JP6182268B2 - ケイ素金属浮遊ゲートを有するスプリットゲート不揮発性フラッシュメモリセル及びその製造方法 - Google Patents
ケイ素金属浮遊ゲートを有するスプリットゲート不揮発性フラッシュメモリセル及びその製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title description 5
- 239000000463 material Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 23
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 16
- 229920005591 polysilicon Polymers 0.000 claims description 16
- 239000007769 metal material Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000010410 layer Substances 0.000 description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 20
- 239000002184 metal Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 19
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 235000012239 silicon dioxide Nutrition 0.000 description 10
- 239000000377 silicon dioxide Substances 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 125000006850 spacer group Chemical group 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 239000002784 hot electron Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
- H01L29/42328—Gate electrodes for transistors with a floating gate with at least one additional gate other than the floating gate and the control gate, e.g. program gate, erase gate or select gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
- H01L29/7883—Programmable transistors with only two possible levels of programmation charging by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Description
Claims (2)
- 不揮発性メモリセルであって、
第1の導電型の基板であって、第2導電型の第1の領域と、前記第1の領域から離間されている前記第2の導電型の第2の領域とを有し、それらの間にチャネル領域を形成する、第1の導電型の基板と、
前記第1の領域に隣接している前記チャネル領域の第1の部分から絶縁され、かつ前記第1の部分にわたって配置される選択ゲートと、
前記第2の領域に隣接している前記チャネル領域の第2の部分から絶縁され、かつ前記第2の部分にわたって配置され、ポリシリコンによって形成され、平坦な頂面を持つ浮遊ゲートと、
前記浮遊ゲートに接触して形成される金属材料と、
前記浮遊ゲートから絶縁され、かつ前記浮遊ゲートにわたって配置される制御ゲートと、
第1の部分及び第2の部分を含む消去ゲートであって、
前記第1の部分は、前記第2の領域から絶縁され、かつ前記第2の領域の上に配置されており、及び、前記浮遊ゲートから絶縁され、かつ前記浮遊ゲートに横方向に隣接して配置されている、並びに
前記第2の部分は、前記制御ゲートから絶縁され、かつ前記制御ゲートに横方向に隣接して配置されている、及び、前記浮遊ゲートにわたって部分的に延在し、かつ前記浮遊ゲートの平坦な頂面に垂直方向で重なり合う、消去ゲートとを含み、
前記金属材料は、前記浮遊ゲートの前記平坦な頂面に層として配置され、
前記金属材料の前記層は、前記浮遊ゲートの前記平坦な頂面の一部分のみにわたって延在し、
前記金属材料の前記層は、前記消去ゲートの前記第2の部分が延在する前記平坦な頂面のいかなる部分にも延在しない、
不揮発性メモリセル。 - 不揮発性メモリセルを形成する方法であって、
第1の導電型の基板内に、第2の導電型の、離間された第1の領域及び第2の領域を形成することであって、それらの間にチャネル領域を画定する、ことと、
前記第1の領域に隣接している前記チャネル領域の第1の部分から絶縁され、かつ前記第1の部分にわたって配置される選択ゲートを形成することと、
前記第2の領域に隣接している前記チャネル領域の第2の部分から絶縁され、かつ前記第2の部分にわたって配置され、ポリシリコン材料の浮遊ゲートを形成することと、
前記浮遊ゲートに接触して金属材料を形成することと、
前記浮遊ゲートから絶縁され、かつ前記浮遊ゲートにわたって配置される制御ゲートを形成することと、
第1の部分及び第2の部分を含む消去ゲートを形成することであって、
前記第1の部分は、前記第2の領域から絶縁され、かつ前記領域の上に配置されており、及び、前記浮遊ゲートから絶縁され、かつ前記浮遊ゲートに横方向に隣接して配置されている、並びに
前記第2の部分は、前記制御ゲートから絶縁され、かつ前記制御ゲートに横方向に隣接して配置されており、及び、前記浮遊ゲートにわたって部分的に延在し、かつ前記浮遊ゲートに垂直方向で重なり合っている、こととを含み、
前記金属材料は、前記浮遊ゲートの平坦な頂面に層として配置され、
前記金属材料の前記層は、前記浮遊ゲートの前記平坦な頂面の一部分のみにわたって延在し、
前記金属材料の前記層は、前記消去ゲートの前記第2の部分が延在する前記平坦な頂面のいかなる部分にも延在しない、
方法。
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Application Number | Priority Date | Filing Date | Title |
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US13/958,483 US9123822B2 (en) | 2013-08-02 | 2013-08-02 | Split gate non-volatile flash memory cell having a silicon-metal floating gate and method of making same |
US13/958,483 | 2013-08-02 | ||
PCT/US2014/048787 WO2015017495A1 (en) | 2013-08-02 | 2014-07-30 | Split gate non-volatile flash memory cell having a silicon-metal floating gate and method of making same |
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JP2016531434A JP2016531434A (ja) | 2016-10-06 |
JP6182268B2 true JP6182268B2 (ja) | 2017-08-16 |
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US (1) | US9123822B2 (ja) |
EP (1) | EP3028297B1 (ja) |
JP (1) | JP6182268B2 (ja) |
KR (1) | KR101773727B1 (ja) |
CN (1) | CN105453229B (ja) |
TW (1) | TWI533442B (ja) |
WO (1) | WO2015017495A1 (ja) |
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WO2015017495A1 (en) | 2015-02-05 |
EP3028297A1 (en) | 2016-06-08 |
TWI533442B (zh) | 2016-05-11 |
US20150035040A1 (en) | 2015-02-05 |
KR20160039276A (ko) | 2016-04-08 |
JP2016531434A (ja) | 2016-10-06 |
CN105453229A (zh) | 2016-03-30 |
KR101773727B1 (ko) | 2017-08-31 |
TW201511238A (zh) | 2015-03-16 |
US9123822B2 (en) | 2015-09-01 |
EP3028297B1 (en) | 2020-07-01 |
CN105453229B (zh) | 2018-01-26 |
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