JP6221403B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP6221403B2
JP6221403B2 JP2013133261A JP2013133261A JP6221403B2 JP 6221403 B2 JP6221403 B2 JP 6221403B2 JP 2013133261 A JP2013133261 A JP 2013133261A JP 2013133261 A JP2013133261 A JP 2013133261A JP 6221403 B2 JP6221403 B2 JP 6221403B2
Authority
JP
Japan
Prior art keywords
light emitting
light
white resist
emitting element
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013133261A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015008237A5 (https=
JP2015008237A (ja
Inventor
祐太 岡
祐太 岡
岡田　聡
岡田　　聡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2013133261A priority Critical patent/JP6221403B2/ja
Priority to US14/315,437 priority patent/US9385288B2/en
Publication of JP2015008237A publication Critical patent/JP2015008237A/ja
Publication of JP2015008237A5 publication Critical patent/JP2015008237A5/ja
Application granted granted Critical
Publication of JP6221403B2 publication Critical patent/JP6221403B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
JP2013133261A 2013-06-26 2013-06-26 発光装置 Active JP6221403B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013133261A JP6221403B2 (ja) 2013-06-26 2013-06-26 発光装置
US14/315,437 US9385288B2 (en) 2013-06-26 2014-06-26 Light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013133261A JP6221403B2 (ja) 2013-06-26 2013-06-26 発光装置

Publications (3)

Publication Number Publication Date
JP2015008237A JP2015008237A (ja) 2015-01-15
JP2015008237A5 JP2015008237A5 (https=) 2016-08-04
JP6221403B2 true JP6221403B2 (ja) 2017-11-01

Family

ID=52338326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013133261A Active JP6221403B2 (ja) 2013-06-26 2013-06-26 発光装置

Country Status (2)

Country Link
US (1) US9385288B2 (https=)
JP (1) JP6221403B2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6102187B2 (ja) * 2012-10-31 2017-03-29 日亜化学工業株式会社 発光装置用パッケージ及びそれを用いた発光装置
JP6107136B2 (ja) 2012-12-29 2017-04-05 日亜化学工業株式会社 発光装置用パッケージ及びそれを備える発光装置、並びにその発光装置を備える照明装置
JP6484396B2 (ja) 2013-06-28 2019-03-13 日亜化学工業株式会社 発光装置用パッケージ及びそれを用いた発光装置
KR102160075B1 (ko) 2014-04-22 2020-09-25 서울반도체 주식회사 발광 장치
JP6736256B2 (ja) * 2015-03-23 2020-08-05 ローム株式会社 Ｌｅｄパッケージ
JP2016207739A (ja) * 2015-04-17 2016-12-08 株式会社東芝 半導体発光装置及びその製造方法
JP6459880B2 (ja) 2015-09-30 2019-01-30 日亜化学工業株式会社 発光装置及びその製造方法
JP6213582B2 (ja) * 2016-01-22 2017-10-18 日亜化学工業株式会社 発光装置
US11600754B2 (en) * 2018-11-29 2023-03-07 Lumileds Llc Light-emitting device and method of packaging the same
JP6974741B2 (ja) * 2018-12-26 2021-12-01 日亜化学工業株式会社 樹脂パッケージ及び発光装置
JP7417031B2 (ja) * 2019-03-27 2024-01-18 日亜化学工業株式会社 発光装置
JP7790949B2 (ja) * 2021-12-09 2025-12-23 ローム株式会社 半導体発光装置
JP7783041B2 (ja) * 2021-12-21 2025-12-09 ローム株式会社 半導体装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3655267B2 (ja) 2002-07-17 2005-06-02 株式会社東芝 半導体発光装置
JP4049186B2 (ja) 2006-01-26 2008-02-20 ソニー株式会社 光源装置
JP2007324205A (ja) * 2006-05-30 2007-12-13 Toyoda Gosei Co Ltd 発光装置
JP2008060344A (ja) 2006-08-31 2008-03-13 Toshiba Corp 半導体発光装置
JP4107349B2 (ja) 2007-06-20 2008-06-25 ソニー株式会社 光源装置、表示装置
JP4862795B2 (ja) * 2007-09-27 2012-01-25 豊田合成株式会社 光源装置
JP2009252778A (ja) * 2008-04-01 2009-10-29 Sharp Corp 半導体パッケージの製造方法
JPWO2010150830A1 (ja) * 2009-06-23 2012-12-10 旭硝子株式会社 発光装置
JP2011044593A (ja) * 2009-08-21 2011-03-03 Hitachi Chem Co Ltd Ｌｅｄ基板及びｌｅｄパッケージ
JP5528900B2 (ja) * 2010-04-30 2014-06-25 ローム株式会社 発光素子モジュール
JP5940775B2 (ja) * 2010-08-27 2016-06-29 ローム株式会社 液晶表示装置バックライト用ｌｅｄ光源装置および液晶表示装置
JP5886584B2 (ja) * 2010-11-05 2016-03-16 ローム株式会社 半導体発光装置
JP5669525B2 (ja) * 2010-11-08 2015-02-12 スタンレー電気株式会社 半導体発光装置
JP5638922B2 (ja) 2010-11-17 2014-12-10 パナソニック株式会社 発光装置および発光装置を備える照明装置
JP5985846B2 (ja) * 2011-06-29 2016-09-06 Ｆｌｅｘｃｅｅｄ株式会社 発光素子搭載用基板及びｌｅｄパッケージ
JP5831013B2 (ja) * 2011-07-28 2015-12-09 日亜化学工業株式会社 発光装置の製造方法および発光装置
JP5818149B2 (ja) * 2011-09-09 2015-11-18 大日本印刷株式会社 樹脂付リードフレーム、半導体装置、照明装置、樹脂付リードフレームの製造方法および半導体装置の製造方法
JP2013089717A (ja) 2011-10-17 2013-05-13 Rohm Co Ltd Ｌｅｄモジュール
EP2858132B1 (en) * 2012-05-31 2017-09-13 Panasonic Intellectual Property Management Co., Ltd. Led module

Also Published As

Publication number Publication date
US9385288B2 (en) 2016-07-05
US20150021640A1 (en) 2015-01-22
JP2015008237A (ja) 2015-01-15

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