WO2018088094A1 - 接合装置、接合システム、接合方法及びコンピュータ記憶媒体 - Google Patents
接合装置、接合システム、接合方法及びコンピュータ記憶媒体 Download PDFInfo
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- WO2018088094A1 WO2018088094A1 PCT/JP2017/036782 JP2017036782W WO2018088094A1 WO 2018088094 A1 WO2018088094 A1 WO 2018088094A1 JP 2017036782 W JP2017036782 W JP 2017036782W WO 2018088094 A1 WO2018088094 A1 WO 2018088094A1
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
- H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L22/10—Measuring as part of the manufacturing process
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Definitions
- the present invention relates to a bonding apparatus for bonding substrates, a bonding system including the bonding apparatus, a bonding method using the bonding apparatus, and a computer storage medium.
- a bonding system includes a surface modifying device for modifying a surface to which a wafer is bonded, a surface hydrophilizing device for hydrophilizing a wafer surface modified by the surface modifying device, and the surface hydrophilizing device. And a bonding apparatus for bonding wafers having hydrophilic surfaces.
- the surface of the wafer is subjected to plasma treatment in a surface modification device to modify the surface, and the surface is hydrophilized by supplying pure water to the surface of the wafer in the surface hydrophilization device.
- the wafers are bonded to each other by van der Waals force and hydrogen bond (intermolecular force).
- an upper chuck is used to hold one wafer (hereinafter referred to as “upper wafer”), and another wafer (hereinafter referred to as “lower wafer” using a lower chuck provided below the upper chuck).
- the upper wafer and the lower wafer are bonded together.
- the lower chuck is moved in the horizontal direction, the horizontal position of the upper wafer and the lower wafer is adjusted, and the lower chuck is moved in the vertical direction, and the upper wafer and the lower wafer are moved. Adjust the vertical position of.
- the moving unit that moves the lower chuck in the horizontal direction moves on the rail extending in the horizontal direction (X direction and Y direction).
- the moving unit that moves the lower chuck in the vertical direction includes a wedge-shaped base (triangular prism shape) whose upper surface is inclined, and a linear guide that is movable along the upper surface of the base. Then, the linear guide moves in the horizontal direction and the vertical direction along the base, whereby the lower chuck supported by the linear guide moves in the vertical direction.
- the base of the moving unit is used as described above. Since the base has a wedge shape, the lower chuck also moves in the horizontal direction. If it does so, the horizontal direction position of a lower chuck will shift. Moreover, since this horizontal position shift is a load-side lower chuck shift, it cannot be grasped by a linear scale that measures the horizontal position of the moving part. Therefore, when bonding the wafers, there is a possibility that the upper wafer and the lower wafer are shifted and bonded, and there is room for improvement in the bonding process between the wafers.
- the present invention has been made in view of the above points, and appropriately adjusts the position of the first holding unit that holds the first substrate and the second holding unit that holds the second substrate, so that the substrates are aligned with each other.
- the purpose of this is to appropriately perform the joining process.
- one embodiment of the present invention is a bonding apparatus for bonding substrates, the first holding portion holding the first substrate by vacuum suction on the lower surface, and the first A second holding portion that is vacuum-evacuated and held on the upper surface by the second holding portion, and the first holding portion and the second holding portion are relatively horizontal.
- a control unit that controls the moving unit using the measurement result of the meter and the measurement result of the linear scale.
- the position of the first holding unit or the second holding unit on the load side can be measured using a laser interferometer, and the position of the moving unit can be measured using a linear scale. it can. Then, when the first holding unit or the second holding unit is moved in the vertical direction as in the prior art, even if the first holding unit or the second holding unit is shifted in the horizontal direction, The amount of deviation can be grasped using a laser interferometer. Therefore, the relative positions of the first holding unit and the second holding unit can be adjusted appropriately, and then held by the first substrate and the second holding unit held by the first holding unit. The bonding process with the second substrate thus performed can be performed appropriately.
- Another aspect of the present invention is a bonding system including the bonding apparatus, a processing station including the bonding apparatus, a first substrate, a second substrate, or a first substrate and a second. And a loading / unloading station for loading / unloading the first substrate, the second substrate, or the polymerization substrate to / from the processing station.
- the processing station includes a surface modification device for modifying a surface to which the first substrate or the second substrate is bonded, and the first substrate or the second substrate modified by the surface modification device.
- a surface hydrophilizing device that hydrophilizes the surface and a transport device for transporting the first substrate, the second substrate, or the polymerization substrate to the surface modifying device, the surface hydrophilizing device, and the bonding device;
- the first substrate and the second substrate whose surfaces are hydrophilized by the surface hydrophilizing apparatus are joined.
- Another embodiment of the present invention is a bonding method in which substrates are bonded to each other using a bonding device, wherein the bonding device vacuums and holds the first substrate on the lower surface.
- a holding unit a second holding unit which is provided below the first holding unit and sucks and holds the second substrate on the upper surface by suction; the first holding unit and the second holding unit;
- a moving unit that moves the moving unit relatively in the horizontal direction, a laser interferometer that measures the position of the first holding unit or the second holding unit moved by the moving unit, and a position of the moving unit
- the moving unit is controlled using the measurement result of the laser interferometer and the measurement result of the linear scale, and the first holding unit and the second holding unit Adjust the relative position of.
- a readable computer storage medium storing a program that operates on a computer of a control unit that controls the joining device so that the joining method is executed by the joining device.
- the present invention it is possible to appropriately adjust the positions of the first holding unit that holds the first substrate and the second holding unit that holds the second substrate, and appropriately perform the bonding process between the substrates. it can.
- FIG. 1 is a plan view illustrating the outline of the configuration of the joining system 1.
- FIG. 2 is a side view illustrating the outline of the internal configuration of the joining system 1.
- the wafer disposed on the upper side is referred to as “upper wafer W U ” as the first substrate
- the wafer disposed on the lower side is referred to as “lower wafer W L ” as the second substrate.
- a bonding surface to which the upper wafer W U is bonded is referred to as “front surface W U1 ”
- a surface opposite to the front surface W U1 is referred to as “back surface W U2 ”.
- the bonding surface to which the lower wafer W L is bonded is referred to as “front surface W L1 ”, and the surface opposite to the front surface W L1 is referred to as “back surface W L2 ”. Then, in the bonding system 1, by joining the upper wafer W U and the lower wafer W L, to form the overlapped wafer W T as a polymerization substrate.
- the bonding system 1 carries in and out cassettes C U , C L , and C T that can accommodate a plurality of wafers W U and W L and a plurality of superposed wafers W T , respectively, with the outside.
- the loading / unloading station 2 and the processing station 3 including various processing apparatuses that perform predetermined processing on the wafers W U , W L , and the overlapped wafer W T are integrally connected.
- the loading / unloading station 2 is provided with a cassette mounting table 10.
- the cassette mounting table 10 is provided with a plurality of, for example, four cassette mounting plates 11.
- the cassette mounting plates 11 are arranged in a line in the horizontal X direction (vertical direction in FIG. 1). These cassette mounting plates 11, cassettes C U to the outside of the interface system 1, C L, when loading and unloading the C T, a cassette C U, C L, it is possible to place the C T .
- carry-out station 2 a wafer over multiple W U, a plurality of lower wafer W L, and is configured to be held by a plurality of overlapped wafer W T.
- the number of cassette mounting plates 11 is not limited to this embodiment, and can be set arbitrarily.
- One of the cassettes may be used for collecting abnormal wafers. That is, a wafer abnormality occurs in the bonding of the upper wafer W U and the lower wafer W L to various factors, and housed individually to a cassette to be able to be separated from the other normal overlapped wafer W T May be.
- a wafer abnormality occurs in the bonding of the upper wafer W U and the lower wafer W L to various factors, and housed individually to a cassette to be able to be separated from the other normal overlapped wafer W T May be.
- using a one cassette C T for the recovery of the abnormal wafer and using other cassettes C T for the accommodation of a normal overlapped wafer W T.
- a wafer transfer unit 20 is provided adjacent to the cassette mounting table 10.
- the wafer transfer unit 20 is provided with a wafer transfer device 22 that is movable on a transfer path 21 extending in the X direction.
- the wafer transfer device 22 is also movable in the vertical direction and around the vertical axis ( ⁇ direction), and includes cassettes C U , C L , C T on each cassette mounting plate 11 and a third of the processing station 3 described later.
- the wafers W U and W L and the superposed wafer W T can be transferred between the transition devices 50 and 51 in the processing block G3.
- the processing station 3 is provided with a plurality of, for example, three processing blocks G1, G2, G3 provided with various devices.
- a first processing block G1 is provided on the front side of the processing station 3 (X direction negative direction side in FIG. 1), and on the back side of the processing station 3 (X direction positive direction side in FIG. 1)
- Two processing blocks G2 are provided.
- a third processing block G3 is provided on the loading / unloading station 2 side of the processing station 3 (Y direction negative direction side in FIG. 1).
- a surface modification device 30 for modifying the surfaces W U1 and W L1 of the wafers W U and W L is disposed.
- the surface modification device 30 for example, in a reduced-pressure atmosphere, oxygen gas or nitrogen gas, which is a processing gas, is excited to be turned into plasma and ionized.
- the surfaces W U1 and W L1 of the wafers W U and W L are irradiated with the oxygen ions or nitrogen ions, and the surfaces W U1 and W L1 are plasma-treated and modified.
- the second processing block G2 includes, for example, a surface hydrophilizing device 40 that hydrophilizes the surfaces W U1 and W L1 of the wafers W U and W L with pure water and cleans the surfaces W U1 and W L1.
- a surface hydrophilizing device 40 that hydrophilizes the surfaces W U1 and W L1 of the wafers W U and W L with pure water and cleans the surfaces W U1 and W L1.
- U, bonding device 41 for bonding the W L are arranged side by side in the horizontal direction of the Y-direction in this order from the carry-out station 2 side. The configuration of the joining device 41 will be described later.
- the surface hydrophilizing apparatus 40 for example, wafer W U held by the spin chuck, while rotating the W L, for supplying pure water the wafer W U, on W L. Then, the supplied pure water is diffused on the wafer W U, W L of the surface W U1, W L1, surface W U1, W L1 is hydrophilized.
- the third processing block G3, the wafer W U as shown in FIG. 2, W L, a transition unit 50, 51 of the overlapped wafer W T are provided in two tiers from the bottom in order.
- a wafer transfer region 60 is formed in a region surrounded by the first processing block G1 to the third processing block G3.
- a wafer transfer device 61 is disposed in the wafer transfer region 60.
- the wafer transfer device 61 includes, for example, a transfer arm 61a that can move around the vertical direction, the horizontal direction (Y direction, X direction), and the vertical axis.
- the wafer transfer device 61 moves in the wafer transfer region 60, and adds wafers W U , W L , and W to predetermined devices in the surrounding first processing block G1, second processing block G2, and third processing block G3. You can transfer the overlapping wafer W T.
- the above joining system 1 is provided with a controller 70 as shown in FIG.
- the control unit 70 is, for example, a computer and has a program storage unit (not shown).
- the program storage unit stores a program for controlling processing of the wafers W U and W L and the overlapped wafer W T in the bonding system 1.
- the program storage unit also stores a program for controlling operations of driving systems such as the above-described various processing apparatuses and transfer apparatuses to realize later-described wafer bonding processing in the bonding system 1.
- the program is recorded on a computer-readable storage medium H such as a computer-readable hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical desk (MO), or a memory card. May have been installed in the control unit 70 from the storage medium H.
- the joining device 41 includes a processing container 100 that can seal the inside.
- the inside of the processing container 100 is partitioned by the inner wall 103 into a transport area T1 and a processing area T2.
- the loading / unloading port 101 described above is formed on the side surface of the processing container 100 in the transfer region T1.
- a loading / unloading port 104 for the wafers W U and W L and the overlapped wafer W T is formed on the inner wall 103.
- a transition 110 for temporarily placing the wafers W U and W L and the superposed wafer W T is provided on the Y direction positive direction side of the transfer region T1.
