JP6392784B2 - 積層型電子部品およびその実装構造体 - Google Patents

積層型電子部品およびその実装構造体 Download PDF

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Publication number
JP6392784B2
JP6392784B2 JP2015554973A JP2015554973A JP6392784B2 JP 6392784 B2 JP6392784 B2 JP 6392784B2 JP 2015554973 A JP2015554973 A JP 2015554973A JP 2015554973 A JP2015554973 A JP 2015554973A JP 6392784 B2 JP6392784 B2 JP 6392784B2
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Japan
Prior art keywords
main body
bonding member
pair
electronic component
substrate
Prior art date
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JP2015554973A
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English (en)
Japanese (ja)
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JPWO2015098990A1 (ja
Inventor
西村　道明
道明 西村
泰尚 重永
泰尚 重永
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Kyocera Corp
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Kyocera Corp
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Publication of JPWO2015098990A1 publication Critical patent/JPWO2015098990A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2015554973A 2013-12-24 2014-12-24 積層型電子部品およびその実装構造体 Active JP6392784B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2013265494 2013-12-24
JP2013265494 2013-12-24
JP2013267388 2013-12-25
JP2013267388 2013-12-25
JP2014014433 2014-01-29
JP2014014433 2014-01-29
JP2014027602 2014-02-17
JP2014027602 2014-02-17
PCT/JP2014/084199 WO2015098990A1 (ja) 2013-12-24 2014-12-24 積層型電子部品およびその実装構造体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018122445A Division JP2018186283A (ja) 2013-12-24 2018-06-27 積層型電子部品およびその実装構造体

Publications (2)

Publication Number Publication Date
JPWO2015098990A1 JPWO2015098990A1 (ja) 2017-03-23
JP6392784B2 true JP6392784B2 (ja) 2018-09-19

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JP2015554973A Active JP6392784B2 (ja) 2013-12-24 2014-12-24 積層型電子部品およびその実装構造体
JP2018122445A Pending JP2018186283A (ja) 2013-12-24 2018-06-27 積層型電子部品およびその実装構造体

Family Applications After (1)

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JP2018122445A Pending JP2018186283A (ja) 2013-12-24 2018-06-27 積層型電子部品およびその実装構造体

Country Status (4)

Country Link
US (1) US9877393B2 (zh)
JP (2) JP6392784B2 (zh)
CN (1) CN105849835B (zh)
WO (1) WO2015098990A1 (zh)

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JP6392784B2 (ja) * 2013-12-24 2018-09-19 京セラ株式会社 積層型電子部品およびその実装構造体
US10204737B2 (en) * 2014-06-11 2019-02-12 Avx Corporation Low noise capacitors
JP6524734B2 (ja) * 2015-03-19 2019-06-05 株式会社村田製作所 電子部品およびこれを備えた電子部品連
CN112908693B (zh) 2016-12-01 2022-10-21 株式会社村田制作所 芯片型电子部件
DE102017109712A1 (de) * 2017-05-05 2018-11-08 Avl Software And Functions Gmbh Bestimmung akustischer Störsignale in elektrischen Schaltungen
US10658118B2 (en) * 2018-02-13 2020-05-19 Samsung Electro-Mechanics Co., Ltd. Electronic component and board having the same
CN110312359A (zh) * 2018-03-27 2019-10-08 联发科技股份有限公司 用来降低电容器噪音的装置与方法
JP7089426B2 (ja) 2018-07-23 2022-06-22 太陽誘電株式会社 積層セラミック電子部品、積層セラミック電子部品の製造方法及び電子部品内蔵基板
JP7292958B2 (ja) 2019-04-26 2023-06-19 株式会社村田製作所 電子部品の実装構造体
JP7451103B2 (ja) * 2019-07-31 2024-03-18 株式会社村田製作所 チップ型電子部品、電子部品の実装構造体および電子部品連
JP2022061644A (ja) 2020-10-07 2022-04-19 株式会社村田製作所 積層セラミックコンデンサの製造方法
JP2022061645A (ja) 2020-10-07 2022-04-19 株式会社村田製作所 積層セラミックコンデンサ
JP2022061638A (ja) * 2020-10-07 2022-04-19 株式会社村田製作所 積層セラミックコンデンサ
JP2022061640A (ja) 2020-10-07 2022-04-19 株式会社村田製作所 積層セラミックコンデンサ
JP2022061643A (ja) 2020-10-07 2022-04-19 株式会社村田製作所 積層セラミックコンデンサ
JP2022061639A (ja) 2020-10-07 2022-04-19 株式会社村田製作所 積層セラミックコンデンサ
JP2022061641A (ja) 2020-10-07 2022-04-19 株式会社村田製作所 積層セラミックコンデンサ
JP7444048B2 (ja) * 2020-12-22 2024-03-06 株式会社村田製作所 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法
JP2022177518A (ja) 2021-05-18 2022-12-01 株式会社村田製作所 積層セラミックコンデンサ
JP2023044006A (ja) * 2021-09-17 2023-03-30 株式会社村田製作所 電子部品

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JP6392784B2 (ja) * 2013-12-24 2018-09-19 京セラ株式会社 積層型電子部品およびその実装構造体

Also Published As

Publication number Publication date
US9877393B2 (en) 2018-01-23
JPWO2015098990A1 (ja) 2017-03-23
US20170042029A1 (en) 2017-02-09
CN105849835B (zh) 2019-05-07
WO2015098990A1 (ja) 2015-07-02
CN105849835A (zh) 2016-08-10
JP2018186283A (ja) 2018-11-22

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