CN103137526B - 用于安装半导体芯片的设备 - Google Patents

用于安装半导体芯片的设备 Download PDF

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Publication number
CN103137526B
CN103137526B CN201210483718.1A CN201210483718A CN103137526B CN 103137526 B CN103137526 B CN 103137526B CN 201210483718 A CN201210483718 A CN 201210483718A CN 103137526 B CN103137526 B CN 103137526B
Authority
CN
China
Prior art keywords
pick
support table
head
semiconductor chips
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210483718.1A
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English (en)
Chinese (zh)
Other versions
CN103137526A (zh
Inventor
鲁埃迪·格吕特尔
吉多·祖特尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Esec AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec AG filed Critical Esec AG
Publication of CN103137526A publication Critical patent/CN103137526A/zh
Application granted granted Critical
Publication of CN103137526B publication Critical patent/CN103137526B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201210483718.1A 2011-11-25 2012-11-23 用于安装半导体芯片的设备 Active CN103137526B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01886/11A CH705802B1 (de) 2011-11-25 2011-11-25 Einrichtung für die Montage von Halbleiterchips.
CH01886/11 2011-11-25

Publications (2)

Publication Number Publication Date
CN103137526A CN103137526A (zh) 2013-06-05
CN103137526B true CN103137526B (zh) 2017-12-19

Family

ID=48366057

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210483718.1A Active CN103137526B (zh) 2011-11-25 2012-11-23 用于安装半导体芯片的设备

Country Status (10)

Country Link
US (1) US9603294B2 (https=)
JP (1) JP6217958B2 (https=)
KR (1) KR101991965B1 (https=)
CN (1) CN103137526B (https=)
CH (1) CH705802B1 (https=)
DE (1) DE102012110604B4 (https=)
FR (1) FR2983344B1 (https=)
MY (1) MY160071A (https=)
SG (1) SG190511A1 (https=)
TW (1) TWI555110B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015038074A1 (en) * 2013-09-13 2015-03-19 Orion Systems Integration Pte Ltd System and method for positioning a semiconductor chip with a bond head, thermal bonding system and method
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
WO2016017029A1 (ja) * 2014-08-01 2016-02-04 富士機械製造株式会社 部品装着方法および部品装着装置
CH711536B1 (de) * 2015-08-31 2019-02-15 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
DE102016113328B4 (de) 2015-08-31 2018-07-19 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats
DE102015220746A1 (de) * 2015-10-23 2017-04-27 Ersa Gmbh Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile
JP7164314B2 (ja) * 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
JP7340774B2 (ja) * 2019-05-23 2023-09-08 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品圧着方法
CN113471107B (zh) * 2021-06-29 2022-04-19 深圳新益昌科技股份有限公司 固晶机及固晶方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101740418A (zh) * 2008-11-20 2010-06-16 松下电器产业株式会社 元件安装设备和元件安装方法

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US5251266A (en) * 1990-08-27 1993-10-05 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly
US5799858A (en) * 1995-09-16 1998-09-01 Samsung Aerospace Industries, Ltd. Die bonding device
KR0175267B1 (ko) * 1995-09-30 1999-04-01 김광호 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치
JP2000505598A (ja) * 1996-02-29 2000-05-09 アルファセム・アクチェンゲゼルシャフト 部品を受け取り、位置付け、組み立てるための方法及び装置
JP2002271093A (ja) * 2001-03-07 2002-09-20 Fuji Mach Mfg Co Ltd 電気部品装着システム
JP2003086611A (ja) 2001-09-07 2003-03-20 Heiwa Kinzoku Kogyo Kk Ｉｃダイボンド装置
JP3636127B2 (ja) * 2001-10-12 2005-04-06 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
TW567574B (en) 2001-12-05 2003-12-21 Esec Trading Sa Apparatus for mounting semiconductor chips
SG104292A1 (en) 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
US7033842B2 (en) * 2002-03-25 2006-04-25 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
JP2004179517A (ja) * 2002-11-28 2004-06-24 Shinkawa Ltd ボンディング装置、ボンディング方法及びボンディングプログラム
DE50304286D1 (de) 2003-05-21 2006-08-31 Unaxis Int Trading Ltd Halbleiter-Montageeinrichtung
TWI231561B (en) 2003-05-21 2005-04-21 Esec Trading Sa Apparatus for mounting semiconductors
JP4156460B2 (ja) * 2003-07-09 2008-09-24 Ｔｄｋ株式会社 ワークのピックアップ方法及びその装置、実装機
EP1676475A1 (en) * 2003-10-24 2006-07-05 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
JP4111160B2 (ja) * 2004-03-26 2008-07-02 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
US8137050B2 (en) * 2005-09-29 2012-03-20 Semiconductor Energy Laboratory Co., Ltd. Pickup device and pickup method
KR101248719B1 (ko) * 2006-04-12 2013-03-28 쿨릭케 운트 소파 다이 본딩 게엠베하 전자 부품의 배치 방법 및 장치
KR20080041471A (ko) 2006-11-07 2008-05-13 삼성전자주식회사 다이 본더
CH698718B1 (de) * 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag Vorrichtung für die Montage eines Flipchips auf einem Substrat.
WO2009047214A2 (en) 2007-10-09 2009-04-16 Oerlikon Assembly Equipment Ag, Steinhausen Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
CN101884089B (zh) 2007-12-03 2012-02-08 松下电器产业株式会社 芯片安装系统
JP4946989B2 (ja) * 2008-07-07 2012-06-06 パナソニック株式会社 電子部品ボンディング装置
CN101842000B (zh) * 2009-03-19 2014-04-30 鸿富锦精密工业（深圳）有限公司 贴附装置及使用该贴附装置的贴附方法
JP4766144B2 (ja) * 2009-04-08 2011-09-07 パナソニック株式会社 電子部品実装装置

Patent Citations (1)

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CN101740418A (zh) * 2008-11-20 2010-06-16 松下电器产业株式会社 元件安装设备和元件安装方法

Also Published As

Publication number Publication date
FR2983344A1 (fr) 2013-05-31
DE102012110604B4 (de) 2024-05-23
US20130133188A1 (en) 2013-05-30
JP2013115428A (ja) 2013-06-10
DE102012110604A1 (de) 2013-05-29
CH705802A1 (de) 2013-05-31
CN103137526A (zh) 2013-06-05
KR101991965B1 (ko) 2019-06-21
TW201330154A (zh) 2013-07-16
US9603294B2 (en) 2017-03-21
SG190511A1 (en) 2013-06-28
MY160071A (en) 2017-02-15
KR20130058628A (ko) 2013-06-04
JP6217958B2 (ja) 2017-10-25
CH705802B1 (de) 2016-04-15
FR2983344B1 (fr) 2019-01-25
TWI555110B (zh) 2016-10-21

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