のいずれか一項に記載のセラミック配線基板。
- 前記ガラスは、ガラス組成として、質量%で、SiO2 60〜80%、B2O3 10〜30%、Li2O+Na2O+K2O 1〜5%及びMgO+CaO+SrO+BaO 0〜20%を含む、請求項4に記載のセラミック配線基板。
- ガラス、ウイレマイトフィラー及びアルミナフィラーからなるセラミック配線基板用ガラスセラミック粉末を含む、
セラミック配線基板用セラミックグリーンシート。 - ガラス、ウイレマイトフィラー及びアルミナフィラーを含み、
前記ガラスと前記アルミナフィラー及び前記ウイレマイトフィラーとの質量比(前記ガラス:前記アルミナフィラー及び前記ウイレマイトフィラー)は30:70〜65:35の範囲内にあり、前記アルミナフィラーと前記ウイレマイトフィラーとの質量比(前記アルミナフィラー:前記ウイレマイトフィラー)は20:80〜60:40の範囲内にあり、
前記ウイレマイトフィラーの平均粒子径は、前記アルミナフィラーの平均粒子径よりも小さい、
セラミック配線基板用セラミックグリーンシート。 - ガラス、ウイレマイトフィラー及びアルミナフィラーからなる、
セラミック配線基板用ガラスセラミックス粉末。 - ガラス、ウイレマイトフィラー及びアルミナフィラーを含み、
前記ガラスと前記アルミナフィラー及び前記ウイレマイトフィラーとの質量比(前記ガラス:前記アルミナフィラー及び前記ウイレマイトフィラー)は30:70〜65:35の範囲内にあり、前記アルミナフィラーと前記ウイレマイトフィラーとの質量比(前記アルミナフィラー:前記ウイレマイトフィラー)は20:80〜60:40の範囲内にあり、
前記ウイレマイトフィラーの平均粒子径は、前記アルミナフィラーの平均粒子径よりも小さい、
セラミック配線基板用ガラスセラミックス粉末。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014175340A JP6474018B2 (ja) | 2013-09-30 | 2014-08-29 | セラミック配線基板、セラミック配線基板用セラミックグリーンシート及びセラミック配線基板用ガラスセラミックス粉末 |
CN201480051062.3A CN105579418B (zh) | 2013-09-30 | 2014-09-05 | 陶瓷布线基板、陶瓷布线基板用陶瓷生坯片及陶瓷布线基板用玻璃陶瓷粉末 |
PCT/JP2014/073567 WO2015045815A1 (ja) | 2013-09-30 | 2014-09-05 | セラミック配線基板、セラミック配線基板用セラミックグリーンシート及びセラミック配線基板用ガラスセラミックス粉末 |
KR1020167003592A KR102174577B1 (ko) | 2013-09-30 | 2014-09-05 | 세라믹 배선 기판, 세라믹 배선 기판용 세라믹 그린 시트 및 세라믹 배선 기판용 유리 세라믹스 분말 |
TW103132268A TWI634091B (zh) | 2013-09-30 | 2014-09-18 | Ceramic wiring board, ceramic green sheet for ceramic wiring board, and glass ceramic powder for ceramic wiring board |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013204765 | 2013-09-30 | ||
JP2013204765 | 2013-09-30 | ||
JP2014175340A JP6474018B2 (ja) | 2013-09-30 | 2014-08-29 | セラミック配線基板、セラミック配線基板用セラミックグリーンシート及びセラミック配線基板用ガラスセラミックス粉末 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015092541A JP2015092541A (ja) | 2015-05-14 |
JP6474018B2 true JP6474018B2 (ja) | 2019-02-27 |
Family
ID=52742962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014175340A Active JP6474018B2 (ja) | 2013-09-30 | 2014-08-29 | セラミック配線基板、セラミック配線基板用セラミックグリーンシート及びセラミック配線基板用ガラスセラミックス粉末 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6474018B2 (ja) |
KR (1) | KR102174577B1 (ja) |
CN (1) | CN105579418B (ja) |
TW (1) | TWI634091B (ja) |
WO (1) | WO2015045815A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI662872B (zh) * | 2018-01-26 | 2019-06-11 | 謝孟修 | 陶瓷電路板及其製法 |
CN114208402A (zh) * | 2019-08-06 | 2022-03-18 | 日本电气硝子株式会社 | 陶瓷布线基板、陶瓷布线基板用陶瓷生片以及陶瓷布线基板用玻璃陶瓷粉末 |
JP2021138575A (ja) * | 2020-03-06 | 2021-09-16 | 日本電気硝子株式会社 | 連結基板及びそれを用いた素子基板の製造方法 |
JPWO2022153797A1 (ja) * | 2021-01-15 | 2022-07-21 | ||
KR102575742B1 (ko) * | 2021-04-29 | 2023-09-06 | (주)샘씨엔에스 | Ltcc 기판을 제조하기 위한 슬러리 조성물, ltcc 기판의 제조 방법, ltcc 기판, 공간 변환기 및 공간 변환기의 제조 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06116019A (ja) * | 1992-10-07 | 1994-04-26 | Sumitomo Metal Mining Co Ltd | 低温焼成ガラスセラミック基板 |
JP3522559B2 (ja) * | 1998-12-18 | 2004-04-26 | 三星電機株式会社 | 誘電体磁器材料 |
