JP6446282B2 - 部品実装装置、及び部品実装方法 - Google Patents

部品実装装置、及び部品実装方法 Download PDF

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JP6446282B2
JP6446282B2 JP2015015232A JP2015015232A JP6446282B2 JP 6446282 B2 JP6446282 B2 JP 6446282B2 JP 2015015232 A JP2015015232 A JP 2015015232A JP 2015015232 A JP2015015232 A JP 2015015232A JP 6446282 B2 JP6446282 B2 JP 6446282B2
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hole
unit
head
component mounting
head unit
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JP2015015232A
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Japanese (ja)
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JP2016139750A (ja
Inventor
伊藤　弘朗
弘朗 伊藤
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Juki Corp
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Juki Corp
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Priority to JP2015015232A priority Critical patent/JP6446282B2/ja
Priority to CN201610065386.3A priority patent/CN105848462B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
JP2015015232A 2015-01-29 2015-01-29 部品実装装置、及び部品実装方法 Active JP6446282B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015015232A JP6446282B2 (ja) 2015-01-29 2015-01-29 部品実装装置、及び部品実装方法
CN201610065386.3A CN105848462B (zh) 2015-01-29 2016-01-29 部件安装装置及部件安装方法

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Application Number Priority Date Filing Date Title
JP2015015232A JP6446282B2 (ja) 2015-01-29 2015-01-29 部品実装装置、及び部品実装方法

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JP2016139750A JP2016139750A (ja) 2016-08-04
JP6446282B2 true JP6446282B2 (ja) 2018-12-26

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JP2015015232A Active JP6446282B2 (ja) 2015-01-29 2015-01-29 部品実装装置、及び部品実装方法

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JP (1) JP6446282B2 (zh)
CN (1) CN105848462B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202003712WA (en) * 2017-08-28 2020-05-28 Shinkawa Kk Device and method for linearly moving first and second moving bodies relative to target object
TWI686881B (zh) * 2017-08-28 2020-03-01 日商新川股份有限公司 相對於對象物使移動體直線移動的裝置以及方法
CN108286364B (zh) * 2018-01-17 2020-02-18 深圳绿米联创科技有限公司 门锁安装辅助方法及装置
CN111801993B (zh) * 2018-03-13 2021-10-15 株式会社富士 安装装置以及安装方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071891A (ja) * 2002-08-07 2004-03-04 Matsushita Electric Ind Co Ltd 部品実装装置
JP4046030B2 (ja) * 2002-08-30 2008-02-13 株式会社村田製作所 部品装着方法および部品装着装置
JP4903627B2 (ja) * 2007-04-24 2012-03-28 Ｊｕｋｉ株式会社 表面実装機、及び、そのカメラ位置補正方法
JP5471131B2 (ja) * 2009-07-31 2014-04-16 日本電気株式会社 電子部品実装装置および電子部品実装装置におけるカメラ位置補正方法
JP6159124B2 (ja) * 2013-04-04 2017-07-05 ヤマハ発動機株式会社 部品実装装置

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JP2016139750A (ja) 2016-08-04
CN105848462A (zh) 2016-08-10
CN105848462B (zh) 2020-03-06

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