- the transition 110 is formed in, for example, two stages, and any two of the wafers W U , W L , and the superposed wafer W T can be placed at the same time.
- a wafer transfer mechanism 111 is provided in the transfer area T1.
- the wafer transfer mechanism 111 includes, for example, a transfer arm 111a that can move around the vertical direction, horizontal direction (X direction, Y direction), and vertical axis. Then, the wafer transfer mechanism 111 can transport within transfer region T1, or a transfer region T1 wafer W U between the processing region T2, W L, the overlapped wafer W T.
- a position adjusting mechanism 120 for adjusting the horizontal direction of the wafers W U and W L is provided on the Y direction negative direction side of the transfer region T1.
- the position adjustment mechanism 120 the position of the notches of the wafers W U and W L is detected by the detection unit 122 while rotating the wafers W U and W L held on the base 121.
- the horizontal direction of the wafers W U and W L is adjusted by adjusting the position.
- the structure for holding the wafers W U and W L on the base 121 is not particularly limited, and various structures such as a pin chuck structure and a spin chuck structure are used.
- Reversing mechanism 130 for reversing the front and rear surfaces of the upper wafer W U is provided.
- Reversing mechanism 130 has a holding arm 131 which holds the upper wafer W U.
- the holding arm 131 extends in the horizontal direction (X direction).
- the holding arm 131 is provided on the holding member 132 for holding the upper wafer W U, for example four positions.
- the holding arm 131 is supported by a driving unit 133 including, for example, a motor.
- a driving unit 133 including, for example, a motor.
- the holding arm 131 is rotatable around a horizontal axis.
- the holding arm 131 is rotatable about the drive unit 133 and is movable in the horizontal direction (X direction).
- Below the drive unit 133 for example, another drive unit (not shown) including a motor or the like is provided below the drive unit 133.
- this other driving unit the driving unit 133 can move in the vertical direction along the support pillar 134 extending in the vertical direction.
- Such driving unit 133, the upper wafer W U held by the holding member 132 is movable in the vertical direction and the horizontal direction together with the pivotable about a horizontal axis. Further, the upper wafer W U held by the holding member 132 can move around the drive unit 133 and move from the position adjustment mechanism 120 to the upper chuck 140 described later.
- the processing region T2 under the upper wafer W U and the chuck 140 as a first holding portion for holding suction on the lower surface, as a second holding portion for holding suction by placing the lower wafer W L with the upper surface
- a chuck 141 is provided.
- the lower chuck 141 is provided below the upper chuck 140 and is configured to be disposed so as to face the upper chuck 140. That is, the lower wafer W L held on the wafer W U and the lower chuck 141 on which is held by the upper chuck 140 is adapted to be placed opposite.
- the upper chuck 140 is held by an upper chuck holding portion 150 provided above the upper chuck 140.
- the upper chuck holding unit 150 is provided on the ceiling surface of the processing container 100. In other words, the upper chuck 140 is fixed to the processing container 100 via the upper chuck holding part 150.
- the upper chuck holding portion 150, the upper imaging unit 151 to image the surface W L1 of the lower wafer W L held by the lower chuck 141 is provided. That is, the upper imaging unit 151 is provided adjacent to the upper chuck 140.
- a CCD camera is used for the upper imaging unit 151.
- the lower chuck 141 is supported by a lower chuck stage 160 provided below the lower chuck 141.
- the lower chuck stage 160 is provided with a lower imaging unit 161 that images the surface W U1 of the upper wafer W U held by the upper chuck 140. That is, the lower imaging unit 161 is provided adjacent to the lower chuck 141.
- a CCD camera is used for the lower imaging unit 161 for the lower imaging unit 161, for example, a CCD camera is used.
- the lower chuck stage 160 is supported by a first lower chuck moving part 162 provided below the lower chuck stage 160, and the first lower chuck moving part 162 is further supported by a support base 163.
- the first lower chuck moving unit 162 is configured to move the lower chuck 141 in the horizontal direction (X direction) as described later.
- the first lower chuck moving part 162 is configured to move the lower chuck 141 in the vertical direction.
- the first lower chuck moving unit 162 can have the same structure as the first lower chuck moving unit described in Japanese Patent Application Laid-Open No. 2016-105458. That is, the first lower chuck moving unit 162 includes a wedge-shaped (triangular prism-shaped) base whose upper surface is inclined, a rail disposed on the upper surface of the base, and a linear guide movable along the rail. Have. Then, when the linear guide moves along the rail, the lower chuck supported by the linear guide moves in the vertical direction.
- first lower chuck moving part 162 is configured to be rotatable around the vertical axis.
- the support base 163 is provided on the lower surface side of the support base 163 and is attached to a pair of rails 164 and 164 extending in the horizontal direction (X direction).
- the support base 163 is configured to be movable along the rail 164 by the first lower chuck moving part 162.
- the first lower chuck moving part 162 is moved by, for example, a linear motor (not shown) provided along the rail 164.
- the pair of rails 164 and 164 are disposed in the second lower chuck moving portion 165.
- the second lower chuck moving unit 165 is provided on the lower surface side of the second lower chuck moving unit 165 and is attached to a pair of rails 166 and 166 extending in the horizontal direction (Y direction).
- the second lower chuck moving portion 165 is configured to be movable along the rail 166, that is, configured to move the lower chuck 141 in the horizontal direction (Y direction).
- the second lower chuck moving unit 165 moves by a linear motor (not shown) provided along the rail 166, for example.
- the pair of rails 166 and 166 are disposed on a mounting table 167 provided on the bottom surface of the processing container 100.
- Servo control in the present embodiment is hybrid control using a laser interferometer and a linear scale.
- the joining apparatus 41 is provided with a laser interferometer system 170 that measures the horizontal position of the lower chuck 141.
- the laser interferometer system 170 includes a laser head 171, optical path changing units 172 and 173, reflection plates 174 and 175, and laser interferometers 176 and 177.
- a known method is used as a method for measuring the position of the lower chuck 141 in the laser interferometer system 170.
- the laser head 171 is a light source that emits laser light.
- the laser head 171 has substantially the same height as the upper surface of the mounting table 167, and is provided at the X direction center portion and the Y direction negative direction end side of the mounting table 167.
- the laser head 171 is supported by a support member (not shown) provided outside the mounting table 167.
- the optical path changing units 172 and 173 change the optical path of the laser light emitted from the laser head 171.
- the first optical path changing unit 172 changes the optical path of the laser light from the laser head 171 vertically upward.
- the first optical path changing unit 172 has substantially the same height as the top surface of the mounting table 167 and is provided on the X-direction positive end side and the Y-direction negative end side of the mounting table 167.
- the first optical path changing unit 172 is supported by a support member (not shown) provided outside the mounting table 167.
- the second optical path changing unit 173 receives the laser light from the first optical path changing unit 172 on the first laser interferometer 176 side (X direction negative direction side) and the second laser interferometer 177 side (Y direction positive direction). Branch to).
- the second optical path changing unit 173 has substantially the same height as the upper surface of the lower chuck stage 160 and is provided on the X-direction positive end side and the Y-direction negative end side of the mounting table 167.
- the second optical path changing unit 173 is supported by a support member (not shown) provided outside the mounting table 167.
- the first reflector 174 reflects the laser beam from the first laser interferometer 176.
- the first reflecting plate 174 is provided to face the first laser interferometer 176 on the Y direction negative direction side of the upper surface of the lower chuck stage 160.
- the first reflector 174 extends in the X direction.
- the length of the first reflector 174 in the X direction is such that the X direction of the lower chuck stage 160 is such that the laser beam from the first laser interferometer 176 can always be reflected even if the lower chuck stage 160 moves in the X direction.
- the moving distance (stroke length) in the direction is longer than the specified distance.
- the vertical length of the first reflecting plate 174 is equal to or longer than the vertical movement distance (stroke length) of the lower chuck stage 160.
- the second reflector 175 reflects the laser light from the second laser interferometer 177.
- the second reflecting plate 175 is provided to face the second laser interferometer 177 on the X direction positive direction side of the upper surface of the lower chuck stage 160.
- the second reflecting plate 175 extends in the Y direction.
- the length of the second reflecting plate 175 in the Y direction is Y of the lower chuck stage 160 so that the laser beam from the second laser interferometer 177 can always be reflected even if the lower chuck stage 160 moves in the Y direction.
- the moving distance (stroke length) in the direction is longer than the specified distance.
- the vertical length of the second reflector 175 is equal to or longer than the vertical movement distance (stroke length) of the lower chuck stage 160.
- the first laser interferometer 176 measures the position of the lower chuck 141 in the X direction using the laser light from the second optical path changing unit 173 and the reflected light from the first reflecting plate 174.
- the first laser interferometer 176 has substantially the same height as the upper surface of the lower chuck stage 160 and is provided on the center of the mounting table 167 in the X direction and on the end side in the Y direction negative direction.
- the first laser interferometer 176 is supported by a support member (not shown) provided outside the mounting table 167. Note that a detector (not shown) is connected to the first laser interferometer 176.
- the second laser interferometer 177 measures the Y-direction position of the lower chuck 141 using the laser light from the second optical path changing unit 173 and the reflected light from the second reflecting plate 175.
- the second laser interferometer 177 is substantially the same height as the upper surface of the lower chuck stage 160, and is provided at the end side in the positive direction of the X direction and at the center of the Y direction of the mounting table 167.
- the second laser interferometer 177 is supported by a support member (not shown) provided outside the mounting table 167. Note that a detector (not shown) is connected to the second laser interferometer 177.
- the joining device 41 includes a first linear scale 181 that measures the X-direction position of the first lower chuck moving portion 162 and a second linear that measures the Y-direction position of the second lower chuck moving portion 165.
- a scale 182 is provided.
- the first linear scale 181 is provided along the rail 164 on the second lower chuck moving unit 165.
- the second linear scale 182 is provided along the rail 166 on the mounting table 167.
- a known method is used as a method for measuring the position of the lower chuck moving parts 162 and 165 using the linear scales 181 and 182.
- FIG. 7 is an explanatory diagram showing a configuration of a servo loop in the control unit 70.
- the control unit 70 has a position loop and a velocity loop as servo loops.
- the position loop the measurement results of the laser interferometers 176 and 177 are used, and the positions of the lower chuck moving parts 162 and 165 are feedback-controlled.
- the speed loop the measurement results of the linear scales 181 and 182 are used, and the speeds of the lower chuck moving parts 162 and 165 are feedback-controlled. Note that the measurement results of the laser interferometers 176 and 177 are also used as a speed command.
- the second linear scale 182 is arranged in the vicinity of the second lower chuck moving part 165, and the measurement result of the second linear scale 182 becomes highly stable data, and the second lower chuck moving part 165 165 is fed back. For this reason, it is possible to increase the speed loop gain and increase the responsiveness to perform fast control.
- the vertical distance between the second laser interferometer 177 that measures the position of the load-side lower chuck 141 and the second lower chuck moving unit 165 is about 300 mm.
- the second laser interferometer 177 and the second lower chuck moving part 165 are separated from each other, and the structure provided between the lower chuck 141 and the second lower chuck moving part 165 is not a rigid body. Then, the measurement result of the second laser interferometer 177 becomes data with low stability, and is fed back to the second lower chuck moving unit 165.
- the position of the lower chuck 141 on the load side cannot be measured. For example, even if the position of the lower chuck 141 is displaced, the displacement cannot be grasped. Therefore, it is preferable to use the measurement result of the second laser interferometer 177 for the position loop.
- the position of the lower chuck 141 on the load side can be grasped.
- the second lower chuck moving unit 165 can be quickly returned to an appropriate position.
- the measurement result of the first laser interferometer 176 is used for the position loop, and the measurement result of the first linear scale 181 is used for the velocity loop.
- the lower chuck moving unit 162 and 165 by performing hybrid control using the measurement result of the laser interferometer system 170 and the measurement result of the linear scales 181 and 182, the lower chuck moving unit 162 and 165. Can be controlled appropriately.
- the upper chuck 140 employs a pin chuck system as shown in FIG.
