JP6448766B2 - 実装装置及び実装方法 - Google Patents
実装装置及び実装方法 Download PDFInfo
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- JP6448766B2 JP6448766B2 JP2017507188A JP2017507188A JP6448766B2 JP 6448766 B2 JP6448766 B2 JP 6448766B2 JP 2017507188 A JP2017507188 A JP 2017507188A JP 2017507188 A JP2017507188 A JP 2017507188A JP 6448766 B2 JP6448766 B2 JP 6448766B2
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- 238000000034 method Methods 0.000 title claims description 57
- 238000003384 imaging method Methods 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 31
- 238000005070 sampling Methods 0.000 claims description 24
- 238000000926 separation method Methods 0.000 claims description 14
- 238000010586 diagram Methods 0.000 description 9
- 230000032258 transport Effects 0.000 description 7
- 230000002411 adverse Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
- H05K13/0853—Determination of transport trajectories inside mounting machines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95121—Active alignment, i.e. by apparatus steering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95136—Aligning the plurality of semiconductor or solid-state bodies involving guiding structures, e.g. shape matching, spacers or supporting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Operations Research (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
所定の特徴部が上面に形成された部品を採取する1以上の採取部材を有し該採取した部品を基板上へ移動させる実装ヘッドと、
前記実装ヘッドと共に移動し前記部品の上面を撮像可能な撮像部と、
前記部品を収容したテープを有するフィーダを装着する装着部と、
前記採取部材と前記撮像部との離間距離よりも、複数配列された前記部品の載置距離が短い状態で、前記部品を前記撮像部により撮像して該部品の位置を認識する認識処理を連続又は一括で行うよう前記実装ヘッド及び前記撮像部を制御する制御部と、
を備えたものである。
Claims (11)
- 所定の特徴部が上面に形成された部品を採取する1以上の採取部材を有し該採取した部品を基板上へ移動させる実装ヘッドと、
前記実装ヘッドと共に移動し前記部品の上面を撮像可能な撮像部と、
前記部品を収容したテープを有するフィーダを装着する装着部と、
前記採取部材と前記撮像部との離間距離よりも、複数配列された前記部品の載置距離が短い状態で、前記部品を前記撮像部により撮像して該部品の位置を認識する認識処理を連続又は一括で行うよう前記実装ヘッド及び前記撮像部を制御する制御部と、
を備えた実装装置。 - 前記実装ヘッドは、2以上の所定数の前記採取部材を有し、
前記装着部は、前記部品を収容した前記所定数以下のフィーダが複数配列して装着されている、請求項1に記載の実装装置。 - 請求項1又は2に記載の実装装置であって、
部品を載置する載置台、を備え、
前記制御部は、前記載置台の上に複数の前記部品を配列させたのち、該載置台上の複数の前記部品を前記撮像部により撮像して該部品の位置を認識する処理を連続又は一括で行う、実装装置。 - 請求項1〜3のいずれか1項に記載の実装装置であって、
部品を載置する載置台、を備え、
前記実装ヘッドは、2以上の所定数の前記採取部材を有し、
前記装着部は、前記部品を収容した前記所定数以下のフィーダが複数配列して装着されており、
前記制御部は、前記配列したフィーダ上で前記部品を前記撮像部により撮像して該部品の位置を認識する処理を連続又は一括で行ったのち、該部品を吸着して前記載置台に配列させ、該載置台上の複数の前記部品を前記撮像部により撮像して該部品の位置を認識する処理を連続又は一括で行う、実装装置。 - 請求項1〜4のいずれか1項に記載の実装装置であって、
前記実装ヘッドが有する所定数の前記採取部材と同数以上の部品を載置可能な載置台、を備えた実装装置。 - 請求項1〜4のいずれか1項に記載の実装装置であって、
前記実装ヘッドが有する所定数の前記採取部材よりも少ない数の部品を載置可能な載置台、を備え、
前記制御部は、前記所定数の前記採取部材のすべてに前記部品を採取させる、実装装置。 - 前記制御部は、前記部品の位置を認識した結果を用いて位置補正を行い、前記採取部材に前記部品を採取させる、請求項1〜6のいずれか1項に記載の実装装置。
- 前記部品は、前記上面側に前記特徴部として発光体が形成されている、請求項1〜6のいずれか1項に記載の実装装置。
- 前記制御部は、前記実装ヘッドが部品を採取し前記基板に実装する間において、所定の特徴部が上面に形成された部品と、所定の特徴部が上面に形成されていない部品とを前記採取部材に採取させる、請求項1〜8のいずれか1項に記載の実装装置。
- 前記制御部は、前記実装ヘッドが部品を採取し前記基板に実装する間において、所定の特徴部が上面に形成された部品をすべての前記採取部材に採取させる、請求項1〜9のいずれか1項に記載の実装装置。
- 所定の特徴部が上面に形成された部品を採取する1以上の採取部材を有し該採取した部品を基板上へ移動させる実装ヘッドと、前記実装ヘッドと共に移動し前記部品の上面を撮像可能な撮像部と、前記部品を収容したテープを有するフィーダを装着する装着部とを備えた実装装置を用いた実装方法であって、
