WO2018221573A1 - 接着剤組成物、接着シート、及び封止体 - Google Patents
接着剤組成物、接着シート、及び封止体 Download PDFInfo
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- WO2018221573A1 WO2018221573A1 PCT/JP2018/020733 JP2018020733W WO2018221573A1 WO 2018221573 A1 WO2018221573 A1 WO 2018221573A1 JP 2018020733 W JP2018020733 W JP 2018020733W WO 2018221573 A1 WO2018221573 A1 WO 2018221573A1
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- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- 125000002560 nitrile group Chemical group 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000006187 pill Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- SGCFZHOZKKQIBU-UHFFFAOYSA-N tributoxy(ethenyl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C=C SGCFZHOZKKQIBU-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention provides an adhesive composition that can be easily formed into a sheet, an adhesive sheet that has an adhesive layer that is formed using this adhesive composition and has excellent unevenness followability, and an object to be sealed is the adhesive sheet.
- the present invention relates to a sealed body.
- organic EL elements have attracted attention as light-emitting elements that can emit light with high luminance by low-voltage direct current drive.
- the organic EL element has a problem that light emission characteristics such as light emission luminance, light emission efficiency, and light emission uniformity are likely to deteriorate with time.
- the organic EL element was sealed using a sealing material.
- oxygen and moisture have been prevented from entering.
- a sealing material having a low viscosity has been developed.
- Patent Document 1 discloses a resin composition containing a specific epoxy resin, a specific epoxy resin curing agent, a specific microcapsule, and a specific amount of filler, which is measured by an E-type viscometer at 25 ° C. A composition having a viscosity at 2.5 rpm of 0.5 to 50 Pa ⁇ s is described. Patent Document 1 also describes that by using a liquid epoxy resin and a liquid epoxy resin curing agent and adjusting the filler content, both low viscosity and high moisture resistance of the cured product can be achieved. Yes.
- Patent Document 1 has a low viscosity and is excellent in uneven followability. However, since this composition has fluidity before the curing reaction, it is necessary to use a special coating apparatus such as a dispenser when sealing the organic EL element. Accordingly, there has been a demand for an adhesive composition that can be easily formed into a sheet shape and capable of forming an adhesive layer that is excellent in irregularity following ability.
- the present invention has been made in view of the above circumstances, and is an adhesive composition that is easy to be formed into a sheet, and an adhesive sheet that is formed using this adhesive composition and has an adhesive layer that is excellent in unevenness followability. And it aims at providing the sealing body by which a to-be-sealed thing is sealed with the said adhesive sheet.
- An adhesive composition containing a modified polyolefin resin and one or more polyfunctional epoxy compounds, and the total amount of the polyfunctional epoxy compound relative to 100 parts by mass of the modified polyolefin resin Is an adhesive composition in which at least one polyfunctional epoxy compound is liquid at 25 ° C., and is easily molded into a sheet shape, (ii) using this adhesive composition
- the adhesive layer formed in this way was found to be excellent in uneven followability, and the present invention was completed.
- the following adhesive compositions (1) to (11), adhesive sheets (12) to (14), and sealed bodies (15) and (16) are provided.
- the following (A) component and (B) component are the adhesive compositions which may contain the (C) component, Comprising: The total amount of (B) component and (C) component Is more than 100 parts by mass with respect to 100 parts by mass of the component (A).
- (B) component polyfunctional epoxy compound that is liquid at 25 ° C.
- C) component polyfunctional epoxy compound that is solid at 25 ° C.
- the component (A) is an acid.
- the total amount of the component (B) and the component (C) is more than 100 parts by mass and not more than 200 parts by mass with respect to 100 parts by mass of the component (A), according to (1) or (2).
- the content of the component (D) is 1 to 200 parts by mass with respect to 100 parts by mass of the component (A).
- the adhesive composition described in 1. (8) The adhesive composition according to any one of (1) to (7), further comprising the following component (E): Component (E): Imidazole-based curing catalyst (9)
- the content of the component (E) is 1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the component (B) and the component (C).
- an adhesive composition that can be easily formed into a sheet shape, an adhesive sheet that is formed using the adhesive composition and has an adhesive layer with excellent unevenness followability, and an object to be sealed are bonded.
- a sealing body that is sealed with a sheet is provided.
- Adhesive composition is an adhesive composition containing the following component (A) and component (B), which may contain component (C), The total amount of the component (B) and the component (C) is more than 100 parts by mass with respect to 100 parts by mass of the component (A).
- (A) component Modified polyolefin-type resin
- the adhesive composition of this invention contains modified polyolefin-type resin as (A) component.
- the adhesive composition of the present invention is excellent in adhesive strength by containing a modified polyolefin resin. Moreover, a comparatively thin adhesive layer can be efficiently formed by using the adhesive composition containing the modified polyolefin resin.
- the modified polyolefin resin is a polyolefin resin having a functional group introduced, which is obtained by subjecting a polyolefin resin as a precursor to a modification treatment using a modifier.
- the polyolefin resin refers to a polymer containing repeating units derived from olefinic monomers.
- the polyolefin resin may be a polymer composed only of repeating units derived from olefinic monomers, or derived from monomers that are copolymerizable with olefinic monomers and repeating units derived from olefinic monomers. The polymer which consists of these repeating units may be sufficient.
- the olefin monomer is preferably an ⁇ -olefin having 2 to 8 carbon atoms, more preferably ethylene, propylene, 1-butene, isobutylene, or 1-hexene, and even more preferably ethylene or propylene.
- These olefinic monomers can be used alone or in combination of two or more.
- Examples of the monomer copolymerizable with the olefin monomer include vinyl acetate, (meth) acrylic acid ester, and styrene.
- the monomers copolymerizable with these olefinic monomers can be used singly or in combination of two or more.
- polyolefin resins include very low density polyethylene (VLDPE), low density polyethylene (LDPE), medium density polyethylene (MDPE), high density polyethylene (HDPE), linear low density polyethylene, polypropylene (PP), and ethylene-propylene.
- VLDPE very low density polyethylene
- LDPE low density polyethylene
- MDPE medium density polyethylene
- HDPE high density polyethylene
- PP polypropylene
- ethylene-propylene examples include a polymer, an olefin elastomer (TPO), an ethylene-vinyl acetate copolymer (EVA), an ethylene- (meth) acrylic acid copolymer, and an ethylene- (meth) acrylic acid ester copolymer.
- the modifier used for the modification treatment of the polyolefin resin is a compound having a functional group in the molecule.
- Functional groups include carboxyl groups, carboxylic anhydride groups, carboxylic ester groups, hydroxyl groups, epoxy groups, amide groups, ammonium groups, nitrile groups, amino groups, imide groups, isocyanate groups, acetyl groups, thiol groups, ether groups. Thioether group, sulfone group, phosphone group, nitro group, urethane group, halogen atom and the like.
- a carboxyl group, a carboxylic anhydride group, a carboxylic ester group, a hydroxyl group, an ammonium group, an amino group, an imide group, and an isocyanate group are preferable, a carboxylic anhydride group and an alkoxysilyl group are more preferable, and a carboxylic anhydride Physical groups are particularly preferred.
- the compound having a functional group may have two or more kinds of functional groups in the molecule.
- modified polyolefin resin examples include acid-modified polyolefin resins and silane-modified polyolefin resins, and acid-modified polyolefin resins are preferable from the viewpoint of obtaining the better effect of the present invention.
- the acid-modified polyolefin resin is a resin obtained by graft-modifying a polyolefin resin with an acid.
- an unsaturated carboxylic acid or an unsaturated carboxylic acid anhydride (hereinafter collectively referred to as “unsaturated carboxylic acid”) may be reacted with a polyolefin resin to produce a carboxyl group or a carboxylic acid anhydride.
- unsaturated carboxylic acid an unsaturated carboxylic acid or an unsaturated carboxylic acid anhydride
- examples thereof include those introduced with a group (graft modification).
- unsaturated carboxylic acids to be reacted with polyolefin resin examples include unsaturated carboxylic acids such as maleic acid, fumaric acid, itaconic acid, citraconic acid, glutaconic acid, tetrahydrophthalic acid and aconitic acid; maleic anhydride, itaconic anhydride, anhydrous And unsaturated carboxylic acid anhydrides such as glutaconic acid, citraconic acid anhydride, aconitic acid anhydride, norbornene dicarboxylic acid anhydride, and tetrahydrophthalic acid anhydride. These can be used alone or in combination of two or more. Among these, maleic anhydride is preferable because an adhesive composition having better adhesive strength can be easily obtained.
- the amount of unsaturated carboxylic acid or the like to be reacted with the polyolefin resin is preferably 0.1 to 5 parts by mass, more preferably 0.2 to 3 parts by mass, and still more preferably 0.2 to 100 parts by mass of the polyolefin resin. 1.0 parts by mass.
- the adhesive composition containing the acid-modified polyolefin resin thus obtained is more excellent in adhesive strength.
- a commercially available product can also be used as the acid-modified polyolefin resin.
- Examples of commercially available products include Admer (registered trademark) (manufactured by Mitsui Chemicals), Unistor (registered trademark) (manufactured by Mitsui Chemicals), BondyRam (manufactured by Polyram), orevac (registered trademark) (manufactured by ARKEMA), Modic (registered trademark) (manufactured by Mitsubishi Chemical Corporation) and the like.
- Silane-modified polyolefin resin refers to a polyolefin resin graft-modified with an unsaturated silane compound.
- the silane-modified polyolefin resin has a structure in which an unsaturated silane compound as a side chain is graft copolymerized with a polyolefin resin as a main chain.
- Examples include silane-modified polyethylene resins and silane-modified ethylene-vinyl acetate copolymers, and silane-modified polyethylene resins such as silane-modified low-density polyethylene, silane-modified ultra-low-density polyethylene, and silane-modified linear low-density polyethylene are preferable.
- the unsaturated silane compound to be reacted with the polyolefin resin is preferably a vinyl silane compound, such as vinyl trimethoxy silane, vinyl triethoxy silane, vinyl tripropoxy silane, vinyl triisopropoxy silane, vinyl tributoxy silane, vinyl tripentyloxy.
- vinyl silane compound such as vinyl trimethoxy silane, vinyl triethoxy silane, vinyl tripropoxy silane, vinyl triisopropoxy silane, vinyl tributoxy silane, vinyl tripentyloxy.
- Examples include silane, vinyltriphenoxysilane, vinyltribenzyloxysilane, vinyltrimethylenedioxysilane, vinyltriethylenedioxysilane, vinylpropionyloxysilane, vinyltriacetoxysilane, and vinyltricarboxysilane. These can be used alone or in combination of two or more.
- a known conventional graft polymerization method may be employed as a condition for graft polymerization of the unsaturated si
- the amount of the unsaturated silane compound to be reacted with the polyolefin resin is preferably from 0.1 to 10 parts by weight, particularly preferably from 0.3 to 7 parts by weight, based on 100 parts by weight of the polyolefin resin. Further, it is preferably 0.5 to 5 parts by mass. When the amount of the unsaturated silane compound to be reacted is in the above range, the adhesive composition containing the resulting silane-modified polyolefin resin is more excellent in adhesive strength.
- silane-modified polyolefin resin examples include Lincron (registered trademark) (manufactured by Mitsubishi Chemical Corporation). Of these, low-density polyethylene-based linklon, linear low-density polyethylene-based linkron, ultra-low-density polyethylene-based linkron, and ethylene-vinyl acetate copolymer-based linkron can be preferably used.
- the modified polyolefin resin can be used alone or in combination of two or more.
- the number average molecular weight (Mn) of the modified polyolefin resin is preferably 10,000 to 2,000,000, more preferably 20,000 to 1,500,000.
- the number average molecular weight (Mn) of the modified polyolefin resin can be obtained as a standard polystyrene equivalent value by performing gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent.
- (B) Component Polyfunctional epoxy compound that is liquid at 25 ° C.
- the adhesive composition of the present invention contains a polyfunctional epoxy compound that is liquid at 25 ° C. as component (B).
- the “polyfunctional epoxy compound that is liquid at 25 ° C.” refers to a polyfunctional epoxy compound that has a constant volume (except for the part that volatilizes) at 25 ° C., but does not have a fixed shape.
- the viscosity at 25 ° C. of the “polyfunctional epoxy compound that is liquid at 25 ° C.” used in the present invention is usually 0.1 to 100,000 mPa ⁇ s, preferably 0.2 to 50,000 mPa ⁇ s, more preferably 0.3 to 10,000 mPa ⁇ s.
- the component (B) has an effect of lowering the storage elastic modulus of the adhesive composition when the adhesive composition reaches a high temperature (hereinafter sometimes referred to as “storage elastic modulus lowering effect”). For this reason, the adhesive bond layer which is excellent in uneven
- the polyfunctional epoxy compound refers to a compound having two or more epoxy groups in the molecule.
- the polyfunctional epoxy compound of a component can be used individually by 1 type or in combination of 2 or more types.
- the molecular weight of the polyfunctional epoxy compound as component (B) is preferably 700 to 5,000, more preferably 1,200 to 4,500.
- the epoxy equivalent of the (B) component polyfunctional epoxy compound is preferably 100 g / eq or more and 500 g / eq or less, more preferably 150 g / eq or more and 300 g / eq or less.
- Component (C) Polyfunctional epoxy compound that is solid at 25 ° C.
- the adhesive composition of the present invention may contain a polyfunctional epoxy compound that is solid at 25 ° C. as component (C).
