JP6463405B2 - 半導体チップ、および半導体チップの製造方法 - Google Patents
半導体チップ、および半導体チップの製造方法 Download PDFInfo
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- JP6463405B2 JP6463405B2 JP2017095649A JP2017095649A JP6463405B2 JP 6463405 B2 JP6463405 B2 JP 6463405B2 JP 2017095649 A JP2017095649 A JP 2017095649A JP 2017095649 A JP2017095649 A JP 2017095649A JP 6463405 B2 JP6463405 B2 JP 6463405B2
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/18—Semiconductor lasers with special structural design for influencing the near- or far-field
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2036—Broad area lasers
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
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- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
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Description
2 第2の半導体層
3 第3の層
4 コンタクト層
5 パッシベーション層
6 基板
7 温度分布パターン部
8,9 保護層
10 半導体材料
11,12,13 領域
21 リッジ導波構造
61 表面
62 マーク
70 温度分布パターン要素
100 半導体チップ
200 支持体
201 回転方向
300 光ビーム
301 複数の光源
400 光偏向装置
500 検出器
1000,2000,3000 方法のステップ
Claims (12)
- 第1の半導体層(1)を備えた半導体チップ(100)であって、
前記第1の半導体層(1)は、少なくとも1つの延在方向において材料組成の横方向の変化を有し、
前記第1の半導体層(1)は一定の厚さを有し、
前記第1の半導体層(1)は、少なくとも1つの第1の領域(11)と、横方向において当該第1の領域(11)の隣の少なくとも1つの第2の領域(12)とを有し、
前記第1の領域(11)と前記第2の領域(12)とは同一の材料系を有し、
前記第1の領域(11)の材料組成は前記第2の領域(12)の材料組成と異なり、かつ、前記第1の領域(11)と前記第2の領域(12)とは等しい厚さを有し、
前記半導体チップ(100)は発光ダイオードチップとして構成されており、かつ、少なくとも一部がボンディングパッドとして構成されているコンタクト層(4)を有し、
前記第2の領域(12)は前記ボンディングパッドの下方に配置されており、
前記コンタクト層(4)は電流輸送リブ部を有し、
前記第2の領域(12)は前記電流輸送リブ部の下方に形成されている、
ことを特徴とする半導体チップ(100)。 - 前記半導体チップ(100)はレーザダイオードチップとして構成されており、かつ、動作中に光を放射するファセットを有し、
前記第2の領域(12)は、前記ファセットに接するファセット領域として、当該ファセットと前記第1の領域(11)との間に形成されている、
請求項1記載の半導体チップ(100)。 - 前記半導体チップ(100)はレーザダイオードチップとして構成されており、かつ、動作中に光を生成するレーザストライプ部を有し、
前記第1の領域(11)は前記レーザストライプ部の領域に形成されており、
前記第2の領域(12)は前記レーザストライプ部の両隣に形成されている、
請求項1または2記載の半導体チップ(100)。 - 前記半導体チップ(100)は発光ダイオードチップとして構成されており、
前記第2の領域(12)は横方向において前記第1の領域(11)を包囲して、前記半導体チップ(100)の縁部に環状に接する、
請求項1から3までのいずれか1項記載の半導体チップ(100)。 - 前記第2の領域(12)のバンドギャップが前記第1の領域(11)のバンドギャップより大きくなるように、当該第1の領域(11)および第2の領域(12)の材料組成は選択されている、
請求項1から4までのいずれか1項記載の半導体チップ(100)。 - 前記第1の半導体層(1)は少なくとも、活性層の一部である、
請求項1から5までのいずれか1項記載の半導体チップ(100)。 - 前記第1の半導体層(1)はInAlGaN材料系をベースとしており、
前記材料組成の横方向の変化のためにIn含有率が変化する、
請求項1から6までのいずれか1項記載の半導体チップ(100)。 - 前記材料組成の横方向の変化は、少なくとも部分的に階段状の推移を有する、
請求項1から7までのいずれか1項記載の半導体チップ(100)。 - 前記材料組成の横方向の変化は、少なくとも部分的に連続的な推移を有する、
請求項1から8までのいずれか1項記載の半導体チップ(100)。 - 請求項1から9までのいずれか1項記載の半導体チップ(100)の製造方法であって、
第1の半導体層(1)を成長させる成長プロセス中に、当該第1の半導体層(1)の材料組成の横方向の変化が生じるように、当該成長中の第1の半導体層(1)の少なくとも1つの延在方向において不均一な横方向温度分布を生成する
ことを特徴とする製造方法。 - 局所的に変化する光照射(300)によって、前記不均一な横方向温度分布の少なくとも一部を規定通りに生じさせる、
請求項10記載の製造方法。 - 前記成長中の第1の半導体層(1)の温度を局所的に上昇または低下させる少なくとも1つの温度分布パターン要素(70)を有する温度分布パターン部(7)によって、前記不均一な横方向温度分布の少なくとも一部を規定通りに生じさせる、
請求項10または11記載の製造方法。
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JP2017208543A (ja) * | 2016-05-13 | 2017-11-24 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 半導体チップの製造方法、および半導体チップ |
US10637211B2 (en) | 2016-05-13 | 2020-04-28 | Osram Oled Gmbh | Light-emitting semiconductor chip and method for producing a semiconductor light-emitting chip |
US10693033B2 (en) | 2016-05-13 | 2020-06-23 | Osram Oled Gmbh | Semiconductor chip and method for producing a semiconductor chip |
US11004876B2 (en) | 2016-05-13 | 2021-05-11 | Osram Oled Gmbh | Method for producing a semiconductor chip and semiconductor chip |
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JP2017208545A (ja) | 2017-11-24 |
US10693033B2 (en) | 2020-06-23 |
JP6997071B2 (ja) | 2022-01-17 |
DE102017108949A1 (de) | 2017-11-16 |
US20190319162A1 (en) | 2019-10-17 |
US20170330996A1 (en) | 2017-11-16 |
US10388823B2 (en) | 2019-08-20 |
JP2019071457A (ja) | 2019-05-09 |
DE102017108949B4 (de) | 2021-08-26 |
CN107394583A (zh) | 2017-11-24 |
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