前記採取部材と前記撮像部との離間距離よりも、複数配列された前記部品の載置距離が短い状態で、前記部品を前記撮像部により撮像して該部品の位置を認識する処理を連続又は一括で行うよう前記実装ヘッド及び前記撮像部を制御するステップ、
を含む実装方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2015/058714 WO2016151725A1 (ja) | 2015-03-23 | 2015-03-23 | 実装装置及び実装方法 |
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JPWO2016151725A1 JPWO2016151725A1 (ja) | 2018-01-11 |
JP6448766B2 true JP6448766B2 (ja) | 2019-01-09 |
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Country Status (5)
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US (1) | US10784129B2 (ja) |
EP (1) | EP3277068B1 (ja) |
JP (1) | JP6448766B2 (ja) |
CN (1) | CN107432117B (ja) |
WO (1) | WO2016151725A1 (ja) |
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US10966361B2 (en) * | 2016-04-26 | 2021-03-30 | Fuji Corporation | Machine for performing specified work to a printed circuit board |
WO2018146766A1 (ja) * | 2017-02-09 | 2018-08-16 | 株式会社Fuji | 実装機およびエラー報知方法 |
CN110707025A (zh) * | 2019-10-09 | 2020-01-17 | 深圳市盛世智能装备有限公司 | 一种贴片机的压力输出控制方法及贴片机 |
Family Cites Families (12)
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JP3477321B2 (ja) * | 1996-07-25 | 2003-12-10 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP2000150970A (ja) * | 1998-11-18 | 2000-05-30 | Fuji Photo Film Co Ltd | 発光素子のボンディング方法および装置 |
JP2006202911A (ja) * | 2005-01-19 | 2006-08-03 | Matsushita Electric Ind Co Ltd | 保持具識別装置、部品供給方法、部品実装機 |
JP4811073B2 (ja) * | 2006-03-22 | 2011-11-09 | パナソニック株式会社 | 電子部品実装装置および電子部品実装方法 |
JP4208155B2 (ja) * | 2006-03-27 | 2009-01-14 | パナソニック株式会社 | 実装ヘッド、および電子部品実装装置 |
WO2009072659A1 (en) | 2007-12-03 | 2009-06-11 | Panasonic Corporation | Chip mounting system |
JP4829941B2 (ja) * | 2008-08-22 | 2011-12-07 | ヤマハ発動機株式会社 | 表面実装機 |
JP4834703B2 (ja) * | 2008-08-22 | 2011-12-14 | ヤマハ発動機株式会社 | 表面実装機 |
JP5641889B2 (ja) * | 2010-11-10 | 2014-12-17 | 富士機械製造株式会社 | スプライシング誤作業防止方法 |
JP5445537B2 (ja) * | 2011-08-25 | 2014-03-19 | パナソニック株式会社 | テープフィーダ、部品実装装置及び部品実装方法 |
WO2014076836A1 (ja) * | 2012-11-19 | 2014-05-22 | 富士機械製造株式会社 | 部品実装機および実装検査機 |
JP6153611B2 (ja) * | 2013-06-24 | 2017-06-28 | 富士機械製造株式会社 | 部品実装装置 |
-
2015
- 2015-03-23 EP EP15886280.5A patent/EP3277068B1/en active Active
- 2015-03-23 WO PCT/JP2015/058714 patent/WO2016151725A1/ja active Application Filing
- 2015-03-23 JP JP2017507188A patent/JP6448766B2/ja active Active
- 2015-03-23 US US15/560,538 patent/US10784129B2/en active Active
- 2015-03-23 CN CN201580077934.8A patent/CN107432117B/zh active Active
Also Published As
Publication number | Publication date |
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EP3277068A4 (en) | 2018-02-07 |
US20180114709A1 (en) | 2018-04-26 |
CN107432117B (zh) | 2019-12-03 |
JPWO2016151725A1 (ja) | 2018-01-11 |
EP3277068A1 (en) | 2018-01-31 |
EP3277068B1 (en) | 2019-03-13 |
US10784129B2 (en) | 2020-09-22 |
CN107432117A (zh) | 2017-12-01 |
WO2016151725A1 (ja) | 2016-09-29 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |