JP6325053B2 - 接合システム、接合方法、および半導体デバイスの製造方法 - Google Patents

接合システム、接合方法、および半導体デバイスの製造方法 Download PDF

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JP6325053B2
JP6325053B2 JP2016214000A JP2016214000A JP6325053B2 JP 6325053 B2 JP6325053 B2 JP 6325053B2 JP 2016214000 A JP2016214000 A JP 2016214000A JP 2016214000 A JP2016214000 A JP 2016214000A JP 6325053 B2 JP6325053 B2 JP 6325053B2
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temperature
bump electrode
bonded
objects
distance
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Japanese (ja)
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JP2017034282A5 (https=
JP2017034282A (ja
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山内　朗
朗 山内
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Bondtech Inc
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Bondtech Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors

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  • Wire Bonding (AREA)
JP2016214000A 2016-11-01 2016-11-01 接合システム、接合方法、および半導体デバイスの製造方法 Active JP6325053B2 (ja)

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JP2016214000A JP6325053B2 (ja) 2016-11-01 2016-11-01 接合システム、接合方法、および半導体デバイスの製造方法

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JP2016214000A JP6325053B2 (ja) 2016-11-01 2016-11-01 接合システム、接合方法、および半導体デバイスの製造方法

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JP2012042038A Division JP6083041B2 (ja) 2012-02-28 2012-02-28 接合方法、接合システム、および半導体デバイスの製造方法

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JP2017034282A JP2017034282A (ja) 2017-02-09
JP2017034282A5 JP2017034282A5 (https=) 2017-03-30
JP6325053B2 true JP6325053B2 (ja) 2018-05-16

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7417371B2 (ja) * 2019-07-12 2024-01-18 芝浦メカトロニクス株式会社 実装装置
JP7346190B2 (ja) * 2019-09-17 2023-09-19 キオクシア株式会社 半導体製造装置
KR102749775B1 (ko) * 2020-08-07 2025-01-07 가부시키가이샤 신가와 반도체 장치의 제조 장치 및 제조 방법
JP7671175B2 (ja) * 2021-05-13 2025-05-01 日本アビオニクス株式会社 接合装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09153525A (ja) * 1995-11-30 1997-06-10 Toshiba Corp ボンディング装置およびボンディング方法
JP4577941B2 (ja) * 1999-04-05 2010-11-10 東レエンジニアリング株式会社 チップ実装方法及びその装置
JP4445163B2 (ja) * 2001-07-13 2010-04-07 パナソニック株式会社 電子部品の実装装置
JP4089531B2 (ja) * 2003-07-09 2008-05-28 富士通株式会社 半導体装置の製造方法
JP4522881B2 (ja) * 2005-02-15 2010-08-11 パナソニック株式会社 電子部品の実装方法

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