- the “polyfunctional epoxy compound that is solid at 25 ° C.” is a polyfunctional epoxy resin having a softening point in a temperature region of 25 ° C. or higher.
- the polyfunctional epoxy compound of the component (C) is considered to have almost no storage elastic modulus lowering effect. For this reason, the storage elastic modulus of the adhesive composition containing the component (C) instead of the component (B) hardly decreases even when the temperature rises.
- the storage elastic modulus lowering effect of the component (B) can be further enhanced.
- the reason for this is that the presence of the component (C) may increase the proportion of the sea region of the sea-island structure described later.
- the adhesive composition containing the component (C) is more easily formed into a sheet. Therefore, the adhesive composition of the present invention more preferably contains the component (C).
- Component (C) includes bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin, hydrogenated bisphenol S type epoxy resin, etc. Can be mentioned.
- the polyfunctional epoxy compound of a component can be used individually by 1 type or in combination of 2 or more types.
- the molecular weight of the polyfunctional epoxy compound as component (C) is preferably 500 to 10,000, more preferably 1,000 to 5,000.
- the total amount of the component (B) and the component (C) [If the adhesive composition does not contain the component (C), it means the content of the component (B) (below The same)]. Is more than 100 parts by mass with respect to 100 parts by mass of component (A), preferably more than 100 parts by mass and not more than 200 parts by mass, more preferably not less than 120 parts by mass and not more than 200 parts by mass.
- the total amount of the component (B) and the component (C) is more than 100 parts by mass with respect to 100 parts by mass of the component (A), so that “island” composed of the modified polyolefin resin (component (A)) It is possible to efficiently form an sea-island-structured adhesive layer having a “sea” composed of a polyfunctional epoxy compound (component (B) and component (C)). Such a sea-island-structured adhesive layer has excellent irregularity followability because its storage elastic modulus is greatly reduced when heated.
- the adhesive composition of this invention may contain components other than the said (A) component, (B) component, and (C) component.
- components other than the component (A), the component (B), and the component (C) include the following component (D), component (E), and component (F).
- Component (D) Tackifier having a softening point of 80 ° C. or higher
- the adhesive composition containing the component (B) has a low storage elastic modulus before curing, and is excellent in uneven followability.
- such an adhesive composition may be difficult to maintain a certain shape and difficult to be formed into a sheet shape.
- the moldability can be improved by adding the component (D).
- the tackifier of component (D) is not particularly limited as long as it has a softening point of 80 ° C or higher.
- a styrene resin is preferable, and a styrene monomer / aliphatic monomer copolymer resin is more preferable.
- These tackifiers can be used singly or in combination of two or more.
- the content thereof is preferably 1 to 200 parts by weight, more preferably 10 to 150 parts by weight with respect to 100 parts by weight of the component (A). It is.
- there is too little content of (D) component there exists a possibility that it may become difficult to shape
- there is too much content of (D) component there exists a possibility that an adhesive bond layer may become weak.
- Component (E): Imidazole-based curing catalyst As imidazole-based curing catalyst, 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl Examples include -4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and 2-phenyl-4,5-dihydroxymethylimidazole. Of these, 2-ethyl-4-methylimidazole is preferred. These imidazole-based curing catalysts can be used singly or in combination of two or more.
- the content of the adhesive composition of the present invention contains the component (E)
- the content is preferably 1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the component (B) and the component (C). More preferably, it is 2 to 5 parts by mass.
- the cured product of the adhesive composition in which the content of the imidazole curing catalyst is within this range has excellent adhesiveness even at high temperatures.
- silane coupling agent As a silane coupling agent, a well-known silane coupling agent can be used. Of these, organosilicon compounds having at least one alkoxysilyl group in the molecule are preferred.
- silane coupling agents include polymerizable unsaturated group-containing silicon compounds such as vinyltrimethoxysilane, vinyltriethoxysilane, and methacryloxypropyltrimethoxysilane; 3-glycidoxypropyltrimethoxysilane, 8-glycidoxyoctyl Silicon compounds having an epoxy structure such as trimethoxysilane and 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane; 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxy Amino group-containing silicon compounds such as silane, N- (2-aminoethyl) -8-a
- an adhesive composition containing a silane coupling agent By using an adhesive composition containing a silane coupling agent, it becomes easier to obtain a cured product having better adhesive strength in a normal temperature and high temperature environment.
- the adhesive composition of the present invention contains a silane coupling agent
- the content thereof is preferably 0.01 to 10 parts by mass, more preferably 0.02 with respect to 100 parts by mass of the component (A). Is 5 parts by mass.
- the adhesive composition of the present invention may contain a solvent.
- Solvents include aromatic hydrocarbon solvents such as benzene and toluene; ester solvents such as ethyl acetate and butyl acetate; ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; n-pentane, n-hexane, n- And aliphatic hydrocarbon solvents such as heptane; alicyclic hydrocarbon solvents such as cyclopentane, cyclohexane, and methylcyclohexane; These solvents can be used alone or in combination of two or more. The content of the solvent can be appropriately determined in consideration of coating properties and the like.
- the adhesive composition of the present invention may contain other components as long as the effects of the present invention are not hindered.
- other components include additives such as ultraviolet absorbers, antistatic agents, light stabilizers, antioxidants, resin stabilizers, fillers, pigments, extenders and softeners. These can be used alone or in combination of two or more. When the adhesive composition of this invention contains these additives, the content can be suitably determined according to the objective.
- the adhesive composition of the present invention can be prepared by appropriately mixing and stirring predetermined components according to a conventional method.
- the storage elastic modulus at 23 ° C. is preferably 0.1 to 600 MPa, more preferably 0.2 to 500 MPa.
- the storage elastic modulus at 23 ° C. is 0.1 MPa or more, it is easy to form into a sheet shape.
- the storage elastic modulus at 23 ° C. is 600 MPa or less, an adhesive layer that is relatively soft and excellent in sealing properties can be formed.
- solid content means the solid part except volatile substances, such as a solvent.
- the upper limit of the storage elastic modulus at 80 ° C. is preferably 0.1 MPa.
- An adhesive composition having a storage elastic modulus at 80 ° C. of 0.1 MPa or less tends to have good unevenness followability.
- the lower limit of the storage elastic modulus at 80 ° C. is preferably 1 kPa.
- An adhesive composition having a storage elastic modulus at 80 ° C. of 1 kPa or more is superior in handling properties.
- the storage elastic modulus of the solid content of the adhesive composition of the present invention is, for example, an example in which the sheet-like adhesive obtained by applying and drying the adhesive composition of the present invention is used as a test piece. It can be measured according to the method described in 1.
- the adhesive composition having the above characteristics can be efficiently obtained by optimizing the amount of the component (B) and the amount of the component (C) used as necessary. Specifically, the storage elastic modulus at 23 ° C. and 80 ° C. tends to decrease by adding the component (B). On the other hand, when the component (B) is added too much, it may be difficult to form the sheet. In this case, by adding an appropriate amount of the component (C), the moldability is improved and the storage elastic modulus at 80 ° C. can be lowered.
- the adhesive composition of the present invention is easy to be formed into a sheet and is excellent in unevenness followability. For this reason, the adhesive composition of this invention is used suitably when forming a sealing material.
- Adhesive sheet The adhesive sheet of this invention is an adhesive sheet which has an adhesive bond layer, Comprising: The said adhesive bond layer is formed using the adhesive composition of this invention.
- the thickness of the adhesive layer of the adhesive sheet is not particularly limited, but is preferably 5 to 25 ⁇ m, more preferably 10 to 20 ⁇ m.
- An adhesive layer having a thickness within the above range is suitably used as a sealing material.
- the adhesive sheet of the present invention may have a release film.
- the release film functions as a support in the manufacturing process of the adhesive sheet, and functions as a protective sheet for the adhesive layer until the adhesive sheet is used.
- the release film is usually peeled off.
- a conventionally well-known thing can be utilized as a peeling film.
- the substrate for the release film paper substrates such as glassine paper, coated paper, and high-quality paper; laminated paper obtained by laminating a thermoplastic resin such as polyethylene on these paper substrates; polyethylene terephthalate resin, polybutylene terephthalate resin, Examples thereof include plastic films such as polyethylene naphthalate resin, polypropylene resin, and polyethylene resin.
- the release agent include rubber elastomers such as silicone resins, olefin resins, isoprene resins, and butadiene resins, long chain alkyl resins, alkyd resins, and fluorine resins.
- the number of release films may be one or two, but usually one on each side of the adhesive layer, two in total. It has a release film.
- the two release films may be the same or different, but the two release films preferably have different release forces.
- an adhesive sheet can be manufactured using a casting method.
- the adhesive composition of the present invention is applied to the release-treated surface of the release film using a known method, and the obtained coating film is dried to provide a release film.
- An adhesive sheet can be obtained by producing an adhesive layer and then stacking another release film on the adhesive layer.
- Examples of the method for applying the adhesive composition include spin coating, spray coating, bar coating, knife coating, roll coating, blade coating, die coating, and gravure coating.
- the drying conditions for drying the coating film include, for example, 80 to 150 ° C. for 30 seconds to 5 minutes.
- the adhesive layer of the adhesive sheet of the present invention has thermosetting properties.
- the conditions for thermosetting the adhesive layer are not particularly limited.
- the heating temperature is usually 80 to 200 ° C, preferably 90 to 150 ° C.
- the heating time is usually 30 minutes to 12 hours, preferably 1 to 6 hours.
- the peel adhesion strength at 23 ° C. of the adhesive layer after the curing treatment is usually 1 to 100 N / 25 mm, preferably 10 to 50 N / 25 mm.
- the peel adhesion strength at 85 ° C. is usually 1 to 100 N / 25 mm, preferably 5 to 50 N / 25 mm.
- the peel adhesion strength at 23 ° C. is in accordance with JIS Z0237: 2009.
- the peel angle is 180 ° in an environment of a temperature of 23 ° C., a relative humidity of 50% and an environment of a temperature of 85 ° C. (humidity is not controlled).
- a peel test can be performed under conditions.
- the water vapor permeability of the adhesive layer after the curing treatment is usually 0.1 to 200 g ⁇ m ⁇ 2 ⁇ day ⁇ 1 , preferably 1 to 150 g ⁇ m ⁇ 2 ⁇ day ⁇ 1 .
- the water vapor transmission rate can be measured using a known water vapor transmission rate measuring device.
- the adhesive layer of the adhesive sheet of the present invention is excellent in uneven followability. For this reason, an organic EL element etc. can be sealed without gap by using the adhesive sheet of this invention.
- the sealing body of the present invention is formed by sealing an object to be sealed using the adhesive sheet of the present invention.
- the sealing body of the present invention includes, for example, a substrate, an element (an object to be sealed) formed on the substrate, and a sealing material for sealing the element,
- the sealing material is derived from the adhesive layer of the adhesive sheet of the present invention (cured product of the adhesive layer).
- the substrate is not particularly limited, and various substrate materials can be used. In particular, it is preferable to use a substrate material having a high visible light transmittance. In addition, a material having a high blocking performance for blocking moisture and gas to enter from the outside of the element and having excellent solvent resistance and weather resistance is preferable.
- transparent inorganic materials such as quartz and glass; polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polystyrene, polyethylene, polypropylene, polyphenylene sulfide, polyvinylidene fluoride, acetyl cellulose, brominated phenoxy, aramids, polyimides, Examples thereof include transparent plastics such as polystyrenes, polyarylates, polysulfones, and polyolefins, and the gas barrier film described above.
- the thickness of the substrate is not particularly limited, and can be selected as appropriate in consideration of light transmittance and performance for blocking the inside and outside of the element.
- Examples of the objects to be sealed include organic EL elements, organic EL display elements, liquid crystal display elements, solar cell elements, and the like.
- the manufacturing method of the sealing body of this invention is not specifically limited. For example, after the adhesive layer of the adhesive sheet of the present invention is stacked on the object to be sealed, the adhesive layer of the adhesive sheet and the object to be sealed are bonded by heating. Subsequently, the sealing body of this invention can be manufactured by hardening this adhesive bond layer.
- the bonding conditions for bonding the adhesive layer of the adhesive sheet and the object to be sealed are not particularly limited.
- the bonding temperature is, for example, 23 to 100 ° C., preferably 40 to 80 ° C. This adhesion treatment may be performed while applying pressure.
- the curing conditions for curing the adhesive layer the conditions described above can be used.
- the sealing body of the present invention is formed by sealing an object to be sealed with the adhesive sheet of the present invention. Therefore, the sealing body of this invention maintains the performance of a to-be-sealed object over a long term.
- Acid-modified polyolefin resin (acid-modified ⁇ -olefin polymer, manufactured by Mitsui Chemicals, trade name: Unistol H-200, number average molecular weight: 47,000) 100 parts, polyfunctional epoxy compound (1) (hydrogenated bisphenol Type A epoxy resin, manufactured by Mitsubishi Chemical Co., Ltd., trade name: YX8034, liquid at 25 ° C., epoxy equivalent 270 g / eq, viscosity at 25 ° C .: 9000 mPa ⁇ s) 125 parts, tackifier (styrene monomer and aliphatic monomer) 1.
- polyfunctional epoxy compound (1) hydroogenated bisphenol Type A epoxy resin, manufactured by Mitsubishi Chemical Co., Ltd., trade name: YX8034, liquid at 25 ° C., epoxy equivalent 270 g / eq, viscosity at 25 ° C .: 9000 mPa ⁇ s) 125 parts
- tackifier sty
- Example 2 In Example 1, the amount of the polyfunctional epoxy compound (1) was changed to 150 parts, and the amount of the imidazole curing catalyst was changed to 1.5 parts. Obtained.
- Example 3 Acid-modified polyolefin resin (acid-modified ⁇ -olefin polymer, manufactured by Mitsui Chemicals, trade name: Unistol H-200, number average molecular weight: 47,000) 100 parts, polyfunctional epoxy compound (2) (hydrogenated bisphenol Type A epoxy resin, manufactured by Mitsubishi Chemical Corporation, trade name: YX8000, liquid at 25 ° C., epoxy equivalent: 205 g / eq, viscosity at 25 ° C .: 1900 mPa ⁇ s) 100 parts, polyfunctional epoxy compound (3) (hydrogenated bisphenol Type A epoxy resin, manufactured by Mitsubishi Chemical Corporation, trade name: YX8040, solid at 25 ° C., epoxy equivalent: 1100 g / eq, softening point: 84 ° C.
- polyfunctional epoxy compound (2) hydroogenated bisphenol Type A epoxy resin, manufactured by Mitsubishi Chemical Corporation, trade name: YX8000, liquid at 25 ° C., epoxy equivalent: 205 g / eq, visco
- Example 4 In Example 3, except that the amount of the polyfunctional epoxy compound (3) was changed to 50 parts, an adhesive composition 3 was prepared in the same manner as in Example 3, and an adhesive sheet 4 was obtained using this. It was.
- Example 1 In Example 1, the amount of the polyfunctional epoxy compound (1) was changed to 100 parts, and the amount of the imidazole-based curing catalyst was changed to 1.0 part. Obtained.
- the adhesive sheets of Examples 1 to 4 contain more polyfunctional epoxy compounds than modified polyolefin resins.
- the adhesive sheets of Examples 3 and 4 include both a polyfunctional epoxy compound that is liquid at 25 ° C. and a polyfunctional epoxy compound that is solid at 25 ° C. These adhesive sheets have a lower storage elastic modulus at 80 ° C. than the adhesive sheet of Comparative Example 1, and are excellent in the unevenness embedding property.
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Abstract
Description
しかし、有機EL素子には、時間の経過とともに、発光輝度、発光効率、発光均一性等の発光特性が低下し易いという問題があった。
この発光特性の低下の問題の原因として、酸素や水分等が有機EL素子の内部に浸入し、電極や有機層を劣化させることが考えられたため、封止材を用いて有機EL素子を封止し、酸素や水分の浸入を防ぐことが行われてきた。
封止材を用いて有機EL素子を封止する場合、有機EL素子の微小な隙間や凹凸を埋め込む必要があることから、従来、低い粘度を有する封止材の開発が行われてきた。
特許文献1には、液状エポキシ樹脂と、液状のエポキシ樹脂硬化剤とを用い、かつ、フィラーの含有量を調整することで、低粘度と硬化物の高い耐湿性とを両立できることも記載されている。
したがって、シート状に成形し易い接着剤組成物であって、凹凸追従性に優れる接着剤層を形成し得るものが要望されていた。
(i)変性ポリオレフィン系樹脂、及び、1種又は2種以上の多官能エポキシ化合物を含有する接着剤組成物であって、変性ポリオレフィン系樹脂100質量部に対して、多官能エポキシ化合物の合計量が100質量部超であり、多官能エポキシ化合物の少なくとも1種が25℃において液体である接着剤組成物は、シート状に成形し易いものであること、(ii)この接着剤組成物を用いて形成される接着剤層は凹凸追従性に優れることを見出し、本発明を完成するに至った。
(1)下記の(A)成分、及び(B)成分を含有し、(C)成分を含有していてもよい接着剤組成物であって、(B)成分と(C)成分の合計量が、(A)成分100質量部に対して100質量部超であることを特徴とする接着剤組成物。
(A)成分:変性ポリオレフィン系樹脂
(B)成分:25℃において液体である多官能エポキシ化合物
(C)成分:25℃において固体である多官能エポキシ化合物
(2)前記(A)成分が、酸変性ポリオレフィン系樹脂である、(1)に記載の接着剤組成物。
(3)前記(B)成分と(C)成分の合計量が、前記(A)成分100質量部に対して100質量部超200質量部以下である、(1)又は(2)に記載の接着剤組成物。
(4)前記(C)成分を含有する、(1)~(3)のいずれかに記載の接着剤組成物。
(5)前記(B)成分と(C)成分の含有割合(質量比)が、〔(B)成分:(C)成分〕=100:1~1:1である、(4)に記載の接着剤組成物。
(6)さらに、下記の(D)成分を含有する、(1)~(5)のいずれかに記載の接着剤組成物。
(D)成分:軟化点が80℃以上の粘着付与剤
(7)前記(D)成分の含有量が、前記(A)成分100質量部に対して1~200質量部である、(6)に記載の接着剤組成物。
(8)さらに、下記の(E)成分を含有する、(1)~(7)のいずれかに記載の接着剤組成物。
(E)成分:イミダゾール系硬化触媒
(9)前記(E)成分の含有量が、前記(B)成分と(C)成分の合計量100質量部に対して1~10質量部である、(8)に記載の接着剤組成物。
(10)さらに、下記の(F)成分を含有する、(1)~(9)のいずれかに記載の接着剤組成物。
(F)成分:シランカップリング剤
(11)前記(F)成分の含有量が、前記(A)成分100質量部に対して0.01~10質量部である、(10)に記載の接着剤組成物。
(12)接着剤層を有する接着シートであって、前記接着剤層が、(1)~(11)のいずれかに記載の接着剤組成物を用いて形成されたものである接着シート。
(13)接着剤層の厚みが5~25μmである、(12)に記載の接着シート。
(14)さらに剥離フィルムを有する、(12)又は(13)に記載の接着シート。
(15)被封止物が、(12)~(14)のいずれかに記載の接着シートを用いて封止されてなる封止体。
(16)前記被封止物が、有機EL素子、有機ELディスプレイ素子、液晶ディスプレイ素子、又は太陽電池素子である、(15)に記載の封止体。
本発明の接着剤組成物は、下記の(A)成分、及び(B)成分を含有し、(C)成分を含有していてもよい接着剤組成物であって、(B)成分と(C)成分の合計量が、(A)成分100質量部に対して100質量部超であることを特徴とする。
(A)成分:変性ポリオレフィン系樹脂
(B)成分:25℃において液体である多官能エポキシ化合物
(C)成分:25℃において固体である多官能エポキシ化合物
本発明の接着剤組成物は、(A)成分として、変性ポリオレフィン系樹脂を含有する。
本発明の接着剤組成物は、変性ポリオレフィン系樹脂を含有することで、接着強度に優れたものとなる。また、変性ポリオレフィン系樹脂を含有する接着剤組成物を用いることで、比較的薄い接着剤層を効率よく形成することができる。
オレフィン系単量体と共重合可能な単量体としては、酢酸ビニル、(メタ)アクリル酸エステル、スチレン等が挙げられる。これらのオレフィン系単量体と共重合可能な単量体は、1種を単独で、あるいは2種以上を組み合わせて用いることができる。
官能基としては、カルボキシル基、カルボン酸無水物基、カルボン酸エステル基、水酸基、エポキシ基、アミド基、アンモニウム基、ニトリル基、アミノ基、イミド基、イソシアネート基、アセチル基、チオール基、エーテル基、チオエーテル基、スルホン基、ホスホン基、ニトロ基、ウレタン基、ハロゲン原子等が挙げられる。これらの中でも、カルボキシル基、カルボン酸無水物基、カルボン酸エステル基、水酸基、アンモニウム基、アミノ基、イミド基、イソシアネート基が好ましく、カルボン酸無水物基、アルコキシシリル基がより好ましく、カルボン酸無水物基が特に好ましい。
官能基を有する化合物は、分子内に2種以上の官能基を有していてもよい。
これらは、1種を単独で、あるいは2種以上を組み合わせて用いることができる。これらの中でも、接着強度により優れる接着剤組成物が得られ易いことから、無水マレイン酸が好ましい。
不飽和シラン化合物を主鎖であるポリオレフィン樹脂にグラフト重合させる場合の条件は、公知のグラフト重合の常法を採用すればよい。
変性ポリオレフィン系樹脂の数平均分子量(Mn)は、テトラヒドロフラン(THF)を溶媒として用いてゲルパーミエーションクロマトグラフィー(GPC)を行い、標準ポリスチレン換算値として求めることができる。
本発明の接着剤組成物は、(B)成分として、25℃において液体である多官能エポキシ化合物を含有する。
「25℃において液体である多官能エポキシ化合物」とは、25℃において、一定の体積をもつ(揮発する分を除く)が、定まった形をもたない多官能エポキシ化合物をいう。本発明に用いる「25℃において液体である多官能エポキシ化合物」の25℃における粘度は、通常、0.1~100,000mPa・s、好ましくは0.2~50,000mPa・s、より好ましくは0.3~10,000mPa・sである。
(B)成分は、接着剤組成物が高温になったときに、接着剤組成物の貯蔵弾性率を低下させる効果(以下、「貯蔵弾性率低下効果」ということがある。)を有する。このため、本発明の接着剤組成物を用いることで、凹凸追従性に優れる接着剤層を効率よく形成することができる。
(B)成分の多官能エポキシ化合物は、1種を単独で、あるいは2種以上を組み合わせて用いることができる。
(B)成分の多官能エポキシ化合物の分子量は、好ましくは700~5,000、より好ましくは1,200~4,500である。
分子量が700以上の(B)成分を含有する接着剤組成物を用いることで、より低アウトガス性の封止材が得られ易くなる。一方、分子量が5,000以下の(B)成分を含有する接着剤組成物は流動性により優れるため、そのような接着剤組成物を用いることで凹凸追従性により優れる接着剤層を形成し易くなる。
本発明の接着剤組成物は、(C)成分として、25℃において固体である多官能エポキシ化合物を含有していてもよい。
「25℃において固体である多官能エポキシ化合物」とは、25℃以上の温度領域に軟化点を有する多官能エポキシ樹脂である。
(C)成分の多官能エポキシ化合物は、(B)成分の多官能エポキシ化合物とは異なり、貯蔵弾性率低下効果をほとんど有しないと考えられる。このため、(B)成分の代わりに(C)成分を含有する接着剤組成物は、高温になっても貯蔵弾性率はほとんど低下しない。
しかしながら、(C)成分は、(B)成分と組み合わせて用いた場合、(B)成分が有する貯蔵弾性率低下効果をさらに高めることができる。この理由としては、(C)成分が存在することで、後述する海島構造の海の領域の割合が増加することが考えられる。
さらに、(C)成分は接着剤組成物の造膜性を向上させる効果も有するため、(C)成分を含有する接着剤組成物は、よりシート状に成形し易いものとなる。
したがって、本発明の接着剤組成物は、(C)成分を含有するものがより好ましい。
(C)成分の多官能エポキシ化合物は、1種を単独で、あるいは2種以上を組み合わせて用いることができる。
(C)成分の多官能エポキシ化合物の分子量は、好ましくは500~10,000、より好ましくは1,000~5,000である。
(B)成分と(C)成分の合計量が、(A)成分100質量部に対して100質量部超であることで、変性ポリオレフィン樹脂((A)成分)で構成された「島」と、多官能エポキシ化合物((B)成分と(C)成分)で構成された「海」とを有する海島構造の接着剤層を効率よく形成することができる。
このような海島構造の接着剤層は、加熱したときに貯蔵弾性率が大きく低下するため、凹凸追従性に優れる。
(B)成分に対する(C)成分の量が増えるに従って、接着剤組成物をシート状に成形したときに一定の形状が保たれ易くなる傾向がある。
(A)成分、(B)成分、(C)成分以外の成分としては、下記(D)成分、(E)成分、及び(F)成分が挙げられる。
(D)成分:軟化点が80℃以上の粘着付与剤
(E)成分:イミダゾール系硬化触媒
(F)成分:シランカップリング剤
(B)成分を含有する接着剤組成物は硬化前の貯蔵弾性率が低く、凹凸追従性に優れる。しかしながら、そのような接着剤組成物は、一定の形状を保ちにくく、シート状に成形するのが困難な場合がある。特に、(C)成分を含有しないときや、(C)成分の含有量が少ないときはシート状に成形するのが困難となり易い。このようなときは、(D)成分を含有させることで、成形性を改善することができる。
これらの粘着付与剤は、1種を単独で、あるいは2種以上を組み合わせて用いることができる。
イミダゾール系硬化触媒としては、2-メチルイミダゾール、2-フェニルイミダゾール、2-ウンデシルイミダゾール、2-ヘプタデシルイミダゾール、2-エチル-4-メチルイミダゾール、2-フェニル-4-メチルイミダゾール、2-フェニル-4-メチル-5-ヒドロキシメチルイミダゾール、2-フェニル-4,5-ジヒドロキシメチルイミダゾール等が挙げられる。これらの中でも、2-エチル-4-メチルイミダゾールが好ましい。
これらのイミダゾール系硬化触媒は、1種を単独で、あるいは2種以上を組み合わせて用いることができる。
シランカップリング剤としては、公知のシランカップリング剤を用いることができる。なかでも、分子内にアルコキシシリル基を少なくとも1個有する有機ケイ素化合物が好ましい。
シランカップリング剤としては、ビニルトリメトキシシラン、ビニルトリエトキシシラン、メタクリロキシプロピルトリメトキシシラン等の重合性不飽和基含有ケイ素化合物;3-グリシドキシプロピルトリメトキシシラン、8-グリシドキシオクチルトリメトキシシラン、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン等のエポキシ構造を有するケイ素化合物;3-アミノプロピルトリメトキシシラン、N-(2-アミノエチル)-3-アミノプロピルトリメトキシシラン、N-(2-アミノエチル)-8-アミノオクチルトリメトキシシラン、N-(2-アミノエチル)-3-アミノプロピルメチルジメトキシシラン等のアミノ基含有ケイ素化合物;3-クロロプロピルトリメトキシシラン;3-イソシアネートプロピルトリエトキシシラン、3-メルカプトプロピルトリメトキシシラン、3-トリメトキシシリルプロピルコハク酸無水物;等が挙げられる。
これらのシランカップリング剤は、1種単独で、あるいは2種以上を組み合わせて用いることができる。
溶媒としては、ベンゼン、トルエンなどの芳香族炭化水素系溶媒;酢酸エチル、酢酸ブチルなどのエステル系溶媒;アセトン、メチルエチルケトン、メチルイソブチルケトンなどのケトン系溶媒;n-ペンタン、n-ヘキサン、n-ヘプタンなどの脂肪族炭化水素系溶媒;シクロペンタン、シクロヘキサン、メチルシクロヘキサンなどの脂環式炭化水素系溶媒;等が挙げられる。
これらの溶媒は、1種単独で、あるいは2種以上を組み合わせて用いることができる。
溶媒の含有量は、塗工性等を考慮して適宜決定することができる。
その他の成分としては、紫外線吸収剤、帯電防止剤、光安定剤、酸化防止剤、樹脂安定剤、充填剤、顔料、増量剤、軟化剤等の添加剤が挙げられる。
これらは1種単独で、あるいは2種以上を組み合わせて用いることができる。
本発明の接着剤組成物がこれらの添加剤を含有する場合、その含有量は、目的に合わせて適宜決定することができる。
23℃における貯蔵弾性率が0.1MPa以上であることで、シート状に成形するのが容易である。一方、23℃における貯蔵弾性率が600MPa以下であることで、比較的柔軟で封止性に優れる接着剤層を形成することができる。
本明細書において、固形分とは、溶剤などの揮発する物質を除いた固形部分をいう。
また、80℃における貯蔵弾性率の下限は好ましくは1kPaである。80℃における貯蔵弾性率が1kPa以上である接着剤組成物は、ハンドリング性により優れる。
具体的には、(B)成分を加えることで、23℃及び80℃における貯蔵弾性率は低下する傾向がある。一方、(B)成分を加えすぎると、シート状に成形するのが困難になるおそれがある。この場合、適量の(C)成分を加えることで、成形性が向上するとともに、80℃における貯蔵弾性率を低下させることができる。
本発明の接着シートは、接着剤層を有する接着シートであって、前記接着剤層が、本発明の接着剤組成物を用いて形成されたものである。
厚みが上記範囲内にある接着剤層は、封止材として好適に用いられる。
剥離フィルムは、接着シートの製造工程においては支持体として機能するとともに、接着シートを使用するまでの間は、接着剤層の保護シートとして機能するものである。
本発明の接着シートを使用する際は、通常、剥離フィルムは剥離除去される。
剥離フィルム用の基材としては、グラシン紙、コート紙、上質紙等の紙基材;これらの紙基材にポリエチレン等の熱可塑性樹脂をラミネートしたラミネート紙;ポリエチレンテレフタレート樹脂、ポリブチレンテレフタレート樹脂、ポリエチレンナフタレート樹脂、ポリプロピレン樹脂、ポリエチレン樹脂等のプラスチックフィルム;等が挙げられる。
剥離剤としては、シリコーン系樹脂、オレフィン系樹脂、イソプレン系樹脂、ブタジエン系樹脂等のゴム系エラストマー、長鎖アルキル系樹脂、アルキド系樹脂、フッ素系樹脂等が挙げられる。
接着シートをキャスト法により製造する場合、公知の方法を用いて、本発明の接着剤組成物を剥離フィルムの剥離処理面に塗工し、得られた塗膜を乾燥することで、剥離フィルム付接着剤層を製造し、次いで、もう1枚の剥離フィルムを接着剤層上に重ねることで、接着シートを得ることができる。
塗膜を乾燥するときの乾燥条件としては、例えば80~150℃で30秒から5分間が挙げられる。
接着剤層を熱硬化させる際の条件は特に限定されない。
加熱温度は、通常、80~200℃、好ましくは90~150℃である。
加熱時間は、通常、30分から12時間、好ましくは1~6時間である。
23℃における引き剥がし接着強度は、JIS Z0237:2009に準拠し、温度23℃、相対湿度50%の環境下と温度85℃(湿度は制御なし)の環境下において、それぞれ、剥離角度180°の条件で剥離試験を行い、測定することができる。
硬化処理後の接着剤層の水蒸気透過率は、通常、0.1~200g・m-2・day-1、好ましくは1~150g・m-2・day-1である。
水蒸気透過率は、公知の水蒸気透過率測定装置を用いて測定することができる。
本発明の封止体は、被封止物が、本発明の接着シートを用いて封止されてなるものである。
本発明の封止体としては、例えば、基板と、該基板上に形成された素子(被封止物)と、該素子を封止するための封止材とを備えるものであって、前記封止材が本発明の接着シートの接着剤層由来のもの(接着剤層の硬化物)であるものが挙げられる。
基板の厚さは特に制限されず、光の透過率や、素子内外を遮断する性能を勘案して、適宜選択することができる。
次いで、この接着剤層を硬化させることにより、本発明の封止体を製造することができる。
接着剤層を硬化させる際の硬化条件としては、先に説明した条件を利用することができる。
したがって、本発明の封止体は、長期にわたって被封止物の性能が維持されるものである。
各例中の部及び%は、特に断りのない限り、質量基準である。
酸変性ポリオレフィン系樹脂(酸変性α-オレフィン重合体、三井化学社製、商品名:ユニストールH-200、数平均分子量:47,000)100部、多官能エポキシ化合物(1)(水添ビスフェノールA型エポキシ樹脂、三菱化学社製、商品名:YX8034、25℃において液体、エポキシ当量270g/eq、25℃における粘度:9000mPa・s)125部、粘着付与剤(スチレン系モノマー脂肪族系モノマー共重合体、軟化点95℃、三井化学社製、商品名:FTR6100)50部、及び、イミダゾール系硬化触媒(四国化成社製、商品名:キュアゾール2E4MZ、2-エチル-4-メチルイミダゾール)1.25部をメチルエチルケトンに溶解し、固形分濃度32%の接着剤組成物1を調製した。
この接着剤組成物1を剥離フィルム(リンテック社製、商品名:SP-PET382150)の剥離処理面上に塗工し、得られた塗膜を100℃で2分間乾燥し、厚みが12μmの接着剤層を形成し、その上に、もう1枚の剥離フィルム(リンテック社製、商品名:SP-PET381031)の剥離処理面を貼り合わせて接着シート1を得た。
実施例1において、多官能エポキシ化合物(1)の量を150部に変更し、イミダゾール系硬化触媒の量を1.5部に変更したことを除き、実施例1と同様にして接着シート2を得た。
酸変性ポリオレフィン系樹脂(酸変性α-オレフィン重合体、三井化学社製、商品名:ユニストールH-200、数平均分子量:47,000)100部、多官能エポキシ化合物(2)(水添ビスフェノールA型エポキシ樹脂、三菱化学社製、商品名:YX8000、25℃において液体、エポキシ当量:205g/eq、25℃における粘度:1900mPa・s)100部、多官能エポキシ化合物(3)(水添ビスフェノールA型エポキシ樹脂、三菱化学社製、商品名:YX8040、25℃において固体、エポキシ当量:1100g/eq、軟化点:84℃)25部、イミダゾール系硬化触媒(四国化成社製、商品名:キュアゾール2E4MZ、2-エチル-4-メチルイミダゾール)1部、及び、シランカップリング剤(信越化学工業社製、商品名:KBM4803)0.1部をメチルエチルケトンに溶解し、固形分濃度25%の接着剤組成物2を調製した。
この接着剤組成物2を剥離フィルム(リンテック社製、商品名:SP-PET382150)の剥離処理面上に塗工し、得られた塗膜を100℃で2分間乾燥し、厚みが12μmの接着剤層を形成し、その上に、もう1枚の剥離フィルム(リンテック社製、商品名:SP-PET381031)の剥離処理面を貼り合わせて接着シート3を得た。
実施例3において、多官能エポキシ化合物(3)の量を50部に変更したことを除き、実施例3と同様にして、接着剤組成物3を調製し、これを用いて接着シート4を得た。
実施例1において、多官能エポキシ化合物(1)の量を100部に変更し、イミダゾール系硬化触媒の量を1.0部に変更したことを除き、実施例1と同様にして接着シート5を得た。
〔貯蔵弾性率測定〕
実施例又は比較例で得た接着シートの接着剤層を重ねて、ヒートラミネーターを用いて23℃で積層し、厚み1mmの積層体を得た。この積層体をサンプルとして用いて、貯蔵弾性率測定装置(Anton Paar社製、Physica MCR301)により、周波数1Hz、23~150℃の温度範囲で硬化前の接着剤層の貯蔵弾性率を測定した。
23℃、80℃における貯蔵弾性率を第1表に示す。
実施例又は比較例で得た接着シートの接着剤層と厚み25μmのポリエチレンテレフタレートフィルム(PET)を重ね、PET付き接着剤層を得た。
一方で、ガラス基板上に厚み10μmのポリエチレンテレフタレートの小片(疑似デバイス)を静置した。上記のPET付き接着剤層を、その接着剤層がガラス基板に対向する向きで、ガラス基板上の疑似デバイスが完全に覆われるように、ガラス基板に重ねた。次いで、これらを、ヒートラミネーターを用いて60℃に加熱した後、100℃、2時間の条件で接着剤層を硬化させた。
このものを光学顕微鏡で観察し、凹凸に対する浮きの有無を調べ、凹凸埋め込み性を以下の基準で評価した。
○:浮きが無い。
×:浮きがある。
評価結果を第1表に示す。
実施例1~4の接着シートは、変性ポリオレフィン系樹脂より、多官能エポキシ化合物をより多く含有するものである。また、実施例3、4の接着シートは25℃において液体である多官能エポキシ化合物と25℃において固体である多官能エポキシ化合物の両方を含むものである。これらの接着シートは、比較例1の接着シートに比べて80℃における貯蔵弾性率がより低く、凹凸埋め込み性に優れている。
Claims (16)
- 下記の(A)成分、及び(B)成分を含有し、(C)成分を含有していてもよい接着剤組成物であって、(B)成分と(C)成分の合計量が、(A)成分100質量部に対して100質量部超であることを特徴とする接着剤組成物。
(A)成分:変性ポリオレフィン系樹脂
(B)成分:25℃において液体である多官能エポキシ化合物
(C)成分:25℃において固体である多官能エポキシ化合物 - 前記(A)成分が、酸変性ポリオレフィン系樹脂である、請求項1に記載の接着剤組成物。
- 前記(B)成分と(C)成分の合計量が、前記(A)成分100質量部に対して100質量部超200質量部以下である、請求項1又は2に記載の接着剤組成物。
- 前記(C)成分を含有する、請求項1~3のいずれかに記載の接着剤組成物。
- 前記(B)成分と(C)成分の含有割合(質量比)が、〔(B)成分:(C)成分〕=100:1~1:1である、請求項4に記載の接着剤組成物。
- さらに、下記の(D)成分を含有する、請求項1~5のいずれかに記載の接着剤組成物。
(D)成分:軟化点が80℃以上の粘着付与剤 - 前記(D)成分の含有量が、前記(A)成分100質量部に対して1~200質量部である、請求項6に記載の接着剤組成物。
- さらに、下記の(E)成分を含有する、請求項1~7のいずれかに記載の接着剤組成物。
(E)成分:イミダゾール系硬化触媒 - 前記(E)成分の含有量が、前記(B)成分と(C)成分の合計量100質量部に対して1~10質量部である、請求項8に記載の接着剤組成物。
- さらに、下記の(F)成分を含有する、請求項1~9のいずれかに記載の接着剤組成物。
(F)成分:シランカップリング剤 - 前記(F)成分の含有量が、前記(A)成分100質量部に対して0.01~10質量部である、請求項10に記載の接着剤組成物。
- 接着剤層を有する接着シートであって、
前記接着剤層が、請求項1~11のいずれかに記載の接着剤組成物を用いて形成されたものである接着シート。 - 接着剤層の厚みが5~25μmである、請求項12に記載の接着シート。
- さらに剥離フィルムを有する、請求項12又は13に記載の接着シート。
- 被封止物が、請求項12~14のいずれかに記載の接着シートを用いて封止されてなる封止体。
- 前記被封止物が、有機EL素子、有機ELディスプレイ素子、液晶ディスプレイ素子、又は太陽電池素子である、請求項15に記載の封止体。
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CN113993958B (zh) * | 2019-06-14 | 2024-01-05 | 琳得科株式会社 | 器件密封用粘接片 |
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KR20200015452A (ko) | 2020-02-12 |
JPWO2018221573A1 (ja) | 2020-04-02 |
KR102487141B1 (ko) | 2023-01-10 |
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