- Upper chuck 140 includes a body portion 190 having a diameter larger than the diameter of the upper wafer W U in a plan view.
- a plurality of pins 191 that are in contact with the back surface W U2 of the upper wafer W U are provided on the lower surface of the main body 190.
- the outer ribs 192 for supporting the outer peripheral portion of the back surface W U2 of the upper wafer W U is provided on the outer peripheral portion of the back surface W U2 of the upper wafer W U is provided.
- the outer rib 192 is provided in an annular shape outside the plurality of pins 191.
- inner ribs 193 for supporting the back surface W U2 of the upper wafer W U is provided.
- the inner rib 193 is annularly provided concentrically with the outer rib 192.
- the inner region 194 of the outer rib 192 (hereinafter sometimes referred to as a suction region 194) includes a first suction region 194a inside the inner rib 193 and a second suction region 194b outside the inner rib 193. It is divided into and.
- a first suction port 195a for evacuating the upper wafer W U is formed.
- the first suction ports 195a are formed at, for example, four locations in the first suction region 194a.
- a first suction pipe 196a provided inside the main body 190 is connected to the first suction port 195a.
- a first vacuum pump 197a is connected to the first suction pipe 196a.
- the second suction port 195b for evacuating the upper wafer W U is formed on the lower surface of the main body portion 190.
- the second suction port 195b is formed in two places in the second suction region 194b.
- a second suction pipe 196b provided inside the main body 190 is connected to the second suction port 195b.
- a second vacuum pump 197b is connected to the second suction pipe 196b.
- the suction regions 194a and 194b formed surrounded by the upper wafer W U , the main body 190 and the outer rib 192 are evacuated from the suction ports 195a and 195b, respectively, and the suction regions 194a and 194b are decompressed.
- the suction area 194a, for external atmosphere 194b is atmospheric pressure
- the upper chuck 140 is configured to be evacuated over the wafer W U per the first suction area 194a second suction region 194b.
- the outer rib 192 supports the outer peripheral portion of the back surface W U2 of the upper wafer W U, the upper wafer W U is suitably evacuated to the outer periphery thereof. Therefore, the entire surface of the upper wafer W U is held by suction on the chuck 140, to reduce the flatness of the on the wafer W U, it is possible to flatten the upper wafer W U.
- the height of the plurality of pins 191 is uniform, the flatness of the lower surface of the upper chuck 140 can be further reduced.
- the flat lower surface of the upper chuck 140 by reducing the lower surface flatness, it is possible to suppress the distortion of the vertical direction of the wafer W U after being held by the upper chuck 140.
- a through hole 198 that penetrates the main body 190 in the thickness direction is formed at the center of the main body 190.
- the central portion of the body portion 190 corresponds to the central portion of the upper wafer W U which is sucked and held on the chuck 140.
- tip part of the actuator part 211 in the pushing member 210 mentioned later penetrates the through-hole 198. As shown in FIG.
- the upper chuck holding unit 150 has an upper chuck stage 200 provided on the upper surface of the main body 190 of the upper chuck 140 as shown in FIG.
- the upper chuck stage 200 is provided so as to cover at least the upper surface of the main body 190 in a plan view, and is fixed to the main body 190 by, for example, screwing.
- the upper chuck stage 200 is supported by a plurality of support members 201 provided on the ceiling surface of the processing container 100.
- the pushing member 210 has an actuator part 211 and a cylinder part 212.
- the actuator unit 211 generates a constant pressure in a fixed direction by air supplied from an electropneumatic regulator (not shown), and can generate the pressure constantly regardless of the position of the pressure application point. . Then, the air from the electropneumatic regulator, the actuator unit 211 is capable of controlling the pressing load applied against the central portion of the upper wafer W U and those in the center of the on the wafer W U. The tip of the actuator portion 211 is vertically movable through the through hole 198 by air from the electropneumatic regulator.
- the actuator part 211 is supported by the cylinder part 212.
- the cylinder part 212 can move the actuator part 211 in the vertical direction by a drive part incorporating a motor, for example.
- the pressing member 210 controls the pressing load by the actuator unit 211 and controls the movement of the actuator unit 211 by the cylinder unit 212. Then, the pressing member 210, the wafer W U to be described later, at the time of bonding of W L, it can be pressed by contacting the center portion of the center and lower wafer W L of the upper wafer W U.
- the lower chuck 141 employs a pin chuck system as with the upper chuck 140.
- Lower chuck 141 includes a body portion 220 having a diameter larger than the diameter of the lower wafer W L in a plan view.
- the upper surface of the main body portion 220 a plurality of pins 221 in contact with the back surface W L2 of the lower wafer W L is provided.
- the outer ribs 222 for supporting the outer peripheral portion of the back surface W L2 of the lower wafer W L is provided.
- the outer rib 222 is provided in an annular shape outside the plurality of pins 221.
- inner ribs 223 for supporting the back surface W L2 of the lower wafer W L is provided.
- the inner rib 223 is annularly provided concentrically with the outer rib 222.
- the inner region 224 of the outer rib 222 (hereinafter sometimes referred to as a suction region 224) includes a first suction region 224a inside the inner rib 223 and a second suction region 224b outside the inner rib 223. It is divided into and.
- a first suction port 225a for evacuating the lower wafer W L are formed.
- the first suction port 225a is formed at one place in the first suction region 224a.
- a first suction pipe 226a provided inside the main body 220 is connected to the first suction port 225a.
- a first vacuum pump 227a is connected to the first suction pipe 226a.
- the second suction port 225b for evacuating the lower wafer W L are formed on the upper surface of the main body portion 220.
- the second suction port 225b is formed in two places in the second suction region 224b.
- a second suction tube 226b provided inside the main body 220 is connected to the second suction port 225b.
- a second vacuum pump 227b is connected to the second suction pipe 226b.
- the lower wafer W L, the main body portion 220 and the suction area 224a which is formed surrounded by outer ribs 222, 224b each suction port 225a, evacuated from 225b, the suction area 224a, the 224b vacuo.
- the suction area 224a, for external atmosphere 224b is atmospheric pressure
- the lower chuck 141 is evacuated configured to be able to lower wafer W L for each of the first suction area 224a second suction region 224b.
