JP6454906B2 - 真空蒸着装置及びそれを用いたデバイス製造方法 - Google Patents
真空蒸着装置及びそれを用いたデバイス製造方法 Download PDFInfo
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- JP6454906B2 JP6454906B2 JP2018103138A JP2018103138A JP6454906B2 JP 6454906 B2 JP6454906 B2 JP 6454906B2 JP 2018103138 A JP2018103138 A JP 2018103138A JP 2018103138 A JP2018103138 A JP 2018103138A JP 6454906 B2 JP6454906 B2 JP 6454906B2
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- 238000001771 vacuum deposition Methods 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000001704 evaporation Methods 0.000 claims description 96
- 230000008020 evaporation Effects 0.000 claims description 94
- 238000000151 deposition Methods 0.000 claims description 56
- 230000008021 deposition Effects 0.000 claims description 56
- 238000007740 vapor deposition Methods 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 26
- 230000001105 regulatory effect Effects 0.000 claims description 14
- 239000011553 magnetic fluid Substances 0.000 claims description 13
- 238000007738 vacuum evaporation Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 14
- 230000007246 mechanism Effects 0.000 description 10
- 239000002923 metal particle Substances 0.000 description 7
- 238000009429 electrical wiring Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 238000005019 vapor deposition process Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011554 ferrofluid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170068987A KR101821926B1 (ko) | 2017-06-02 | 2017-06-02 | 진공 증착 장치 및 이를 사용한 디바이스 제조방법 |
| KR10-2017-0068987 | 2017-06-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018204106A JP2018204106A (ja) | 2018-12-27 |
| JP6454906B2 true JP6454906B2 (ja) | 2019-01-23 |
Family
ID=61029255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018103138A Active JP6454906B2 (ja) | 2017-06-02 | 2018-05-30 | 真空蒸着装置及びそれを用いたデバイス製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6454906B2 (zh) |
| KR (1) | KR101821926B1 (zh) |
| CN (1) | CN108977771B (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110643969A (zh) * | 2018-06-27 | 2020-01-03 | 北京铂阳顶荣光伏科技有限公司 | 一种真空蒸镀设备 |
| JP7324593B2 (ja) | 2019-03-05 | 2023-08-10 | キヤノントッキ株式会社 | 真空チャンバ内へのユーティリティライン導入機構、成膜装置、成膜システム |
| CN110739285A (zh) * | 2019-10-30 | 2020-01-31 | 北京工业大学 | 硅基金属中间层化合物半导体晶圆的结构及制备方法 |
| JP2021095609A (ja) * | 2019-12-18 | 2021-06-24 | キヤノントッキ株式会社 | 成膜装置、成膜方法及び電子デバイスの製造方法 |
| JP7177128B2 (ja) * | 2020-09-30 | 2022-11-22 | キヤノントッキ株式会社 | 成膜装置、検知装置、検知方法、及び電子デバイスの製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004269907A (ja) * | 2003-03-05 | 2004-09-30 | Jeol Ltd | 真空蒸着装置 |
| JP4446048B2 (ja) * | 2003-07-11 | 2010-04-07 | 株式会社昭和真空 | 真空蒸着装置の蒸発源移動機構 |
| JP4789551B2 (ja) * | 2005-09-06 | 2011-10-12 | 株式会社半導体エネルギー研究所 | 有機ｅｌ成膜装置 |
| KR100842183B1 (ko) * | 2006-12-29 | 2008-06-30 | 두산메카텍 주식회사 | 증발원 스캐닝 장치 |
| KR20090130559A (ko) * | 2008-06-16 | 2009-12-24 | 삼성모바일디스플레이주식회사 | 이송 장치 및 이를 구비하는 유기물 증착 장치 |
| JP5492027B2 (ja) * | 2010-08-31 | 2014-05-14 | 株式会社日立ハイテクノロジーズ | 有機ｅｌデバイス製造装置及び製造方法 |
| US9055654B2 (en) * | 2011-12-22 | 2015-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Film formation apparatus and film formation method |
| KR101340615B1 (ko) | 2011-12-26 | 2013-12-11 | 엘아이지에이디피 주식회사 | 화학기상 증착장치 |
| KR101385587B1 (ko) | 2012-01-02 | 2014-04-16 | 주식회사 에스에프에이 | 평면디스플레이용 화학 기상 증착장치 |
| CN204474753U (zh) * | 2015-02-10 | 2015-07-15 | 光驰科技(上海)有限公司 | 用于真空系统运动机构的锁紧机构 |
-
2017
- 2017-06-02 KR KR1020170068987A patent/KR101821926B1/ko active IP Right Grant
-
2018
- 2018-05-30 JP JP2018103138A patent/JP6454906B2/ja active Active
- 2018-06-01 CN CN201810553063.8A patent/CN108977771B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108977771A (zh) | 2018-12-11 |
| CN108977771B (zh) | 2021-06-01 |
| KR101821926B1 (ko) | 2018-01-24 |
| JP2018204106A (ja) | 2018-12-27 |
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