JP6373605B2 - 配線基板、及び、配線基板の製造方法 - Google Patents

配線基板、及び、配線基板の製造方法 Download PDF

Info

Publication number
JP6373605B2
JP6373605B2 JP2014043317A JP2014043317A JP6373605B2 JP 6373605 B2 JP6373605 B2 JP 6373605B2 JP 2014043317 A JP2014043317 A JP 2014043317A JP 2014043317 A JP2014043317 A JP 2014043317A JP 6373605 B2 JP6373605 B2 JP 6373605B2
Authority
JP
Japan
Prior art keywords
hole
wiring board
shape
core layer
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014043317A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015170669A5 (https=
JP2015170669A (ja
Inventor
泰彦 草間
泰彦 草間
秀行 田光
秀行 田光
謙治 川井
謙治 川井
文久 宮坂
文久 宮坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014043317A priority Critical patent/JP6373605B2/ja
Priority to US14/634,972 priority patent/US9560768B2/en
Publication of JP2015170669A publication Critical patent/JP2015170669A/ja
Publication of JP2015170669A5 publication Critical patent/JP2015170669A5/ja
Application granted granted Critical
Publication of JP6373605B2 publication Critical patent/JP6373605B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2014043317A 2014-03-05 2014-03-05 配線基板、及び、配線基板の製造方法 Active JP6373605B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014043317A JP6373605B2 (ja) 2014-03-05 2014-03-05 配線基板、及び、配線基板の製造方法
US14/634,972 US9560768B2 (en) 2014-03-05 2015-03-02 Wiring substrate and method of making wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014043317A JP6373605B2 (ja) 2014-03-05 2014-03-05 配線基板、及び、配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2015170669A JP2015170669A (ja) 2015-09-28
JP2015170669A5 JP2015170669A5 (https=) 2017-02-09
JP6373605B2 true JP6373605B2 (ja) 2018-08-15

Family

ID=54018869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014043317A Active JP6373605B2 (ja) 2014-03-05 2014-03-05 配線基板、及び、配線基板の製造方法

Country Status (2)

Country Link
US (1) US9560768B2 (https=)
JP (1) JP6373605B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6639934B2 (ja) * 2016-02-08 2020-02-05 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP2017175000A (ja) * 2016-03-24 2017-09-28 ローム株式会社 電子部品およびその製造方法、ならびに、インターポーザ
JP6748501B2 (ja) * 2016-07-14 2020-09-02 ローム株式会社 電子部品およびその製造方法
JP6997670B2 (ja) * 2018-04-23 2022-01-17 新光電気工業株式会社 配線基板及びその製造方法
CN112201652A (zh) * 2019-07-07 2021-01-08 深南电路股份有限公司 线路板及其制作方法
KR102789025B1 (ko) * 2019-12-16 2025-04-01 삼성전기주식회사 전자부품 내장기판
CN113571491B (zh) * 2021-06-18 2026-03-24 日月光半导体制造股份有限公司 半导体结构及其制造方法
CN121532036A (zh) * 2024-08-05 2026-02-13 华为技术有限公司 埋嵌框架、内埋基板及制备方法、电源装置及电子设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7876577B2 (en) * 2007-03-12 2011-01-25 Tyco Electronics Corporation System for attaching electronic components to molded interconnection devices
JP5001395B2 (ja) 2010-03-31 2012-08-15 イビデン株式会社 配線板及び配線板の製造方法
JP2012079994A (ja) * 2010-10-05 2012-04-19 Yamaichi Electronics Co Ltd 部品内蔵プリント配線板およびその製造方法
JP2012164952A (ja) * 2011-01-20 2012-08-30 Ibiden Co Ltd 電子部品内蔵配線板及びその製造方法
JP5600803B2 (ja) 2011-05-13 2014-10-01 イビデン株式会社 配線板及びその製造方法
US8957320B2 (en) * 2011-10-11 2015-02-17 Ibiden Co., Ltd. Printed wiring board
US9439289B2 (en) * 2012-01-12 2016-09-06 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
JP6029342B2 (ja) * 2012-06-15 2016-11-24 新光電気工業株式会社 配線基板及びその製造方法
KR102080663B1 (ko) * 2013-07-15 2020-02-24 삼성전기주식회사 전자소자 내장형 인쇄회로기판 및 그 제조방법
JP5462404B1 (ja) * 2013-09-12 2014-04-02 太陽誘電株式会社 部品内蔵基板及び部品内蔵基板用コア基材
JP2015159153A (ja) * 2014-02-21 2015-09-03 イビデン株式会社 電子部品内蔵多層配線板
JP6334962B2 (ja) * 2014-03-05 2018-05-30 新光電気工業株式会社 配線基板、及び、配線基板の製造方法
JP2015185828A (ja) * 2014-03-26 2015-10-22 イビデン株式会社 電子部品内蔵多層配線板およびその製造方法
JP2015220281A (ja) * 2014-05-15 2015-12-07 イビデン株式会社 プリント配線板

Also Published As

Publication number Publication date
JP2015170669A (ja) 2015-09-28
US9560768B2 (en) 2017-01-31
US20150257275A1 (en) 2015-09-10

Similar Documents

Publication Publication Date Title
JP6373605B2 (ja) 配線基板、及び、配線基板の製造方法
JP6334962B2 (ja) 配線基板、及び、配線基板の製造方法
JP5715009B2 (ja) 部品内蔵配線基板及びその製造方法
US9161453B2 (en) Wiring board and method of manufacturing the same
KR102100209B1 (ko) 배선 기판
JP6478306B2 (ja) 電子部品組込み基板及びその製造方法
JP2014131037A (ja) 回路基板及びその製造方法
JP5655244B2 (ja) 配線基板およびその製造方法、並びに半導体装置およびその製造方法
JP5462404B1 (ja) 部品内蔵基板及び部品内蔵基板用コア基材
JP2014110423A (ja) 電子部品組込み基板及びその製造方法
JP2012099610A5 (https=)
JP2007048976A (ja) プリント回路板、およびプリント回路板を備えた電子機器
JP6743287B2 (ja) 配線基板及びその製造方法
JP5412002B1 (ja) 部品内蔵基板
US11096285B2 (en) Electronic circuit substrate
KR20140039993A (ko) 배선 기판
JP2011155199A (ja) 回路実装基板
KR101622895B1 (ko) 배선기판 및 그 제조방법
JP2013058619A (ja) 部品内蔵配線基板及びその製造方法
KR101320973B1 (ko) 집적회로 소자 패키지 및 이의 제조 방법
JP2013168520A (ja) 電子装置
JP2007027527A (ja) 基板及びその製造方法
CN213586442U (zh) 电子线路总成
JP6068167B2 (ja) 配線基板およびその製造方法
JP6892281B2 (ja) 配線基板およびその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161226

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20161226

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170921

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171031

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171225

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180508

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180621

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180703

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180718

R150 Certificate of patent or registration of utility model

Ref document number: 6373605

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150