- the lower wafer W L is suitably evacuated to the outer periphery thereof. Therefore, the entire surface of the lower wafer W L is sucked and held on the lower chuck 141, to reduce the flatness of the lower wafer W L, it is possible to flatten the lower wafer W L.
- the flatness of the upper surface of the lower chuck 141 can be further reduced.
- the flat upper surface of the lower chuck 141 by reducing the flatness of the upper surface, it is possible to suppress distortion in the vertical direction of the lower wafer W L held by the lower chuck 141.
- through holes penetrating through the main body 220 in the thickness direction are formed, for example, at three locations near the center of the main body 220. And the raising / lowering pin provided under the 1st lower chuck
- the outer peripheral portion of the main body portion 220, the wafer W U, W L, or jump out from the overlapped wafer W T is lower chuck 141, a guide member to prevent the sliding (not shown) is provided.
- the guide members are provided at a plurality of positions, for example, at four positions at equal intervals on the outer peripheral portion of the main body 220.
- FIG. 9 is a flowchart showing an example of main steps of the wafer bonding process.
- the cassette C U, the cassette C L accommodating the lower wafer W L of the plurality, and the empty cassette C T is a predetermined cassette mounting plate 11 of the carry-out station 2 accommodating the wafers W U on the plurality Placed on. Thereafter, the upper wafer W U in the cassette C U is taken out by the wafer transfer device 22 is conveyed to the transition unit 50 of the third processing block G3 in the processing station 3.
- the upper wafer W U is transferred to the surface modification apparatus 30 of the first processing block G1 by the wafer transfer apparatus 61.
- oxygen gas or nitrogen gas which is a processing gas, is excited and turned into plasma and ionized under a predetermined reduced-pressure atmosphere.
- the surface W U1 of the upper wafer W U is irradiated with this oxygen ion or nitrogen ion, and the surface W U1 is subjected to plasma treatment.
- the surface W U1 of the upper wafer W U is modified (Step S1 in FIG. 9).
- the upper wafer W U is transferred to a surface hydrophilizing apparatus 40 of the second processing block G2 by the wafer transfer apparatus 61.
- the surface hydrophilizing device 40 while rotating the upper wafer W U held by the spin chuck, for supplying pure water onto the onto the wafer W U. Then, the supplied pure water is diffused over the front surface W U1 of the upper wafer W U, the surface W U1 to hydroxyl (silanol group) in the upper wafer W U which are modified in the surface modification apparatus 30 is the attached The surface W U1 is hydrophilized. Further, the surface W U1 of the upper wafer W U is cleaned with the pure water (step S2 in FIG. 9).
- the upper wafer W U is transferred to the bonding apparatus 41 of the second processing block G2 by the wafer transfer apparatus 61.
- Upper wafer W U which is carried into the joining device 41 is conveyed to the position adjusting mechanism 120 by the wafer transfer mechanism 111 via the transition 110.
- the position adjusting mechanism 120, the horizontal orientation of the upper wafer W U is adjusted (step S3 in FIG. 9).
- the upper wafer W U is transferred from the position adjusting mechanism 120 to the holding arm 131 of the reversing mechanism 130. Subsequently, in transfer region T1, by reversing the holding arm 131, the front and back surfaces of the upper wafer W U is inverted (step S4 in FIG. 9). That is, the surface W U1 of the upper wafer W U is directed downward.
- the holding arm 131 of the reversing mechanism 130 rotates around the driving unit 133 and moves below the upper chuck 140.
- the upper wafer W U is delivered from the reversing mechanism 130 to the upper chuck 140.
- Upper wafer W U, the back surface W U2 above the chuck 140 is held by suction (step S5 in FIG. 9).
- the vacuum pump 197a actuates the 197b, the suction area 194a, the upper wafer W U evacuated suction port 195a, via 195b in 194b, the upper wafer W U is attracted and held on the chuck 140 .
- the processing of the lower wafer W L Following the on wafer W U is performed.
- the lower wafer W L in the cassette C L is taken out by the wafer transfer device 22 is conveyed to the transition unit 50 in the processing station 3.
- Step S6 In FIG. 9
- modification of the surface W L1 of the lower wafer W L in step S6 is the same as step S1 of the aforementioned.
- step S7 hydrophilic and cleaning of the surface W L1 of the lower wafer W L in step S7, is similar to the process S2 described above.
- the lower wafer W L is transported to the bonding apparatus 41 by the wafer transfer apparatus 61.
- Lower wafer W L which is transported to the bonding unit 41 is conveyed to the position adjusting mechanism 120 by the wafer transfer mechanism 111 via the transition 110.
- the position adjusting mechanism 120, the horizontal orientation of the lower wafer W L are adjusted (step S8 in FIG. 9).
- the lower wafer W L is transferred to the lower chuck 141 by the wafer transfer mechanism 111, the back surface W L2 is held by suction to the lower chuck 141 (step S9 in FIG. 9).
- the vacuum pump 227a actuates the 227b, evacuated, and the lower wafer W L is sucked and held by the lower chuck 141 to the lower wafer W L through the suction port 225a, 225b in the suction area 224a, 224b .
- the lower chuck 141 is moved in the horizontal direction (X direction and Y direction) by the first lower chuck moving unit 162 and the second lower chuck moving unit 165, and the lower wafer is used by using the upper imaging unit 151.
- a predetermined reference point on the surface W L1 of W L is sequentially imaged.
- a predetermined reference point on the surface W U1 of the upper wafer W U is sequentially imaged using the lower imaging unit 161.
- the captured image is output to the control unit 70.
- the reference point of the reference point and the lower wafer W L of the upper wafer W U matches each position
- the lower chuck 141 is moved by the first lower chuck moving part 162 and the second lower chuck moving part 165. Horizontal position of the upper wafer W U and the lower wafer W L is adjusted in this way (step S10 in FIG. 9).
- step S10 the X direction position of the lower chuck 141 is measured using the first laser interferometer 176, and the Y direction position of the lower chuck 141 is measured using the second laser interferometer 177. Further, the X direction position of the first lower chuck moving unit 162 is measured using the first linear scale 181, and the Y direction position of the second lower chuck moving unit 165 is measured using the second linear scale 182. To do.
