JP6208410B2 - 封止体の作製方法 - Google Patents
封止体の作製方法 Download PDFInfo
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- JP6208410B2 JP6208410B2 JP2012134032A JP2012134032A JP6208410B2 JP 6208410 B2 JP6208410 B2 JP 6208410B2 JP 2012134032 A JP2012134032 A JP 2012134032A JP 2012134032 A JP2012134032 A JP 2012134032A JP 6208410 B2 JP6208410 B2 JP 6208410B2
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- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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Description
本実施の形態では、本発明の一態様の封止体の作製方法について、図1乃至図3を用いて説明する。
図1(A)乃至(D)、図2(A)、(B)は本作製方法例で例示する封止体の作製方法を説明する図である。それぞれの図において、上面概略図と断面概略図を並べて明示している。
ここで、フリットペーストに導電性の材料を含有させることにより、上述の発熱層113を設けることなく、誘導加熱法によりフリットペースト自体を焼成することができる。以下では、導電性材料を含むフリットペーストを用いた封止体の作製方法について図3を用いて説明する。なお、作製方法例1と重複する部分については説明を省略するか、簡略化して説明するものとする。
本実施の形態では、実施の形態1で例示した本発明の一態様の封止体の作製方法を、発光装置に適用する例について説明する。本実施の形態では、耐熱性の低い材料が設けられた発光装置、特にカラーフィルタが適用された発光装置の作製方法について、図4を用いて説明する。
図4(A)乃至(D)は本作製方法例で例示する発光装置の作製方法を説明する図である。それぞれの図において、上面概略図と断面概略図を並べて明示している。
本実施の形態では、本発明の一態様の封止体の作製方法に適用可能な発光ユニットの構成例について、図5及び図6を用いて説明する。
本構成例では、パッシブマトリクス型の発光ユニットについて例示する。図5(A)は、本構成例で例示するパッシブマトリクス型の発光ユニット300の上面概略図であり、図5(B)は、図5(A)中の切断線A−A’における断面概略図である。
続いて本構成例では、アクティブマトリクス型の発光ユニットに本発明のガラスフリットを用いた封止方法を適用した構成ついて例示する。図6(A)は、本構成例で例示するアクティブマトリクス型の発光ユニットが適用された発光装置350の上面概略図であり、図6(B)は、図6(A)中の切断線B−B’における断面概略図である。
本実施の形態では、本発明の一態様に適用できるEL層の一例について、図7を用いて説明する。
本実施の形態では、本発明の一態様の封止体の作製方法が適用された発光装置を有する電子機器や照明装置の例について、図8を用いて説明する。
101 第2の基板
103 第1の電極
105 EL層
107 第2の電極
111 第1の基板
113 発熱層
115 フリットペースト
117 ガラスフリット
119 ガラスフリット
121 シール材
123 シール材
131 誘導加熱装置
133 コイル
135 紫外光
137 遮蔽板
141 レーザ光
150 封止体
155 フリットペースト
157 ガラスフリット
159 ガラスフリット
180 発光装置
181 カラーフィルタ
183 発光ユニット
300 発光ユニット
301 基板
302 下地層
303 走査線
305 EL層
307 データ線
308 絶縁層
309 隔壁
311 FPC
312 接続配線
313 入力端子
315 領域
350 発光装置
351 第2の基板
352 画素部
353 駆動回路部
354 駆動回路部
355 引き出し配線
356 FPC
358 発熱層
359 ガラスフリット
361 第1の基板
371 TFT
372 TFT
373 TFT
374 TFT
375 下部電極
376 EL層
377 上部電極
378 絶縁層
379 発光素子
381 カラーフィルタ
382 ブラックマトリックス
383 オーバーコート
701 正孔注入層
702 正孔輸送層
703 発光性の有機化合物を含む層
704 電子輸送層
705 電子注入層
706 電子注入バッファー層
707 電子リレー層
708 複合材料層
800 第1のEL層
801 第2のEL層
803 電荷発生層
7100 テレビジョン装置
7101 筐体
7103 表示部
7105 スタンド
7107 表示部
7109 操作キー
7110 リモコン操作機
7201 本体
7202 筐体
7203 表示部
7204 キーボード
7205 外部接続ポート
7206 ポインティングデバイス
7301 筐体
7302 筐体
7303 連結部
7304 表示部
7305 表示部
7306 スピーカ部
7307 記録媒体挿入部
7308 LEDランプ
7309 操作キー
7310 接続端子
7311 センサ
7312 マイクロフォン
7400 携帯電話機
7401 筐体
7402 表示部
7403 操作ボタン
7404 外部接続ポート
7405 スピーカ
7406 マイク
7500 照明装置
7501 筐体
7503 発光装置
Claims (2)
- 第1の基板の上方に導電層を形成する工程と、
前記導電層の上方に、フリット材とバインダとを含むフリットペーストを形成する工程と、
前記導電層を誘導加熱で加熱して、前記バインダを除去すると共に前記フリット材を融合してガラスフリットを形成する工程と、
前記ガラスフリットの外側に樹脂層を形成する工程と、
前記ガラスフリット及び前記樹脂層と第2の基板とを密着させ、減圧雰囲気下で前記樹脂層に紫外光を照射した後、大気圧下で前記ガラスフリットにレーザ光を照射して、前記ガラスフリットと前記第2の基板とを融着させる工程と、
を有することを特徴とする封止体の作製方法。 - 第1の基板の上方に導電層を形成する工程と、
前記導電層の上方に、フリット材とバインダを含むフリットペーストを、閉曲線を成すように形成する工程と、
前記導電層を誘導加熱で加熱して、前記バインダを除去すると共に前記フリット材を融合してガラスフリットを形成する工程と、
前記ガラスフリットと第2の基板とを密着させ、前記ガラスフリットにレーザ光を照射して、前記ガラスフリットと前記第2の基板とを融着させ、前記第1の基板と前記第2の基板と前記ガラスフリットと前記導電層とで囲まれる閉空間を形成する工程と、を有し、
前記レーザ光の照射により、前記導電層が加熱され、前記ガラスフリットを間接的に加熱することを特徴とする封止体の作製方法。
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TWI702483B (zh) | 2018-02-06 | 2020-08-21 | 日商三菱電機股份有限公司 | 伺服系統、感測器集線器及產業用裝置之診斷方法 |
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US9202843B2 (en) | 2015-12-01 |
JP2018006349A (ja) | 2018-01-11 |
KR102038844B1 (ko) | 2019-10-31 |
JP2013020964A (ja) | 2013-01-31 |
US20140361320A1 (en) | 2014-12-11 |
KR20120139557A (ko) | 2012-12-27 |
JP2019140128A (ja) | 2019-08-22 |
US20120319092A1 (en) | 2012-12-20 |
US8816336B2 (en) | 2014-08-26 |
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