JP6177739B2 - 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 - Google Patents

接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 Download PDF

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Publication number
JP6177739B2
JP6177739B2 JP2014161628A JP2014161628A JP6177739B2 JP 6177739 B2 JP6177739 B2 JP 6177739B2 JP 2014161628 A JP2014161628 A JP 2014161628A JP 2014161628 A JP2014161628 A JP 2014161628A JP 6177739 B2 JP6177739 B2 JP 6177739B2
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JP
Japan
Prior art keywords
substrate
wafer
holding
region
main body
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Expired - Fee Related
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JP2014161628A
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English (en)
Japanese (ja)
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JP2016039254A (ja
Inventor
紳太郎 杉原
紳太郎 杉原
英二 眞鍋
英二 眞鍋
元 古家
元 古家
勇之 三村
勇之 三村
陽介 大森
陽介 大森
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2014161628A priority Critical patent/JP6177739B2/ja
Priority to TW104124395A priority patent/TWI594308B/zh
Priority to KR1020150110976A priority patent/KR102407489B1/ko
Priority to CN201510484914.4A priority patent/CN105374725B/zh
Priority to CN201910554608.1A priority patent/CN110416142B/zh
Publication of JP2016039254A publication Critical patent/JP2016039254A/ja
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68309—Auxiliary support including alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68372—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support a device or wafer when forming electrical connections thereto

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP2014161628A 2014-08-07 2014-08-07 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 Expired - Fee Related JP6177739B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014161628A JP6177739B2 (ja) 2014-08-07 2014-08-07 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
TW104124395A TWI594308B (zh) 2014-08-07 2015-07-28 接合裝置、接合系統、接合方法及電腦記憶媒體
KR1020150110976A KR102407489B1 (ko) 2014-08-07 2015-08-06 접합 장치, 접합 시스템, 접합 방법 및 컴퓨터 기억 매체
CN201510484914.4A CN105374725B (zh) 2014-08-07 2015-08-07 接合装置、接合系统以及接合方法
CN201910554608.1A CN110416142B (zh) 2014-08-07 2015-08-07 接合装置、接合系统以及接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014161628A JP6177739B2 (ja) 2014-08-07 2014-08-07 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Publications (2)

Publication Number Publication Date
JP2016039254A JP2016039254A (ja) 2016-03-22
JP6177739B2 true JP6177739B2 (ja) 2017-08-09

Family

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JP2014161628A Expired - Fee Related JP6177739B2 (ja) 2014-08-07 2014-08-07 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Country Status (4)

Country Link
JP (1) JP6177739B2 (ko)
KR (1) KR102407489B1 (ko)
CN (2) CN110416142B (ko)
TW (1) TWI594308B (ko)

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* Cited by examiner, † Cited by third party
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EP3433875B1 (de) 2016-03-22 2022-05-04 EV Group E. Thallner GmbH Verfahren zum bonden von substraten
JP6700130B2 (ja) * 2016-07-12 2020-05-27 東京エレクトロン株式会社 接合システム
JP6727069B2 (ja) * 2016-08-09 2020-07-22 東京エレクトロン株式会社 接合装置および接合システム
SG11201811626TA (en) 2016-08-12 2019-03-28 Ev Group E Thallner Gmbh Method and sample holder for the controlled bonding of substrates
TW201826333A (zh) * 2016-11-16 2018-07-16 日商尼康股份有限公司 保持構件、接合裝置、及接合方法
JP6925160B2 (ja) * 2017-05-02 2021-08-25 東京エレクトロン株式会社 接合装置
JP6854696B2 (ja) 2017-05-02 2021-04-07 東京エレクトロン株式会社 接合装置および接合方法
KR102656787B1 (ko) 2017-09-21 2024-04-12 에베 그룹 에. 탈너 게엠베하 기판을 접합하기 위한 장치 및 방법
TWI818942B (zh) * 2018-01-17 2023-10-21 日商東京威力科創股份有限公司 接合裝置及接合方法
KR20200103849A (ko) * 2018-01-23 2020-09-02 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
KR102468794B1 (ko) * 2018-07-06 2022-11-18 삼성전자주식회사 웨이퍼 본딩 장치 및 이를 이용한 웨이퍼 본딩 시스템
KR102648711B1 (ko) * 2018-09-20 2024-03-20 삼성전자주식회사 기판 본딩 장치 및 그를 이용한 기판 본딩 방법
KR20210138052A (ko) * 2019-03-14 2021-11-18 도쿄엘렉트론가부시키가이샤 접합 시스템 및 접합 방법
WO2020208985A1 (ja) * 2019-04-08 2020-10-15 株式会社村田製作所 接合基板の製造方法
JP6818076B2 (ja) * 2019-04-17 2021-01-20 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板を接合する装置および方法
TWI822993B (zh) * 2019-05-08 2023-11-21 日商尼康股份有限公司 基板貼合裝置及基板貼合方法
CN110911334B (zh) * 2019-11-13 2021-06-15 东莞普莱信智能技术有限公司 一种微型电子元件定位贴合装置及其方法
CN111446191A (zh) * 2020-05-15 2020-07-24 长江存储科技有限责任公司 晶圆键合设备及检测方法
KR102462844B1 (ko) * 2020-12-22 2022-11-04 주식회사 셀코스 반도체 칩 전사 장치 및 이를 이용한 반도체 칩 전사 방법
JP2023044294A (ja) * 2021-09-17 2023-03-30 キオクシア株式会社 接合装置及び接合方法

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JPH0744135B2 (ja) * 1989-08-28 1995-05-15 株式会社東芝 半導体基板の接着方法及び接着装置
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JP5606429B2 (ja) * 2011-12-08 2014-10-15 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
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Also Published As

Publication number Publication date
CN105374725B (zh) 2019-11-12
CN110416142B (zh) 2023-08-29
KR102407489B1 (ko) 2022-06-13
CN110416142A (zh) 2019-11-05
JP2016039254A (ja) 2016-03-22
CN105374725A (zh) 2016-03-02
KR20160018410A (ko) 2016-02-17
TW201621991A (zh) 2016-06-16
TWI594308B (zh) 2017-08-01

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