JP6395573B2 - 基板への接着テープ貼り付け装置及び貼り付け方法 - Google Patents

基板への接着テープ貼り付け装置及び貼り付け方法 Download PDF

Info

Publication number
JP6395573B2
JP6395573B2 JP2014238318A JP2014238318A JP6395573B2 JP 6395573 B2 JP6395573 B2 JP 6395573B2 JP 2014238318 A JP2014238318 A JP 2014238318A JP 2014238318 A JP2014238318 A JP 2014238318A JP 6395573 B2 JP6395573 B2 JP 6395573B2
Authority
JP
Japan
Prior art keywords
adhesive tape
substrate
cut
wafer
original
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014238318A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016100543A (ja
JP2016100543A5 (enExample
Inventor
隆樹 谷川
隆樹 谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takatori Corp
Original Assignee
Takatori Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takatori Corp filed Critical Takatori Corp
Priority to JP2014238318A priority Critical patent/JP6395573B2/ja
Publication of JP2016100543A publication Critical patent/JP2016100543A/ja
Publication of JP2016100543A5 publication Critical patent/JP2016100543A5/ja
Application granted granted Critical
Publication of JP6395573B2 publication Critical patent/JP6395573B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2014238318A 2014-11-26 2014-11-26 基板への接着テープ貼り付け装置及び貼り付け方法 Expired - Fee Related JP6395573B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014238318A JP6395573B2 (ja) 2014-11-26 2014-11-26 基板への接着テープ貼り付け装置及び貼り付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014238318A JP6395573B2 (ja) 2014-11-26 2014-11-26 基板への接着テープ貼り付け装置及び貼り付け方法

Publications (3)

Publication Number Publication Date
JP2016100543A JP2016100543A (ja) 2016-05-30
JP2016100543A5 JP2016100543A5 (enExample) 2018-02-01
JP6395573B2 true JP6395573B2 (ja) 2018-09-26

Family

ID=56078045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014238318A Expired - Fee Related JP6395573B2 (ja) 2014-11-26 2014-11-26 基板への接着テープ貼り付け装置及び貼り付け方法

Country Status (1)

Country Link
JP (1) JP6395573B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108470692B (zh) * 2017-02-23 2023-08-18 日东电工株式会社 粘合带粘贴方法和粘合带粘贴装置
JP7355568B2 (ja) * 2019-09-17 2023-10-03 株式会社ディスコ ウエーハの加工方法
CN112201600B (zh) * 2020-10-14 2024-03-08 北京中科镭特电子有限公司 一种晶圆劈裂扩片装置及晶圆裂片扩片方法
JP7781008B2 (ja) * 2022-03-30 2025-12-05 株式会社ディスコ はみ出し部除去機構及びエキスパンド装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3021645U (ja) * 1995-08-12 1996-02-27 リンテック株式会社 半導体製造工程用粘着シート
JP4637057B2 (ja) * 2006-05-25 2011-02-23 リンテック株式会社 シート貼付装置及び貼付方法
KR101006526B1 (ko) * 2008-10-22 2011-01-07 주식회사 하이닉스반도체 웨이퍼 마운트 테이프, 이를 이용한 웨이퍼 가공 장치 및 방법
JP4845063B2 (ja) * 2009-12-18 2011-12-28 古河電気工業株式会社 ウエハ加工用テープ及びその製造方法
JP6007071B2 (ja) * 2012-11-07 2016-10-12 リンテック株式会社 刃型、接着シート製造装置、剥離方法および接着シート製造方法

Also Published As

Publication number Publication date
JP2016100543A (ja) 2016-05-30

Similar Documents

Publication Publication Date Title
JP4326519B2 (ja) 保護テープ剥離方法およびこれを用いた装置
TWI408740B (zh) 保護帶剝離方法及使用此方法之裝置
JP3956084B2 (ja) 半導体ウェーハへのダイボンドテープ貼り付け方法及び装置
JP5750632B2 (ja) 基板へのシート貼付装置
JP5273791B2 (ja) 基板への接着テープ貼り付け装置
JP6247075B2 (ja) 保護テープ剥離方法および保護テープ剥離装置
JP4417028B2 (ja) ダイシングフレームへのダイシングテープの貼り付け装置
JP5055509B2 (ja) 基板への接着シートの貼付け装置
JP2013153146A (ja) 樹脂封止方法及び樹脂封止装置
JP6395573B2 (ja) 基板への接着テープ貼り付け装置及び貼り付け方法
JP2013219087A (ja) 保護テープ剥離方法および保護テープ剥離装置
JP2012028591A5 (enExample)
JP2014133616A (ja) 粘着テープ接合方法および粘着テープ接合装置
JP2001319906A (ja) ウエハ表面保護テープの剥離装置
JP2004047976A (ja) 保護テープ貼付方法およびその装置
CN103579066B (zh) 半导体晶圆的固定方法及半导体晶圆的固定装置
JP5714318B2 (ja) ウエハマウント作製方法
JP2006159488A (ja) フィルム貼着装置およびフィルム貼着方法
JP4988640B2 (ja) シート貼付装置及び貼付方法
JP4953738B2 (ja) 粘着テープ切断方法およびこれを用いた粘着テープ貼付け装置
JP2010062270A5 (enExample)
JP2010147123A (ja) シート剥離装置及び剥離方法
JP2005314100A (ja) 貼付装置
TW200952091A (en) Method of picking-up device having adhesive film mounted thereon
JP5159650B2 (ja) シート貼付装置および貼付方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20171030

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171207

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180711

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180806

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180828

R150 Certificate of patent or registration of utility model

Ref document number: 6395573

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees