JP2014132680A - 電気又は電子装置 - Google Patents
電気又は電子装置 Download PDFInfo
- Publication number
- JP2014132680A JP2014132680A JP2014048689A JP2014048689A JP2014132680A JP 2014132680 A JP2014132680 A JP 2014132680A JP 2014048689 A JP2014048689 A JP 2014048689A JP 2014048689 A JP2014048689 A JP 2014048689A JP 2014132680 A JP2014132680 A JP 2014132680A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- housing
- substrate
- solder cream
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims abstract description 53
- 229910000679 solder Inorganic materials 0.000 claims abstract description 37
- 239000006071 cream Substances 0.000 claims abstract description 33
- 238000002844 melting Methods 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 13
- 238000005476 soldering Methods 0.000 claims description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 abstract description 62
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000010292 electrical insulation Methods 0.000 abstract 1
- 239000000306 component Substances 0.000 description 36
- 230000017525 heat dissipation Effects 0.000 description 12
- 239000011135 tin Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 229910052718 tin Inorganic materials 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 230000003321 amplification Effects 0.000 description 6
- 238000003199 nucleic acid amplification method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000008358 core component Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
【解決手段】本発明は、プリント回路基板の装着方法に関するものであって、基板の下面で絶縁が要求される部分を除いた所定の部分に半田クリームを提供するステップと、基板を当該基板が装着されるハウジングの装着部分に実装するステップと、基板下面の半田クリームを溶融及び硬化して基板をハウジングに固定結合するステップとを有する。
【選択図】図3
Description
Claims (7)
- プリント回路基板の装着方法であって、
前記回路基板が装着されるハウジングの装着部分において、絶縁が要求される部分に対応して凹溝状の絶縁パターンを予め形成するステップと、
前記回路基板の下面で絶縁が要求される部分を除いた所定の部分に半田クリームを提供するステップと、
前記回路基板を該回路基板が装着されるハウジングの装着部分に実装するステップと、
前記回路基板の下面の半田クリームを溶融及び硬化して前記回路基板を前記ハウジングに固定結合するステップと、
を有し、
前記回路基板には、SMD部品及び、リード部品の集積回路チップ及び他の電気、電子部品が実装され、金属性回路パターンがプリントされ、
前記ハウジングは、電気、電子装備の全体の外観を形成することを特徴とする装着方法。 - 前記回路基板が装着されるハウジングは、前記回路基板と直接半田付けが可能なように所定の部分にメッキすることを特徴とする請求項1に記載の装着方法。
- 前記半田クリームは、前記回路基板の部品半田付け時に使用されることに比べてより低い溶融点を有することを特徴とする請求項1または2に記載の装着方法。
- 前記回路基板の下面の半田クリームを溶融及び硬化時に、前記回路基板と前記ハウジングに前記半田クリームが完全に密着されるようにジグを用いて前記回路基板を押さえることを特徴とする請求項1または2に記載の装着方法。
- 前記回路基板上の高熱を発生する部品の半田付け時に使用される鉛は、前記回路基板の下面に使用される半田クリームに比べて低く、あるいは類似した溶融点を有することを特徴とする請求項1または2に記載の装着方法。
- 前記回路基板に装着される部品のうち、所定の高熱を発生する部品は該回路基板に予め定められた貫通孔に挟まれる形態で装着され、前記回路基板が前記ハウジングに半田付けされる場合に該部品の下部の一側面は前記ハウジングに直接に半田付けされることを特徴とする請求項1または2に記載の装着方法。
- 前記ハウジングに行うメッキはスズメッキであることを特徴とする請求項2に記載の装着方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0005686 | 2008-01-18 | ||
KR1020080005686A KR20090079595A (ko) | 2008-01-18 | 2008-01-18 | 인쇄 회로 기판의 장착 방법 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010543058A Division JP2011512025A (ja) | 2008-01-18 | 2009-01-16 | プリント回路基板の装着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014132680A true JP2014132680A (ja) | 2014-07-17 |
JP6338895B2 JP6338895B2 (ja) | 2018-06-06 |
Family
ID=40875664
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010543058A Pending JP2011512025A (ja) | 2008-01-18 | 2009-01-16 | プリント回路基板の装着方法 |
JP2014048689A Active JP6338895B2 (ja) | 2008-01-18 | 2014-03-12 | 電気又は電子装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010543058A Pending JP2011512025A (ja) | 2008-01-18 | 2009-01-16 | プリント回路基板の装着方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9254531B2 (ja) |
JP (2) | JP2011512025A (ja) |
KR (1) | KR20090079595A (ja) |
CN (1) | CN101978797B (ja) |
WO (1) | WO2009091219A2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090079595A (ko) | 2008-01-18 | 2009-07-22 | 주식회사 케이엠더블유 | 인쇄 회로 기판의 장착 방법 |
CN102355797B (zh) * | 2011-10-18 | 2013-07-31 | 武汉凡谷电子技术股份有限公司 | 一种金属基板与印制板烧结工艺 |
US8870051B2 (en) | 2012-05-03 | 2014-10-28 | International Business Machines Corporation | Flip chip assembly apparatus employing a warpage-suppressor assembly |
CN103464852B (zh) * | 2013-07-10 | 2015-10-07 | 南京信息职业技术学院 | 一种电子器件三维回流焊方法 |
US9706662B2 (en) | 2015-06-30 | 2017-07-11 | Raytheon Company | Adaptive interposer and electronic apparatus |
US9648729B1 (en) | 2015-11-20 | 2017-05-09 | Raytheon Company | Stress reduction interposer for ceramic no-lead surface mount electronic device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0951183A (ja) * | 1995-05-30 | 1997-02-18 | Sumitomo Electric Ind Ltd | 電子部品 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5683051A (en) * | 1979-12-11 | 1981-07-07 | Matsushita Electric Ind Co Ltd | Semiconductor device |
JPS6125222A (ja) * | 1984-07-13 | 1986-02-04 | Ricoh Co Ltd | 温度制御装置 |
JPH0334497A (ja) * | 1989-06-30 | 1991-02-14 | Taiyo Yuden Co Ltd | ハイブリッドicの半田付け方法 |
JP3021552B2 (ja) | 1990-06-12 | 2000-03-15 | 富士電機株式会社 | パルス移相装置 |
JPH0446591U (ja) * | 1990-08-27 | 1992-04-21 | ||
US5155904A (en) * | 1991-04-03 | 1992-10-20 | Compaq Computer Corporation | Reflow and wave soldering techniques for bottom side components |
JP3063924B2 (ja) | 1991-06-28 | 2000-07-12 | 株式会社ユアサコーポレーション | 薄形電池 |
JPH0513061U (ja) * | 1991-07-30 | 1993-02-19 | シヤープ株式会社 | 電力半導体装置 |
EP0608418B1 (en) * | 1992-05-20 | 1998-11-04 | Seiko Epson Corporation | Cartridge for electronic apparatus |
JP2734318B2 (ja) * | 1992-10-09 | 1998-03-30 | 太陽誘電株式会社 | 混成集積回路装置の製造方法 |
US5757251A (en) | 1995-05-30 | 1998-05-26 | Sumitomo Electric Industries, Ltd. | Electronic component contained in a metal package |
JPH10189803A (ja) * | 1996-12-27 | 1998-07-21 | Nippon Inter Electronics Corp | 放熱板への絶縁基板取付構造 |
KR200325539Y1 (ko) * | 1997-12-30 | 2004-02-05 | 엘지정보통신주식회사 | 인쇄회로기판 방열 구조 |
US6276593B1 (en) * | 1999-07-12 | 2001-08-21 | Agere Systems Guardian Corp. | Apparatus and method for solder attachment of high powered transistors to base heatsink |
JP2001237585A (ja) * | 2000-02-22 | 2001-08-31 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
JP2004087594A (ja) * | 2002-08-23 | 2004-03-18 | Alps Electric Co Ltd | 電子回路ユニットの放熱構造 |
JP4457739B2 (ja) * | 2004-04-21 | 2010-04-28 | 株式会社村田製作所 | 電子部品およびその製造方法 |
JP2006041240A (ja) * | 2004-07-28 | 2006-02-09 | Yutaka Denki Seisakusho:Kk | 放熱性に優れたプリント配線板およびその製造方法、使用方法 |
US7479039B2 (en) * | 2004-08-06 | 2009-01-20 | Super Talent Electronics, Inc. | Manufacturing process for a super-digital (SD) flash card with slanted asymmetric circuit board |
DE102005013762C5 (de) * | 2005-03-22 | 2012-12-20 | Sew-Eurodrive Gmbh & Co. Kg | Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters |
KR200394682Y1 (ko) * | 2005-06-07 | 2005-09-05 | 김재용 | 인쇄회로기판 |
JP2007180457A (ja) * | 2005-12-28 | 2007-07-12 | Toyota Industries Corp | 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置 |
KR20090079595A (ko) | 2008-01-18 | 2009-07-22 | 주식회사 케이엠더블유 | 인쇄 회로 기판의 장착 방법 |
-
2008
- 2008-01-18 KR KR1020080005686A patent/KR20090079595A/ko active Search and Examination
-
2009
- 2009-01-16 WO PCT/KR2009/000257 patent/WO2009091219A2/ko active Application Filing
- 2009-01-16 CN CN200980110112XA patent/CN101978797B/zh active Active
- 2009-01-16 JP JP2010543058A patent/JP2011512025A/ja active Pending
- 2009-01-21 US US12/356,931 patent/US9254531B2/en active Active
-
2014
- 2014-03-12 JP JP2014048689A patent/JP6338895B2/ja active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0951183A (ja) * | 1995-05-30 | 1997-02-18 | Sumitomo Electric Ind Ltd | 電子部品 |
Also Published As
Publication number | Publication date |
---|---|
CN101978797A (zh) | 2011-02-16 |
US20090184155A1 (en) | 2009-07-23 |
CN101978797B (zh) | 2013-06-19 |
KR20090079595A (ko) | 2009-07-22 |
US9254531B2 (en) | 2016-02-09 |
WO2009091219A2 (ko) | 2009-07-23 |
JP6338895B2 (ja) | 2018-06-06 |
WO2009091219A3 (ko) | 2009-10-22 |
JP2011512025A (ja) | 2011-04-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6338895B2 (ja) | 電気又は電子装置 | |
CN103237412B (zh) | 一种电子件安装结构及制作方法、电子件产品 | |
KR101388328B1 (ko) | 통합 tht 히트 스프레더 핀을 구비한 리드 프레임 기반 오버-몰딩 반도체 패키지와 그 제조 방법 | |
KR101719822B1 (ko) | 솔더링 연결핀, 상기 솔더링 연결핀을 이용한 반도체 패키지 기판 및 반도체칩의 실장방법 | |
US7070084B2 (en) | Electrical circuit apparatus and methods for assembling same | |
JP2012064911A (ja) | パッケージ基板ユニット及びパッケージ基板ユニットの製造方法 | |
WO2006099811A1 (fr) | Ensemble de carte de circuits imprimés et procédé de fabrication de celui-ci | |
KR100734767B1 (ko) | 땜납 벤트 홀을 사용한 회로 보드 조립체 | |
US7063249B2 (en) | Electrical circuit apparatus and method | |
US20070037432A1 (en) | Built up printed circuit boards | |
US7195145B2 (en) | Electrical circuit apparatus and method for assembling same | |
JPWO2007138771A1 (ja) | 半導体装置、電子部品モジュールおよび半導体装置の製造方法 | |
JP4344764B2 (ja) | 表面実装形電子部品の実装方法 | |
GB2345576A (en) | Heat-sink of ICs and method of mounting to PCBs | |
KR200484049Y1 (ko) | 인쇄 회로 기판을 구비하는 전기, 전자 장비 | |
US20120122278A1 (en) | Method Of Manufacturing Semiconductor Package Board | |
JP2658967B2 (ja) | 電子パッケージ組立体用支持部材およびこれを用いた電子パッケージ組立体 | |
JP2007109751A (ja) | 半導体装置の実装構造及び実装方法 | |
JP4853276B2 (ja) | 半導体装置の製造方法 | |
KR20150051951A (ko) | 인쇄 회로 기판을 구비하는 전기, 전자 장비 | |
JPH1041656A (ja) | 配線基板装置 | |
JP2007306314A (ja) | 導波管接続構造とその製造方法 | |
JPH118452A (ja) | 回路基板の外部電極およびその製造方法 | |
KR100675713B1 (ko) | 고주파 고발열소자용 인쇄회로기판의 제조 방법 | |
CN118019205A (zh) | 用于提高功率放大器散热的垫片、制作方法及电子器件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140410 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140410 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150218 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150224 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150522 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151222 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160322 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20160802 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161201 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161216 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20170113 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20170317 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180109 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180308 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180509 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6338895 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |