JP6298409B2 - 硬化性樹脂膜形成層付シートおよび該シートを用いた半導体装置の製造方法 - Google Patents
硬化性樹脂膜形成層付シートおよび該シートを用いた半導体装置の製造方法 Download PDFInfo
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- JP6298409B2 JP6298409B2 JP2014549922A JP2014549922A JP6298409B2 JP 6298409 B2 JP6298409 B2 JP 6298409B2 JP 2014549922 A JP2014549922 A JP 2014549922A JP 2014549922 A JP2014549922 A JP 2014549922A JP 6298409 B2 JP6298409 B2 JP 6298409B2
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Classifications
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
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| PCT/JP2013/082187 WO2014084357A1 (ja) | 2012-11-30 | 2013-11-29 | 硬化性樹脂膜形成層付シートおよび該シートを用いた半導体装置の製造方法 |
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| KR (1) | KR102224971B1 (ko) |
| CN (1) | CN104797423B (ko) |
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| KR101843900B1 (ko) * | 2015-04-29 | 2018-03-30 | 주식회사 엘지화학 | 반도체 접착용 수지 조성물 및 반도체용 접착 필름 및 다이싱 다이본딩 필름 |
| JP6521823B2 (ja) * | 2015-10-01 | 2019-05-29 | リンテック株式会社 | ダイシングダイボンディングシート |
| KR102412725B1 (ko) * | 2016-10-05 | 2022-06-23 | 린텍 가부시키가이샤 | 제1 보호막 형성용 시트 |
| JP7248572B2 (ja) * | 2017-05-31 | 2023-03-29 | リンテック株式会社 | 接着剤組成物、接着シート、及び封止体 |
| EP3666429A4 (en) | 2017-09-15 | 2021-01-27 | LINTEC Corporation | BAKING MATERIAL IN THE FORM OF FILM, AND BAKING EQUIPMENT IN THE FORM OF FILM EQUIPPED WITH A SUPPORT SHEET |
| JP7137575B2 (ja) * | 2017-10-27 | 2022-09-14 | リンテック株式会社 | 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法 |
| KR102594248B1 (ko) * | 2017-11-17 | 2023-10-25 | 린텍 가부시키가이샤 | 제1 보호막이 형성된 반도체 칩, 제1 보호막이 형성된 반도체 칩의 제조 방법, 및 반도체 칩 제1 보호막 적층체의 평가 방법 |
| JP6497477B1 (ja) * | 2018-10-03 | 2019-04-10 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、および電子部品搭載基板 |
| CN110003822A (zh) * | 2019-04-30 | 2019-07-12 | 浙江华硕科技股份有限公司 | 一种墙纸用环保胶水及其制备方法 |
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| JPH04145119A (ja) * | 1990-10-05 | 1992-05-19 | Toshiba Silicone Co Ltd | エポキシ樹脂組成物 |
| JP4275221B2 (ja) * | 1998-07-06 | 2009-06-10 | リンテック株式会社 | 粘接着剤組成物および粘接着シート |
| WO2003018703A1 (fr) * | 2001-08-27 | 2003-03-06 | Hitachi Chemical Co., Ltd. | Feuille adhesive et dispositif semi-conducteur; procede de fabrication |
| JP4064403B2 (ja) * | 2005-01-18 | 2008-03-19 | シャープ株式会社 | 半導体装置、表示モジュール、半導体チップ実装用フィルム基板の製造方法、及び半導体装置の製造方法 |
| KR100909169B1 (ko) * | 2006-09-11 | 2009-07-23 | 제일모직주식회사 | 선 경화형 반도체 조립용 접착 필름 조성물 |
| KR101023841B1 (ko) * | 2006-12-08 | 2011-03-22 | 주식회사 엘지화학 | 접착제 수지 조성물 및 이를 이용한 다이싱 다이 본딩 필름 |
| JP2009138026A (ja) * | 2007-12-03 | 2009-06-25 | Furukawa Electric Co Ltd:The | エネルギー線硬化型チップ保護用フィルム |
| JP5234594B2 (ja) * | 2008-03-11 | 2013-07-10 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
| WO2011046238A1 (ko) * | 2009-10-16 | 2011-04-21 | (주)Lg화학 | 다이어태치 필름 |
| JP5550371B2 (ja) * | 2010-02-05 | 2014-07-16 | リンテック株式会社 | 接着剤組成物および接着シート |
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| TW201435036A (zh) | 2014-09-16 |
| CN104797423A (zh) | 2015-07-22 |
| JPWO2014084357A1 (ja) | 2017-01-05 |
| KR20150090080A (ko) | 2015-08-05 |
| TWI600740B (zh) | 2017-10-01 |
| CN104797423B (zh) | 2017-06-13 |
| WO2014084357A1 (ja) | 2014-06-05 |
| KR102224971B1 (ko) | 2021-03-08 |
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