JP6182501B2 - 端子及び電線接続構造体 - Google Patents
端子及び電線接続構造体 Download PDFInfo
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- JP6182501B2 JP6182501B2 JP2014089852A JP2014089852A JP6182501B2 JP 6182501 B2 JP6182501 B2 JP 6182501B2 JP 2014089852 A JP2014089852 A JP 2014089852A JP 2014089852 A JP2014089852 A JP 2014089852A JP 6182501 B2 JP6182501 B2 JP 6182501B2
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- Prior art keywords
- layer
- metal layer
- terminal
- welding
- white metal
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- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B23K26/32—Bonding taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49215—Metal by impregnating a porous mass
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Description
(1)銅又は銅合金からなる基材と、前記基材上の一部または全部に設けられた白色系金属層と、前記白色系金属層上に設けられた油膜を有する金属部材から形成される端子であって、前記白色系金属層の厚さは0.01〜0.80μmであり、前記白色系金属層の表面の算術平均粗さは0.6〜1.2μmであり、前記油膜の電気二重層容量が1.5〜7.0μF/cm2であり、他の端子と嵌合するコネクタ部と、電線と圧着接合する管状圧着部と、前記コネクタ部と前記管状圧着部とをつなぐトランジション部とを有し、前記管状圧着部が段差形状を有することを特徴とする端子。
(2)前記白色系金属層が、Sn層、Sn合金層、Ni層及びNi合金層からなる群から選ばれる少なくとも1つの層である、(1)に記載の端子。
(3)(1)又は(2)に記載の端子と、被覆電線とを圧着接合して形成した電線接続構造体。
(4)前記被覆電線の導体部がアルミニウムまたはアルミニウム合金からなる、(3)に記載の電線接続構造体。
基材2は、銅(タフピッチ銅や無酸素銅など)または銅合金であり、好ましくは銅合金である。端子に用いられる銅合金の例としては、例えば、黄銅(例えば、CDA(Copper Development Association)のC2600、C2680)、りん青銅(例えば、CDAのC5210)、コルソン系銅合金(Cu−Ni−Si−(Sn,Zn,Mg,Cr)系銅合金)等が挙げられる。この内、強度と導電率、コストなどの総合的な観点からコルソン系銅合金が好ましい。コルソン系銅合金の例としては、これらに限定されるものではないが、例えば、古河電気工業株式会社製の銅合金FAS−680やFAS−820(いずれも商品名)、三菱伸銅製の銅合金MAX−375、MAX251(いずれも商品名)などを用いることができる。また、CDAのC7025等を用いることもできる。
白色系金属層3は、その色が白色もしくは白色に近い灰色(鈍色)からなり、若干の青色、赤色、銀色、またはその他の色等の色味を有していてもよい金属又はその合金からなる層をいう。白色系金属としては、スズ(Sn)、Sn合金、ニッケル(Ni)及びNi合金からなる群から選ばれる少なくとも1つの金属又は合金が好ましい。この白色系金属層3は、銅又は銅合金からなる基材2上の一部または全部に、少なくとも1層設けられていればよい。2層以上の複数の層が設けられていてもよい。例えば、銅又は銅合金からなる基材2の上に、Sn層又はNi層が1層のみ単一層として設けられていてもよい。あるいは、銅又は銅合金からなる基材2の上に、中間層として例えばNi層又はNi合金層が設けられ、その中間層上にSn層が1層設けられていてもよい。なお、本発明において、中間層は、前記白色系金属以外の金属又は合金から形成されていてもよく、白色系金属から形成されていてもよい。もしこの中間層が、前記白色系金属から形成される場合には、本発明の白色系金属層として規定する表面の算術平均粗さRaを必ずしも満たさなくてもよい。つまり、最も外側に位置する白色系金属層の表面の算術平均粗さRaが重要である。中間層の厚さと表面の算術平均粗さには特に制限はなく、金属部材のレーザ溶接性を阻害しない範囲内で適宜設定することができる。
油膜4は、白色系金属層3上に設けられる。白色系金属層3上に油が存在していることで、レーザ溶接時にレーザ光の吸収がさらに高くなる。よって、効率的にレーザ溶接を行うことができる。なお、この油膜4の電気二重層容量は、1.5〜7.0μF/cm2とすると、効率的なレーザ溶接に寄与する。この範囲よりも電気二重層容量が小さいと、基材2や白色系金属層3の溶接性向上に寄与しづらく、HAZ幅が大きくなって好ましくない。この範囲よりも電気二重層容量が大きいと、溶接の熱によって燃焼する油膜の量が多くなり、溶接欠陥を引き起こしたり、スス等の外観不良の原因となりやすい。油膜4の電気二重層容量は、より好ましくは、2.0〜6.0μF/cm2である。
図3(a)は、金属部材1同士の溶接前の様子を示した断面図である。この溶接では、溶接される2つの金属部材1同士を所定間隔D1だけ開けて設置し、間隔D1の略中心位置に溶接レーザLを照射することで溶接を行う。このような溶接を突合せ溶接という。間隔D1は、溶接方法によって変わるが、溶接後の体積減少を避けるために狭い方が好ましい。通常1.0mm以下に設定される。図中のFLは、レーザ溶接器具の例としてファイバレーザ装置を示している。このファイバレーザ装置FLからレーザ光Lが照射され、金属部材1同士が溶接される。金属部材1の溶接される部分、すなわちレーザ光が照射される部分の近傍には、少なくとも本発明の所定の白色系金属層3と油膜4が形成されている。これら所定の白色系金属層3と油膜4によって、従来は困難であった銅または銅合金からなる基材2を良好に溶接することができる。
本発明の金属部材を用いた端子の一実施形態を図面に基づいて説明する。なお、以下に示す実施形態は一例であり、本発明の技術範囲に属するものであれば、種々の実施形態をとり得る。
図5(a)〜(d)は、図4の端子の製造方法の一例を説明する平面図である。なお、図5は金属部材1の板材70から端子が製造される様子を板材70のZ方向(板面に対して垂直な方向)から見た図である。
図7に本発明の電線接続構造体100を示す。電線接続構造体100は、本発明の端子10と、電線60とが圧着接合された構造を有している。電線接続構造体100は、管状圧着部30内に電線60(電線導体部の一部および絶縁被覆部の一部)を挿入し、管状圧着部30をかしめることで、電線60が管状圧着部30内に圧着接続されている。なお、電線60は、絶縁被覆部61と図示しない導体部とからなる。導体部は、銅、銅合金、アルミニウム又はアルミニウム合金などからなっている。近年は、軽量化の観点からアルミニウム合金からなる導体部が用いられつつあるのは、既に述べたとおりである。絶縁被覆部は、例えばポリエチレン(PE)、ポリプロピレン(PP)などのポリオレフィンを主成分としたものや、ポリ塩化ビニル(PVC)を主成分としたもの等を用いることができる。
端子の基材として、古河電気工業株式会社製の銅合金FAS−680(商品名)(条、厚さ0.25mm、H材)を用いた。FAS−680は、コルソン系(Ni−Si系)の銅合金である。
比較例の試料No.1〜3は、油膜を設けず、Snめっき層の厚さを0.005μmに変えた以外は実施例1の試料No.1〜3と同様にして管状圧着部を形成した。比較例の試料No.4〜5は、油膜を設けず、Snめっき層表面の算術平均粗さRaを表1に記載の通りに変えた以外は実施例1の試料No.13〜18と同様にして管状圧着部を形成した。比較例の試料No.6〜8は、油膜を設けず、Snめっき層の厚さを2μmに変えた以外は実施例1の試料No.1〜3と同様にして管状圧着部を形成した。比較例の試料No.9〜11は、Snめっき層の厚さを0.005μmに変え、油膜の電気二重層容量を表1に記載の通りに変えた以外は実施例1の試料No.1〜3と同様にして管状圧着部を形成した。比較例の試料No.12〜13は、Snめっき層表面の算術平均粗さRaを表1に記載の通りに変え、油膜の電気二重層容量を表1に記載の通りに変えた以外は実施例1の試料No.13〜18と同様にして管状圧着部を形成した。比較例の試料No.14〜16は、Snめっき層の厚さを2μmに変え、油膜の電気二重層容量を表1に記載の通りに変えた以外は実施例1の試料No.1〜3と同様にして管状圧着部を形成した。比較例の試料No.17〜18は、油膜の電気二重層容量を表1に記載の通りに変えた以外は実施例1の試料No.14と同様にして管状圧着部を形成した。
[Snめっき条件]
めっき液:SnSO4 80g/l、H2SO4 80g/l
めっき条件:電流密度 5〜10A/dm2、温度 30℃
処理時間:電流密度を設定した後、望みのSnめっき層の厚さになるように調整した。
めっき液:Ni(SO3NH2)2・4H2O 500g/l、NiCl2 30g/l、H3BO3 30g/l
めっき条件:電流密度 20〜30A/dm2、温度 50℃
処理時間:電流密度を設定した後、望みのNiめっき層の厚さになるように調整した。
(1)レーザ溶接装置:古河電気工業株式会社製シングルモードファイバレーザ ASF1J221(商品名)(500W、CWファイバレーザ)
レーザ光の光源:Ybドープガラスファイバレーザ発振器
レーザ光発振波長:1084±5nm
レーザ光最大出力:500W
レーザ光出力:400W(連続発振)
レーザ光掃引速度:135mm/sec
レーザ光掃引距離:10mm
全条件ジャストフォーカスでレーザ光照射(スポット径サイズ:20μm)
2 基材
3 白色系金属層
4 油膜
5 溶接部
6 熱影響部(HAZ)
10、80、90 端子
20 ボックス部
30、79、81、91 管状圧着部
31、82 挿入口部
32、83 被覆圧着部
33、84、86 縮径部
34、85 導体圧着部
35 凹部
36 封止部
40、92 トランジション部
50、50’、51 溶接部
60 電線
61 絶縁被覆部
70 板材
71a キャリア部
71b 送り穴
72 コネクタ部用板状体
73 トランジション部用板状体
74 管状圧着部用板状体
75、93 コネクタ部
76 トランジション部
77 圧着部用管状体
78 突き合わせ部
93a 接続部
100 電線接続構造体
FL ファイバレーザ溶接装置
L ファイバレーザ光
Claims (4)
- 銅又は銅合金からなる基材と、前記基材上の一部または全部に設けられた白色系金属層と、前記白色系金属層上に設けられた油膜を有する金属部材から形成される端子であって、
前記白色系金属層の厚さは0.01〜0.80μmであり、
前記白色系金属層の表面の算術平均粗さは0.6〜1.2μmであり、
前記油膜の電気二重層容量が1.5〜7.0μF/cm2であり、
他の端子と嵌合するコネクタ部と、電線と圧着接合する管状圧着部と、前記コネクタ部と前記管状圧着部とをつなぐトランジション部とを有し、
前記管状圧着部が段差形状を有することを特徴とする端子。 - 前記白色系金属層が、Sn層、Sn合金層、Ni層及びNi合金層からなる群から選ばれる少なくとも1つの層である、請求項1に記載の端子。
- 請求項1又は2に記載の端子と、被覆電線とを圧着接合して形成した電線接続構造体。
- 前記被覆電線の導体部がアルミニウムまたはアルミニウム合金からなる、請求項3に記載の電線接続構造体。
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JP5246503B2 (ja) * | 2009-02-23 | 2013-07-24 | 住友電装株式会社 | 端子金具 |
JP2011150822A (ja) * | 2010-01-20 | 2011-08-04 | Autonetworks Technologies Ltd | 圧着端子、圧着端子付き平形ケーブル、圧着端子付き平形ケーブルの製造に用いられる圧着装置 |
CN102742083B (zh) * | 2010-02-05 | 2015-05-20 | 古河电气工业株式会社 | 压接端子、连接构造体以及压接端子的制作方法 |
CN201805040U (zh) * | 2010-06-22 | 2011-04-20 | 凡甲电子(苏州)有限公司 | 电源连接器 |
JP2012007227A (ja) * | 2010-06-28 | 2012-01-12 | Jst Mfg Co Ltd | 電子部品 |
JP5692799B2 (ja) * | 2011-03-25 | 2015-04-01 | Dowaメタルテック株式会社 | Snめっき材およびその製造方法 |
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2014
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JP5537751B1 (ja) | 2014-07-02 |
US20150357723A1 (en) | 2015-12-10 |
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