JP6338895B2 - 電気又は電子装置 - Google Patents
電気又は電子装置 Download PDFInfo
- Publication number
- JP6338895B2 JP6338895B2 JP2014048689A JP2014048689A JP6338895B2 JP 6338895 B2 JP6338895 B2 JP 6338895B2 JP 2014048689 A JP2014048689 A JP 2014048689A JP 2014048689 A JP2014048689 A JP 2014048689A JP 6338895 B2 JP6338895 B2 JP 6338895B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- housing
- circuit board
- printed circuit
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 claims description 34
- 239000006071 cream Substances 0.000 claims description 27
- 238000005476 soldering Methods 0.000 claims description 22
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 description 57
- 239000000306 component Substances 0.000 description 37
- 238000000034 method Methods 0.000 description 35
- 230000017525 heat dissipation Effects 0.000 description 11
- 239000011135 tin Substances 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229910052718 tin Inorganic materials 0.000 description 7
- 230000003321 amplification Effects 0.000 description 6
- 238000003199 nucleic acid amplification method Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000008358 core component Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
Claims (1)
- 電気又は電子装置であって、
外面が前記電気又は電子装置の全体の外観を形成して外部に露出され、内部が空であるハウジングと、
上面部、下面部及び高熱を発生する高熱発生部品が装着される部位を有し、前記上面部に前記高熱発生部品以外の他の電気・電子部品が半田付けして装着されるとともに前記下面部が前記ハウジングの内部の予め定められた部分に付着されるプリント回路基板と、を含み、
前記プリント回路基板の下面部と前記ハウジングの予め定められた部分との間には、半田クリームの溶融及び硬化により前記プリント回路基板を前記ハウジングに密着して付着するための半田層が形成され、
前記半田クリームは、前記他の電気・電子部品を前記プリント回路基板に半田付けする際に使用される鉛に比べて低い溶融点を有し、
前記プリント回路基板の前記高熱発生部品が装着される部位には、貫通孔が設けられ、
前記高熱発生部品は前記貫通孔内に設置され、前記高熱発生部品の一面は前記貫通孔を通じて直接前記ハウジングに半田付けされる、
ことを特徴とする電気又は電子装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0005686 | 2008-01-18 | ||
KR1020080005686A KR20090079595A (ko) | 2008-01-18 | 2008-01-18 | 인쇄 회로 기판의 장착 방법 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010543058A Division JP2011512025A (ja) | 2008-01-18 | 2009-01-16 | プリント回路基板の装着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014132680A JP2014132680A (ja) | 2014-07-17 |
JP6338895B2 true JP6338895B2 (ja) | 2018-06-06 |
Family
ID=40875664
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010543058A Pending JP2011512025A (ja) | 2008-01-18 | 2009-01-16 | プリント回路基板の装着方法 |
JP2014048689A Active JP6338895B2 (ja) | 2008-01-18 | 2014-03-12 | 電気又は電子装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010543058A Pending JP2011512025A (ja) | 2008-01-18 | 2009-01-16 | プリント回路基板の装着方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9254531B2 (ja) |
JP (2) | JP2011512025A (ja) |
KR (1) | KR20090079595A (ja) |
CN (1) | CN101978797B (ja) |
WO (1) | WO2009091219A2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090079595A (ko) | 2008-01-18 | 2009-07-22 | 주식회사 케이엠더블유 | 인쇄 회로 기판의 장착 방법 |
CN102355797B (zh) * | 2011-10-18 | 2013-07-31 | 武汉凡谷电子技术股份有限公司 | 一种金属基板与印制板烧结工艺 |
US8870051B2 (en) | 2012-05-03 | 2014-10-28 | International Business Machines Corporation | Flip chip assembly apparatus employing a warpage-suppressor assembly |
CN103464852B (zh) * | 2013-07-10 | 2015-10-07 | 南京信息职业技术学院 | 一种电子器件三维回流焊方法 |
US9706662B2 (en) | 2015-06-30 | 2017-07-11 | Raytheon Company | Adaptive interposer and electronic apparatus |
US9648729B1 (en) | 2015-11-20 | 2017-05-09 | Raytheon Company | Stress reduction interposer for ceramic no-lead surface mount electronic device |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5683051A (en) * | 1979-12-11 | 1981-07-07 | Matsushita Electric Ind Co Ltd | Semiconductor device |
JPS6125222A (ja) * | 1984-07-13 | 1986-02-04 | Ricoh Co Ltd | 温度制御装置 |
JPH0334497A (ja) * | 1989-06-30 | 1991-02-14 | Taiyo Yuden Co Ltd | ハイブリッドicの半田付け方法 |
JP3021552B2 (ja) | 1990-06-12 | 2000-03-15 | 富士電機株式会社 | パルス移相装置 |
JPH0446591U (ja) * | 1990-08-27 | 1992-04-21 | ||
US5155904A (en) * | 1991-04-03 | 1992-10-20 | Compaq Computer Corporation | Reflow and wave soldering techniques for bottom side components |
JP3063924B2 (ja) | 1991-06-28 | 2000-07-12 | 株式会社ユアサコーポレーション | 薄形電池 |
JPH0513061U (ja) * | 1991-07-30 | 1993-02-19 | シヤープ株式会社 | 電力半導体装置 |
DE69227522T2 (de) * | 1992-05-20 | 1999-05-06 | Seiko Epson Corp | Kassette für eine elektronische vorrichtung |
JP2734318B2 (ja) * | 1992-10-09 | 1998-03-30 | 太陽誘電株式会社 | 混成集積回路装置の製造方法 |
KR100247898B1 (ko) | 1995-05-30 | 2000-03-15 | 구라우치 노리타카 | 전자부품 |
JPH0951183A (ja) | 1995-05-30 | 1997-02-18 | Sumitomo Electric Ind Ltd | 電子部品 |
JPH10189803A (ja) * | 1996-12-27 | 1998-07-21 | Nippon Inter Electronics Corp | 放熱板への絶縁基板取付構造 |
KR200325539Y1 (ko) * | 1997-12-30 | 2004-02-05 | 엘지정보통신주식회사 | 인쇄회로기판 방열 구조 |
US6276593B1 (en) * | 1999-07-12 | 2001-08-21 | Agere Systems Guardian Corp. | Apparatus and method for solder attachment of high powered transistors to base heatsink |
JP2001237585A (ja) * | 2000-02-22 | 2001-08-31 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
JP2004087594A (ja) * | 2002-08-23 | 2004-03-18 | Alps Electric Co Ltd | 電子回路ユニットの放熱構造 |
JP4457739B2 (ja) * | 2004-04-21 | 2010-04-28 | 株式会社村田製作所 | 電子部品およびその製造方法 |
JP2006041240A (ja) * | 2004-07-28 | 2006-02-09 | Yutaka Denki Seisakusho:Kk | 放熱性に優れたプリント配線板およびその製造方法、使用方法 |
US7479039B2 (en) * | 2004-08-06 | 2009-01-20 | Super Talent Electronics, Inc. | Manufacturing process for a super-digital (SD) flash card with slanted asymmetric circuit board |
DE102005013762C5 (de) * | 2005-03-22 | 2012-12-20 | Sew-Eurodrive Gmbh & Co. Kg | Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters |
KR200394682Y1 (ko) * | 2005-06-07 | 2005-09-05 | 김재용 | 인쇄회로기판 |
JP2007180457A (ja) | 2005-12-28 | 2007-07-12 | Toyota Industries Corp | 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置 |
KR20090079595A (ko) | 2008-01-18 | 2009-07-22 | 주식회사 케이엠더블유 | 인쇄 회로 기판의 장착 방법 |
-
2008
- 2008-01-18 KR KR1020080005686A patent/KR20090079595A/ko active Search and Examination
-
2009
- 2009-01-16 JP JP2010543058A patent/JP2011512025A/ja active Pending
- 2009-01-16 WO PCT/KR2009/000257 patent/WO2009091219A2/ko active Application Filing
- 2009-01-16 CN CN200980110112XA patent/CN101978797B/zh active Active
- 2009-01-21 US US12/356,931 patent/US9254531B2/en active Active
-
2014
- 2014-03-12 JP JP2014048689A patent/JP6338895B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
WO2009091219A2 (ko) | 2009-07-23 |
JP2014132680A (ja) | 2014-07-17 |
WO2009091219A3 (ko) | 2009-10-22 |
KR20090079595A (ko) | 2009-07-22 |
CN101978797B (zh) | 2013-06-19 |
JP2011512025A (ja) | 2011-04-14 |
US20090184155A1 (en) | 2009-07-23 |
CN101978797A (zh) | 2011-02-16 |
US9254531B2 (en) | 2016-02-09 |
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