JP2017034282A5 - - Google Patents
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- JP2017034282A5 JP2017034282A5 JP2016214000A JP2016214000A JP2017034282A5 JP 2017034282 A5 JP2017034282 A5 JP 2017034282A5 JP 2016214000 A JP2016214000 A JP 2016214000A JP 2016214000 A JP2016214000 A JP 2016214000A JP 2017034282 A5 JP2017034282 A5 JP 2017034282A5
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- temperature
- bump electrode
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- 238000006073 displacement reaction Methods 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 32
- 238000002844 melting Methods 0.000 claims description 30
- 230000008018 melting Effects 0.000 claims description 30
- 238000005304 joining Methods 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 20
- 239000007787 solid Substances 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims 4
- 239000007790 solid phase Substances 0.000 description 3
- 238000005275 alloying Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016214000A JP6325053B2 (ja) | 2016-11-01 | 2016-11-01 | 接合システム、接合方法、および半導体デバイスの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016214000A JP6325053B2 (ja) | 2016-11-01 | 2016-11-01 | 接合システム、接合方法、および半導体デバイスの製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012042038A Division JP6083041B2 (ja) | 2012-02-28 | 2012-02-28 | 接合方法、接合システム、および半導体デバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017034282A JP2017034282A (ja) | 2017-02-09 |
| JP2017034282A5 true JP2017034282A5 (https=) | 2017-03-30 |
| JP6325053B2 JP6325053B2 (ja) | 2018-05-16 |
Family
ID=57987306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016214000A Active JP6325053B2 (ja) | 2016-11-01 | 2016-11-01 | 接合システム、接合方法、および半導体デバイスの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6325053B2 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7417371B2 (ja) * | 2019-07-12 | 2024-01-18 | 芝浦メカトロニクス株式会社 | 実装装置 |
| JP7346190B2 (ja) * | 2019-09-17 | 2023-09-19 | キオクシア株式会社 | 半導体製造装置 |
| KR102749775B1 (ko) * | 2020-08-07 | 2025-01-07 | 가부시키가이샤 신가와 | 반도체 장치의 제조 장치 및 제조 방법 |
| JP7671175B2 (ja) * | 2021-05-13 | 2025-05-01 | 日本アビオニクス株式会社 | 接合装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09153525A (ja) * | 1995-11-30 | 1997-06-10 | Toshiba Corp | ボンディング装置およびボンディング方法 |
| JP4577941B2 (ja) * | 1999-04-05 | 2010-11-10 | 東レエンジニアリング株式会社 | チップ実装方法及びその装置 |
| JP4445163B2 (ja) * | 2001-07-13 | 2010-04-07 | パナソニック株式会社 | 電子部品の実装装置 |
| JP4089531B2 (ja) * | 2003-07-09 | 2008-05-28 | 富士通株式会社 | 半導体装置の製造方法 |
| JP4522881B2 (ja) * | 2005-02-15 | 2010-08-11 | パナソニック株式会社 | 電子部品の実装方法 |
-
2016
- 2016-11-01 JP JP2016214000A patent/JP6325053B2/ja active Active
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