ATE446980T1 (de) * | 2004-06-07 | 2009-11-15 | Ticona Llc | Polyethylen-pulver zur herstellung von formmassen und daraus hergestellte poröse gegenstände |
JP4583224B2 (ja) * | 2005-04-05 | 2010-11-17 | 京セラ株式会社 | 測定用配線基板、プローブカード及び評価装置 |
JP2009074823A (ja) | 2007-09-19 | 2009-04-09 | Ngk Spark Plug Co Ltd | 電子部品検査装置用配線基板およびその製造方法 |
KR100993010B1 (ko) * | 2008-06-26 | 2010-11-09 | 한국과학기술연구원 | 저온소성용 저유전율 유전체 세라믹 조성물 |
JP2012242197A (ja) * | 2011-05-18 | 2012-12-10 | Seiko Epson Corp | プローブカード |
-
2014
- 2014-08-29 JP JP2014175340A patent/JP6474018B2/ja active Active
- 2014-09-05 KR KR1020167003592A patent/KR102174577B1/ko active IP Right Grant
- 2014-09-05 CN CN201480051062.3A patent/CN105579418B/zh active Active
- 2014-09-05 WO PCT/JP2014/073567 patent/WO2015045815A1/ja active Application Filing
- 2014-09-18 TW TW103132268A patent/TWI634091B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI634091B (zh) | 2018-09-01 |
TW201534573A (zh) | 2015-09-16 |
WO2015045815A1 (ja) | 2015-04-02 |
CN105579418A (zh) | 2016-05-11 |
CN105579418B (zh) | 2017-10-27 |
JP2015092541A (ja) | 2015-05-14 |
KR102174577B1 (ko) | 2020-11-05 |
KR20160064072A (ko) | 2016-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6214930B2 (ja) | 多層配線基板 | |
JP6474018B2 (ja) | セラミック配線基板、セラミック配線基板用セラミックグリーンシート及びセラミック配線基板用ガラスセラミックス粉末 | |
JP5158040B2 (ja) | ガラスセラミックス基板 | |
JP2010147101A (ja) | 電子部品 | |
WO2021024918A1 (ja) | セラミック配線基板、セラミック配線基板用セラミックグリーンシート及びセラミック配線基板用ガラスセラミックス粉末 | |
JP5803453B2 (ja) | ガラスセラミック誘電体用材料およびガラスセラミック誘電体 | |
JPWO2020129945A1 (ja) | 積層体及び電子部品 | |
JP2008251782A (ja) | セラミック配線基板およびその製造方法 | |
JPWO2014196348A1 (ja) | セラミック基板用組成物およびセラミック回路部品 | |
JP2004075534A (ja) | 絶縁性組成物 | |
JP2010126381A (ja) | グリーンシート | |
WO2022153797A1 (ja) | セラミック基板、セラミック基板用グリーンシート及びセラミック基板用複合粉末 | |
WO2009119433A1 (ja) | 無鉛ガラス及び無鉛ガラスセラミックス用組成物 | |
JP4373198B2 (ja) | 低温焼成基板用無鉛ガラスセラミックス組成物 | |
JPWO2020129858A1 (ja) | 積層体、電子部品及び積層体の製造方法 | |
JP3807257B2 (ja) | セラミック部品の製造方法 | |
JP7056764B2 (ja) | ガラスセラミック材料、積層体、及び、電子部品 | |
JP2010053010A (ja) | セラミック焼結体の製造方法およびマイクロ波加熱用治具 | |
JP6336841B2 (ja) | 配線基板 | |
JP2002353626A (ja) | 多層配線基板およびその製造方法 | |
JP2006216700A (ja) | セラミック多層基板及びその製造方法 | |
JP5499766B2 (ja) | ガラスセラミックス基板及びその製造方法、並びに配線基板 | |
JP2006265033A (ja) | 低温焼成基板材料及びそれを用いた多層配線基板 | |
JP2005026722A (ja) | 多層セラミック基板およびその製造方法 | |
JP2007227081A (ja) | 導体ペーストおよびセラミック多層基板製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170706 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180329 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180502 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180905 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181015 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190107 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190120 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6474018 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |