JP6442668B2 - プローブピンおよびｉｃソケット - Google Patents
プローブピンおよびｉｃソケット Download PDFInfo
- Publication number
- JP6442668B2 JP6442668B2 JP2014195894A JP2014195894A JP6442668B2 JP 6442668 B2 JP6442668 B2 JP 6442668B2 JP 2014195894 A JP2014195894 A JP 2014195894A JP 2014195894 A JP2014195894 A JP 2014195894A JP 6442668 B2 JP6442668 B2 JP 6442668B2
- Authority
- JP
- Japan
- Prior art keywords
- coil spring
- movable member
- probe pin
- auxiliary
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims description 165
- 239000000758 substrate Substances 0.000 claims description 74
- 238000004804 winding Methods 0.000 claims description 48
- 238000007689 inspection Methods 0.000 claims description 25
- 238000005259 measurement Methods 0.000 claims description 19
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 16
- 238000012986 modification Methods 0.000 description 16
- 230000004048 modification Effects 0.000 description 16
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014195894A JP6442668B2 (ja) | 2014-04-21 | 2014-09-25 | プローブピンおよびｉｃソケット |
| KR1020167031384A KR101894965B1 (ko) | 2014-04-21 | 2015-04-09 | 프로브 핀 및 ic 소켓 |
| PCT/JP2015/061171 WO2015163160A1 (ja) | 2014-04-21 | 2015-04-09 | プローブピンおよびｉｃソケット |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014087081 | 2014-04-21 | ||
| JP2014087081 | 2014-04-21 | ||
| JP2014195894A JP6442668B2 (ja) | 2014-04-21 | 2014-09-25 | プローブピンおよびｉｃソケット |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015215327A JP2015215327A (ja) | 2015-12-03 |
| JP2015215327A5 JP2015215327A5 (enExample) | 2017-11-02 |
| JP6442668B2 true JP6442668B2 (ja) | 2018-12-26 |
Family
ID=54752325
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014195894A Expired - Fee Related JP6442668B2 (ja) | 2014-04-21 | 2014-09-25 | プローブピンおよびｉｃソケット |
| JP2014195895A Pending JP2015215328A (ja) | 2014-04-21 | 2014-09-25 | プローブピンおよびｉｃソケット |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014195895A Pending JP2015215328A (ja) | 2014-04-21 | 2014-09-25 | プローブピンおよびｉｃソケット |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JP6442668B2 (enExample) |
| KR (1) | KR101894965B1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6837283B2 (ja) | 2016-02-29 | 2021-03-03 | 株式会社ヨコオ | ソケット |
| KR101819191B1 (ko) * | 2016-07-20 | 2018-01-16 | 주식회사 마이크로컨텍솔루션 | 컨택트 프로브 |
| JP7021874B2 (ja) * | 2017-06-28 | 2022-02-17 | 株式会社ヨコオ | コンタクトプローブ及び検査治具 |
| JP7024275B2 (ja) * | 2017-09-19 | 2022-02-24 | 日本電産リード株式会社 | 接触端子、検査治具、及び検査装置 |
| JP7141796B2 (ja) * | 2018-09-26 | 2022-09-26 | 株式会社エンプラス | コンタクトピン及びソケット |
| JP6837513B2 (ja) * | 2019-05-07 | 2021-03-03 | 株式会社ヨコオ | ソケット |
| JP7130247B2 (ja) * | 2019-05-31 | 2022-09-05 | 共進電機株式会社 | プローブ及び太陽電池セル用測定装置 |
| KR102182784B1 (ko) * | 2019-05-31 | 2020-11-25 | 주식회사 오킨스전자 | Ｍｅｍｓ 켈빈 스프링 핀, 및 이를 이용한 켈빈 테스트 소켓 |
| KR102162476B1 (ko) * | 2019-07-18 | 2020-10-06 | 박상량 | 단일 몸체의 하우징으로 구성되는 고성능 반도체 테스트 소켓 |
| KR102147699B1 (ko) * | 2020-04-29 | 2020-08-26 | (주)피티앤케이 | 프로브 핀 및 이의 제조 방법 |
| KR102456449B1 (ko) * | 2020-08-11 | 2022-10-20 | 리노공업주식회사 | 검사 프로브 |
| KR102202827B1 (ko) * | 2020-10-27 | 2021-01-14 | (주) 네스텍코리아 | 프로브 핀 및 이를 적용한 동축 프로브 조립체 |
| JP2023107531A (ja) * | 2022-01-24 | 2023-08-03 | Ｉ－Ｐｅｘ株式会社 | プローブ |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3326095B2 (ja) * | 1996-12-27 | 2002-09-17 | 日本発条株式会社 | 導電性接触子 |
| JP2003307542A (ja) * | 2002-02-18 | 2003-10-31 | Tokyo Cosmos Electric Co Ltd | Ｉｃソケット |
| JP4089976B2 (ja) * | 2004-05-17 | 2008-05-28 | リーノ アイエヌディー．インコーポレイテッド | 大電流用プローブ |
| JP2007048576A (ja) * | 2005-08-09 | 2007-02-22 | Yamaichi Electronics Co Ltd | アダプタソケット |
| JP5067790B2 (ja) * | 2007-04-27 | 2012-11-07 | センサータ テクノロジーズ マサチューセッツ インコーポレーテッド | プローブピンおよびそれを用いたソケット |
| WO2008136396A1 (ja) * | 2007-04-27 | 2008-11-13 | Nhk Spring Co., Ltd. | 導電性接触子 |
| JP4900843B2 (ja) * | 2008-12-26 | 2012-03-21 | 山一電機株式会社 | 半導体装置用電気接続装置及びそれに使用されるコンタクト |
| JP5624746B2 (ja) | 2009-10-23 | 2014-11-12 | 株式会社ヨコオ | コンタクトプローブ及びソケット |
| KR101154519B1 (ko) * | 2010-05-27 | 2012-06-13 | 하이콘 주식회사 | 스프링 콘택트 구조 |
| JP5503477B2 (ja) | 2010-09-13 | 2014-05-28 | シチズンセイミツ株式会社 | コンタクトプローブ及びこれを用いた電子回路試験装置 |
| JP5858781B2 (ja) * | 2011-12-29 | 2016-02-10 | 株式会社エンプラス | プローブピン及び電気部品用ソケット |
| JP6011103B2 (ja) * | 2012-07-23 | 2016-10-19 | 山一電機株式会社 | コンタクトプローブ及びそれを備えた半導体素子用ソケット |
-
2014
- 2014-09-25 JP JP2014195894A patent/JP6442668B2/ja not_active Expired - Fee Related
- 2014-09-25 JP JP2014195895A patent/JP2015215328A/ja active Pending
-
2015
- 2015-04-09 KR KR1020167031384A patent/KR101894965B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR101894965B1 (ko) | 2018-09-05 |
| KR20170020314A (ko) | 2017-02-22 |
| JP2015215328A (ja) | 2015-12-03 |
| JP2015215327A (ja) | 2015-12-03 |
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