JP6330149B2 - 無線モジュール及び無線装置 - Google Patents
無線モジュール及び無線装置 Download PDFInfo
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- JP6330149B2 JP6330149B2 JP2015521283A JP2015521283A JP6330149B2 JP 6330149 B2 JP6330149 B2 JP 6330149B2 JP 2015521283 A JP2015521283 A JP 2015521283A JP 2015521283 A JP2015521283 A JP 2015521283A JP 6330149 B2 JP6330149 B2 JP 6330149B2
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- 239000000758 substrate Substances 0.000 claims description 62
- 230000017525 heat dissipation Effects 0.000 claims description 49
- 238000005192 partition Methods 0.000 claims description 8
- 230000005855 radiation Effects 0.000 description 18
- 230000004048 modification Effects 0.000 description 12
- 238000012986 modification Methods 0.000 description 12
- 230000006866 deterioration Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000000644 propagated effect Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Transceivers (AREA)
- Support Of Aerials (AREA)
Description
特許文献1に記載されたモジュールは、アンテナが実装された無線モジュールではなかった。このため、アンテナが実装された無線モジュールに放熱部品を単に設けた場合、放熱部品によってアンテナ特性が劣化する可能性がある。
図1は第1の実施形態における無線装置100の構造例を示す断面図であり、図2に示す無線モジュール1のA−A断面図である。
第1の実施形態では、放熱部品をセット基板10に熱的に接触させたが、第2の実施形態では、放熱部品を筐体7に熱的に接触、つまり筐体7を介して放熱させる場合を示す。
以下に、無線モジュール1Aの変形例を6つ示す。変形例では、主に放熱部品の形状が異なる。変形例における無線モジュール1B〜1Fにおいて、無線モジュール1Aと同様の構成については説明を省略する。
本開示の無線モジュールは、一方の面に、複数のアンテナ部及びグランド部が配設された第1基板と、第1基板の一方の面に対向して配設された放熱部材と、を備え、放熱部材は、各アンテナ部が開口する各開口部と、各開口部を区分する仕切り部と、を含み、グランド部は、第1基板と放熱部材との間に配置されている。
仕切り部は、アンテナ部とアンテナ部に対向する開口部との位置関係が各アンテナ部について略均等となるように形成されている。
グランド部は、発熱量が所定量以上の電子部品と熱的に接触する。
放熱部材は、無線モジュールが実装される第2基板に熱的に接触する。
放熱部材は、無線モジュールと対向する筐体に熱的に接触する。
放熱部材とグランド部との距離は、所定距離以下である。
放熱部材は、筐体に沿って近接配置される第1部分と、開口部を含み第1基板側に沿って近接配置される第2部分と、第1部分と第2部分とを接続する第3部分と、を含む。
放熱部材の第3部分は、第2部分が底部となるテーパ面を有する。
放熱部材の第2部分及び第3部分は、第2部分を基準として、第2部分に直交する方向に対して略対称な形状を有する。
3 モジュール基板
3a 金属層
3b 誘電体層
3c GND層
3d 配線層
5,5A,5B,5C,5D,5E,5F 放熱部品
5a,5b 開口部
5c 仕切り部
5e 基板対向面
5i 他部
5g,5g1,5g2,5g3,5g4,5g5 窪み部
5h1,5h2 窪み部の壁面
5p1,5p2 窪み部の底面
7 筐体
8,9 LSI
10 セット基板
11 GNDパターン
13,15 アンテナ
13a,13b パッチアンテナ
17,18,36 信号ビア
19,33 GNDビア
21a,21b,21c,21d パッド
22a,22b,22c,22d はんだボール
27 モールド部
100,100A 無線装置
Claims (5)
- 無線モジュールを使用する無線装置であって、
前記無線モジュールは、
一方の面に、複数のアンテナ部及びグランド部が配設された第1基板と、
前記複数のアンテナ部及び前記グランド部が配設された前記第1基板の前記一方の面の上方に配設され、前記無線モジュールと対向する筐体に熱的に接触する放熱部材と、
を備え、
前記放熱部材は、
前記各アンテナ部が開口する各開口部と、前記各開口部を区分する仕切り部と、
前記筐体に沿って近接配置される第1部分と、
前記開口部を含み前記第1基板側に沿って近接配置される第2部分と、
前記第1部分と前記第2部分とを接続する第3部分と、
を含む無線装置。 - 請求項1に記載の無線装置であって、
前記放熱部材の前記第3部分は、前記第2部分が底部となるテーパ面を有する無線装置。 - 請求項1または2に記載の無線装置であって、
前記放熱部材の前記第2部分及び前記第3部分は、前記第2部分に直交し、かつ、前記第2部分の中心を通る線を対称軸として略対称な形状を有する無線装置。 - 請求項1に記載の無線装置であって、
前記仕切り部は、前記複数のアンテナ部のうち第1のアンテナと、前記開口部のうち前記第1のアンテナに対応する開口部との相対位置、および、前記複数のアンテナ部のうちの第2のアンテナと、前記開口部のうち前記第2のアンテナに対応する開口部との相対位置が等しくなるように形成された無線装置。 - 請求項1に記載の無線装置であって、
前記グランド部は、発熱量が所定量以上の電子部品と熱的に接触する無線装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013117974 | 2013-06-04 | ||
JP2013117974 | 2013-06-04 | ||
PCT/JP2014/002717 WO2014196144A1 (ja) | 2013-06-04 | 2014-05-23 | 無線モジュール及び無線装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014196144A1 JPWO2014196144A1 (ja) | 2017-02-23 |
JP6330149B2 true JP6330149B2 (ja) | 2018-05-30 |
Family
ID=52007805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015521283A Expired - Fee Related JP6330149B2 (ja) | 2013-06-04 | 2014-05-23 | 無線モジュール及び無線装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9627741B2 (ja) |
JP (1) | JP6330149B2 (ja) |
WO (1) | WO2014196144A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022215873A1 (ko) * | 2021-04-06 | 2022-10-13 | 삼성전자 주식회사 | 방열 구조를 포함하는 전자 장치 |
US11991816B2 (en) | 2021-04-06 | 2024-05-21 | Samsung Electronics Co., Ltd. | Electronic device including heat dissipation structure |
RU2819788C2 (ru) * | 2021-04-06 | 2024-05-24 | Самсунг Электроникс Ко., Лтд. | Электронное устройство, включающее в себя теплорассеивающую конструкцию |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10887439B2 (en) | 2015-12-22 | 2021-01-05 | Intel Corporation | Microelectronic devices designed with integrated antennas on a substrate |
JP6905438B2 (ja) * | 2017-09-22 | 2021-07-21 | 株式会社フジクラ | 無線通信モジュール |
JP7062473B2 (ja) * | 2018-03-14 | 2022-05-06 | 株式会社東芝 | アンテナモジュール |
CN111919338B (zh) * | 2018-03-27 | 2022-06-14 | 株式会社村田制作所 | 天线模块 |
KR102697330B1 (ko) * | 2019-04-15 | 2024-08-23 | 삼성전자 주식회사 | 안테나 및 방열 구조물을 포함하는 전자 장치 |
CN112566440A (zh) * | 2019-09-25 | 2021-03-26 | 中兴通讯股份有限公司 | 一种电子组件及终端设备 |
KR20210098764A (ko) * | 2020-02-03 | 2021-08-11 | 삼성전자주식회사 | 안테나 모듈을 포함하는 전자 장치 |
CN219513349U (zh) * | 2020-08-19 | 2023-08-11 | 株式会社村田制作所 | 通信装置 |
US11476556B1 (en) | 2020-11-23 | 2022-10-18 | Xilinx, Inc. | Remote active cooling heat exchanger and antenna system with the same |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3556832B2 (ja) * | 1998-05-22 | 2004-08-25 | 三菱電機株式会社 | フェーズドアレーアンテナ |
JP3330893B2 (ja) | 1999-02-04 | 2002-09-30 | シャープ株式会社 | 金属筐体に囲まれた電子部品の放熱構造 |
JP2003163459A (ja) * | 2001-11-26 | 2003-06-06 | Sony Corp | 高周波回路ブロック体及びその製造方法、高周波モジュール装置及びその製造方法。 |
JP4630746B2 (ja) | 2005-07-13 | 2011-02-09 | 富士通株式会社 | 半導体パッケージ |
JP2007116217A (ja) * | 2005-10-18 | 2007-05-10 | Hitachi Ltd | ミリ波レーダ装置およびそれを用いたミリ波レーダシステム |
CN102246616A (zh) | 2008-12-12 | 2011-11-16 | 株式会社村田制作所 | 电路模块 |
JP2010182792A (ja) * | 2009-02-04 | 2010-08-19 | Yamaha Corp | 電子回路装置 |
JP2010245373A (ja) * | 2009-04-08 | 2010-10-28 | Panasonic Corp | 半導体装置及びその製造方法 |
JP5374608B2 (ja) * | 2012-04-13 | 2013-12-25 | 株式会社ソニー・コンピュータエンタテインメント | アンテナおよびそれを利用した無線通信装置 |
-
2014
- 2014-05-23 US US14/420,297 patent/US9627741B2/en not_active Expired - Fee Related
- 2014-05-23 WO PCT/JP2014/002717 patent/WO2014196144A1/ja active Application Filing
- 2014-05-23 JP JP2015521283A patent/JP6330149B2/ja not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022215873A1 (ko) * | 2021-04-06 | 2022-10-13 | 삼성전자 주식회사 | 방열 구조를 포함하는 전자 장치 |
US11991816B2 (en) | 2021-04-06 | 2024-05-21 | Samsung Electronics Co., Ltd. | Electronic device including heat dissipation structure |
RU2819788C2 (ru) * | 2021-04-06 | 2024-05-24 | Самсунг Электроникс Ко., Лтд. | Электронное устройство, включающее в себя теплорассеивающую конструкцию |
Also Published As
Publication number | Publication date |
---|---|
JPWO2014196144A1 (ja) | 2017-02-23 |
WO2014196144A1 (ja) | 2014-12-11 |
US20150214598A1 (en) | 2015-07-30 |
US9627741B2 (en) | 2017-04-18 |
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