JP6217958B2 - 半導体チップの実装装置 - Google Patents

半導体チップの実装装置 Download PDF

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Publication number
JP6217958B2
JP6217958B2 JP2012241517A JP2012241517A JP6217958B2 JP 6217958 B2 JP6217958 B2 JP 6217958B2 JP 2012241517 A JP2012241517 A JP 2012241517A JP 2012241517 A JP2012241517 A JP 2012241517A JP 6217958 B2 JP6217958 B2 JP 6217958B2
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JP
Japan
Prior art keywords
support table
head
semiconductor chip
substrate
camera
Prior art date
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Application number
JP2012241517A
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English (en)
Japanese (ja)
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JP2013115428A (ja
JP2013115428A5 (https=
Inventor
ルディ グリューター
ルディ グリューター
グイド ズター
グイド ズター
Original Assignee
エセック アーゲー
エセック アーゲー
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Publication of JP2013115428A publication Critical patent/JP2013115428A/ja
Publication of JP2013115428A5 publication Critical patent/JP2013115428A5/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012241517A 2011-11-25 2012-11-01 半導体チップの実装装置 Active JP6217958B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01886/11A CH705802B1 (de) 2011-11-25 2011-11-25 Einrichtung für die Montage von Halbleiterchips.
CH01886/11 2011-11-25

Publications (3)

Publication Number Publication Date
JP2013115428A JP2013115428A (ja) 2013-06-10
JP2013115428A5 JP2013115428A5 (https=) 2015-12-17
JP6217958B2 true JP6217958B2 (ja) 2017-10-25

Family

ID=48366057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012241517A Active JP6217958B2 (ja) 2011-11-25 2012-11-01 半導体チップの実装装置

Country Status (10)

Country Link
US (1) US9603294B2 (https=)
JP (1) JP6217958B2 (https=)
KR (1) KR101991965B1 (https=)
CN (1) CN103137526B (https=)
CH (1) CH705802B1 (https=)
DE (1) DE102012110604B4 (https=)
FR (1) FR2983344B1 (https=)
MY (1) MY160071A (https=)
SG (1) SG190511A1 (https=)
TW (1) TWI555110B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015038074A1 (en) * 2013-09-13 2015-03-19 Orion Systems Integration Pte Ltd System and method for positioning a semiconductor chip with a bond head, thermal bonding system and method
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
WO2016017029A1 (ja) * 2014-08-01 2016-02-04 富士機械製造株式会社 部品装着方法および部品装着装置
CH711536B1 (de) * 2015-08-31 2019-02-15 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
DE102016113328B4 (de) 2015-08-31 2018-07-19 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats
DE102015220746A1 (de) * 2015-10-23 2017-04-27 Ersa Gmbh Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile
JP7164314B2 (ja) * 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
JP7340774B2 (ja) * 2019-05-23 2023-09-08 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品圧着方法
CN113471107B (zh) * 2021-06-29 2022-04-19 深圳新益昌科技股份有限公司 固晶机及固晶方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5251266A (en) * 1990-08-27 1993-10-05 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly
US5799858A (en) * 1995-09-16 1998-09-01 Samsung Aerospace Industries, Ltd. Die bonding device
KR0175267B1 (ko) * 1995-09-30 1999-04-01 김광호 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치
JP2000505598A (ja) * 1996-02-29 2000-05-09 アルファセム・アクチェンゲゼルシャフト 部品を受け取り、位置付け、組み立てるための方法及び装置
JP2002271093A (ja) * 2001-03-07 2002-09-20 Fuji Mach Mfg Co Ltd 電気部品装着システム
JP2003086611A (ja) 2001-09-07 2003-03-20 Heiwa Kinzoku Kogyo Kk Ｉｃダイボンド装置
JP3636127B2 (ja) * 2001-10-12 2005-04-06 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
TW567574B (en) 2001-12-05 2003-12-21 Esec Trading Sa Apparatus for mounting semiconductor chips
SG104292A1 (en) 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
US7033842B2 (en) * 2002-03-25 2006-04-25 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
JP2004179517A (ja) * 2002-11-28 2004-06-24 Shinkawa Ltd ボンディング装置、ボンディング方法及びボンディングプログラム
DE50304286D1 (de) 2003-05-21 2006-08-31 Unaxis Int Trading Ltd Halbleiter-Montageeinrichtung
TWI231561B (en) 2003-05-21 2005-04-21 Esec Trading Sa Apparatus for mounting semiconductors
JP4156460B2 (ja) * 2003-07-09 2008-09-24 Ｔｄｋ株式会社 ワークのピックアップ方法及びその装置、実装機
EP1676475A1 (en) * 2003-10-24 2006-07-05 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
JP4111160B2 (ja) * 2004-03-26 2008-07-02 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
US8137050B2 (en) * 2005-09-29 2012-03-20 Semiconductor Energy Laboratory Co., Ltd. Pickup device and pickup method
KR101248719B1 (ko) * 2006-04-12 2013-03-28 쿨릭케 운트 소파 다이 본딩 게엠베하 전자 부품의 배치 방법 및 장치
KR20080041471A (ko) 2006-11-07 2008-05-13 삼성전자주식회사 다이 본더
CH698718B1 (de) * 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag Vorrichtung für die Montage eines Flipchips auf einem Substrat.
WO2009047214A2 (en) 2007-10-09 2009-04-16 Oerlikon Assembly Equipment Ag, Steinhausen Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
CN101884089B (zh) 2007-12-03 2012-02-08 松下电器产业株式会社 芯片安装系统
JP4946989B2 (ja) * 2008-07-07 2012-06-06 パナソニック株式会社 電子部品ボンディング装置
JP4788759B2 (ja) * 2008-11-20 2011-10-05 パナソニック株式会社 部品実装装置
CN101842000B (zh) * 2009-03-19 2014-04-30 鸿富锦精密工业（深圳）有限公司 贴附装置及使用该贴附装置的贴附方法
JP4766144B2 (ja) * 2009-04-08 2011-09-07 パナソニック株式会社 電子部品実装装置

Also Published As

Publication number Publication date
FR2983344A1 (fr) 2013-05-31
DE102012110604B4 (de) 2024-05-23
US20130133188A1 (en) 2013-05-30
CN103137526B (zh) 2017-12-19
JP2013115428A (ja) 2013-06-10
DE102012110604A1 (de) 2013-05-29
CH705802A1 (de) 2013-05-31
CN103137526A (zh) 2013-06-05
KR101991965B1 (ko) 2019-06-21
TW201330154A (zh) 2013-07-16
US9603294B2 (en) 2017-03-21
SG190511A1 (en) 2013-06-28
MY160071A (en) 2017-02-15
KR20130058628A (ko) 2013-06-04
CH705802B1 (de) 2016-04-15
FR2983344B1 (fr) 2019-01-25
TWI555110B (zh) 2016-10-21

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