- the position loop using the measurement result of the laser interferometer system 170 and the measurement result of the linear scales 181 and 182 are used using the servo loop shown in FIG.
- the lower chuck moving parts 162 and 165 are servo-controlled using the used speed loop.
- the movement of the lower chuck moving parts 162 and 165 can be appropriately controlled, and the lower chuck 141 is moved in a predetermined horizontal direction. Can be moved to a position.
- step S10 the lower chuck 141 is moved in the horizontal direction as described above, and the lower chuck 141 is rotated by the first lower chuck moving unit 162, so that the rotation direction position of the lower chuck 141 (the lower chuck 141). Is also adjusted.
- the first lower chuck moving unit 162 moves the lower chuck 141 vertically upward to adjust the vertical position of the upper chuck 140 and the lower chuck 141, and the upper wafer W U held by the upper chuck 140 is adjusted. performing adjustment of vertical position of the lower wafer W L held by the lower chuck 141 (the step S11 in FIG. 9).
- step S11 when the lower chuck 141 is moved vertically upward by the first lower chuck moving unit 162, the base of the first lower chuck moving unit 162 has a wedge shape. Move horizontally as well. If it does so, the horizontal direction position of the lower chuck
- step S10 the X direction position of the lower chuck 141 is measured using the first laser interferometer 176, and the Y direction position of the lower chuck 141 is measured using the second laser interferometer 177.
- the first linear scale 181 is used to measure the X-direction position of the first lower chuck moving part 162
- the second linear scale 182 is used to measure the Y-direction position of the second lower chuck moving part 165.
- the lower chuck moving parts 162 and 165 are servo-controlled to control the lower chuck 141. Correct the horizontal position of.
- the horizontal position of the upper wafer W U and the lower wafer W L is corrected (step S12 in FIG. 9).
- the upper wafer W U and the lower wafer W L is opposed to a predetermined position.
- the actuator portion 211 is lowered by the cylinder portion 212 of the pushing member 210. Then, with the downward movement of the actuator portion 211, the center portion of the upper wafer W U is lowered is pressed. At this time, a predetermined pressing load is applied to the actuator unit 211 by the air supplied from the electropneumatic regulator. Then, the pressing member 210 is pressed by abutting the central portion of the central portion and the lower wafer W L of the upper wafer W U (step S13 in FIG. 9).
- a second vacuum pump 197b is The second suction region 194b is evacuated from the second suction port 195b while being operated. Then, even when pressing the central portion of the upper wafer W U by the pressing member 210 can hold the outer peripheral portion of the upper wafer W U by the upper chuck 140.
- the bonding is started between the central portion of the central portion and the lower wafer W L of the upper wafer W U which pressed (thick line portion in FIG. 10). That is, since the surface W U1 of the upper wafer W U and the surface W L1 of the lower wafer W L are modified in steps S1 and S6, respectively, first, the van der Waals force (intermolecular) between the surfaces W U1 and W L1. Force) is generated, and the surfaces W U1 and W L1 are joined to each other.
- the pressing member 210 of the upper wafer W U in a state where the center portion is pressed in the center and lower wafer W L to stop the operation of the second vacuum pump 197b, the second in the second suction region 194b stopping evacuation of the upper wafer W U from the suction port 195b.
- the upper wafer W U falls onto the lower wafer W L.
- the upper wafer W U sequentially falls and comes into contact with the lower wafer W L , and the above-described bonding by the van der Waals force and hydrogen bonding between the surfaces W U1 and W L1 is sequentially expanded.
- the surface W L1 of the surface W U1 and the lower wafer W L of the upper wafer W U abuts on the whole surface, the upper wafer W U and the lower wafer W L is bonded (step S14 in FIG. 9).
- the actuator portion 211 of the pushing member 210 is raised to the upper chuck 140. Further, the vacuum pump 227a, and stops the operation of 227b, to stop the evacuation of the lower wafer W L in the suction region 224, stopping the suction and holding of the lower wafer W L by the lower chuck 141. At this time, since the back surface W L2 of the lower wafer W L is supported by a plurality of pins 221, when releasing the vacuum of the lower wafer W L by the lower chuck 141, peeling the under wafer W L from the lower chuck 141 It is easy.
- the upper wafer W U and the lower wafer W L overlapped wafer bonded W T is transferred to the transition unit 51 by the wafer transfer apparatus 61, then carry out by the wafer transfer apparatus 22 of the station 2 of a predetermined cassette mounting plate 11 It is conveyed to the cassette C T.
- a series of wafers W U, bonding process of W L is completed.
- the horizontal position of the lower chuck moving parts 162 and 165 is appropriately set. Can be adjusted to. Further, when the lower chuck 141 is moved in the vertical direction in step S11, even if the lower chuck 141 is displaced in the horizontal direction, in step S12, the amount of deviation in the horizontal position is calculated using the laser interferometer system 170. I can grasp it. Then, by performing hybrid control using the laser interferometer system 170 and the linear scales 181 and 182, the horizontal position of the lower chuck moving parts 162 and 165 can be appropriately corrected. Therefore, since the relative positions of the upper chuck 140 and the lower chuck 141 can be adjusted appropriately, the upper wafer W U held by the upper chuck 140 and the lower wafer W L held by the lower chuck 141 are then adjusted. Can be appropriately performed.
- the bonding system 1 of the present embodiment includes the surface modification device 30, the surface hydrophilization device 40, and the bonding device 41, the bonding of the wafers W U and W L can be efficiently performed in one system. It can be carried out. Therefore, the throughput of the wafer bonding process can be improved.
- the servo loop shown in FIG. 7 is used for servo control of the first lower chuck moving unit 162 and the second lower chuck moving unit 165, but the present invention is not limited to this.
- the servo loop may have a position loop and a velocity loop using the measurement results of the linear scales 181 and 182.
- the X-direction position of the first lower chuck moving unit 162 is measured using the first linear scale 181
- the Y of the second lower chuck moving unit 165 is used using the second linear scale 182. Measure the directional position.
- the lower chuck moving units 162 and 165 are servo-controlled using a position loop and a velocity loop using the measurement results of the linear scales 181 and 182.
- the X direction position of the lower chuck 141 is measured using the first laser interferometer 176, and the Y direction position of the lower chuck 141 is measured using the second laser interferometer 177. Further, from the measurement result of the laser interferometer system 170, the correction amount of the X-direction position of the first lower chuck moving unit 162 and the correction amount of the Y-direction position of the second lower chuck moving unit 165 are calculated. Based on this correction amount, the lower chuck moving parts 162 and 165 are servo-controlled.
- the same effect as that of the above embodiment can be enjoyed. That is, it is possible to adjust the relative position of the upper chuck 140 and lower chuck 141 properly, then the on the chuck 140 of the lower wafer W L held on the wafer W U and the lower chuck 141 on which is held in A joining process can be performed appropriately.
- the servo control of the lower chuck moving parts 162 and 165 is performed using only the measurement results of the linear scales 181 and 182, and the response can be increased by increasing the gain.
- the lower chuck moving unit 162 is further used using the measurement results of the laser interferometer system 170.
- the lower chuck moving parts 162 and 165 are hybrid-controlled using the measurement results of the laser interferometer system 170 and the measurement results of the linear scales 181 and 182. Then, the above embodiment can improve the throughput of the wafer bonding process.
- the lower chuck 141 is configured to be movable in the horizontal direction, but the upper chuck 140 may be configured to be movable in the horizontal direction.
- the laser interferometer system 170 and the linear scales 181 and 182 are provided on the upper chuck 140, respectively.
- both the upper chuck 140 and the lower chuck 141 may be configured to be movable in the horizontal direction.
- the laser interferometer system 170 and the linear scales 181 and 182 are provided in either the upper chuck 140 or the lower chuck 141, respectively.
- the lower chuck 141 is configured to be movable in the vertical direction.
- the upper chuck 140 may be configured to be movable in the vertical direction, or the upper chuck 140 may be configured to be movable in the vertical direction.
- Both the lower chuck 141 and the lower chuck 141 may be configured to be movable in the vertical direction.
- the lower chuck 141 is configured to be rotatable, but the upper chuck 140 may be configured to be rotatable, or both the upper chuck 140 and the lower chuck 141 may be configured to rotate. May be configured to be rotatable.
- the wafer W U by bonding device 41 after joining the W L, may be further heated bonded overlapped wafer W T with a predetermined temperature (annealing) .
- annealing a predetermined temperature
- the present invention is not limited to such examples. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the idea described in the claims, and these are naturally within the technical scope of the present invention. It is understood.
- the present invention is not limited to this example and can take various forms.
- the present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.
- FPD flat panel display
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
本願は、2016年11月9日に日本国に出願された特願2016-218580号に基づき、優先権を主張し、その内容をここに援用する。
先ず、本実施の形態にかかる接合システムの構成について説明する。図1は、接合システム1の構成の概略を示す平面図である。図2は、接合システム1の内部構成の概略を示す側面図である。
次に、上述した接合装置41の構成について説明する。
接合装置41は、図4及び図5に示すように内部を密閉可能な処理容器100を有している。処理容器100のウェハ搬送領域60側の側面には、ウェハWU、WL、重合ウェハWTの搬入出口101が形成され、当該搬入出口101には開閉シャッタ102が設けられている。
次に、接合装置41における第1の下チャック移動部162の移動と第2の下チャック移動部165のサーボ制御について説明する。本実施の形態におけるサーボ制御は、レーザ干渉計とリニアスケールを用いたハイブリッド制御である。
次に、接合装置41の上チャック140と上チャック保持部150の詳細な構成について説明する。
次に、接合装置41の下チャック141の詳細な構成について説明する。
次に、以上のように構成された接合システム1を用いて行われるウェハWU、WLの接合処理方法について説明する。図9は、かかるウェハ接合処理の主な工程の例を示すフローチャートである。
次に、本発明の他の実施の形態について説明する。
2 搬入出ステーション
3 処理ステーション
30 表面改質装置
40 表面親水化装置
41 接合装置
61 ウェハ搬送装置
70 制御部
140 上チャック
141 下チャック
162 第1の下チャック移動部
165 第2の下チャック移動部
170 レーザ干渉計システム
174 第1の反射板
175 第2の反射板
176 第1のレーザ干渉計
177 第2のレーザ干渉計
181 第1のリニアスケール
182 第2のリニアスケール
WU 上ウェハ
WL 下ウェハ
WT 重合ウェハ
Claims (10)
- 基板同士を接合する接合装置であって、
下面に第1の基板を真空引きして吸着保持する第1の保持部と、
前記第1の保持部の下方に設けられ、上面に第2の基板を真空引きして吸着保持する第2の保持部と、
前記第1の保持部と前記第2の保持部を相対的に水平方向に移動させる移動部と、
前記移動部によって移動する前記第1の保持部又は前記第2の保持部の位置を測定するレーザ干渉計と、
前記移動部の位置を測定するリニアスケールと、
前記レーザ干渉計の測定結果と前記リニアスケールの測定結果を用いて、前記移動部を制御する制御部と、を有する接合装置。 - 請求項1に記載の接合装置において、
前記制御部は位置ループと速度ループを含み、前記移動部をサーボ制御し、
前記位置ループには前記レーザ干渉計の測定結果が用いられ、
前記速度ループには前記リニアスケールの測定結果が用いられる。 - 請求項1に記載の接合装置において、
前記制御部は、前記リニアスケールの測定結果を用いて前記移動部をサーボ制御し、さらに前記レーザ干渉計の測定結果から前記移動部の水平方向位置の補正量を算出し、当該補正量に基づいて前記移動部をサーボ制御する。 - 請求項1に記載の接合装置において、
前記移動部によって移動する前記第1の保持部又は前記第2の保持部には、前記レーザ干渉計に対向する位置に反射板が設けられている。 - 請求項4に記載の接合装置において、
前記反射板の水平方向の長さは、前記移動部によって水平方向に移動する前記第1の保持部又は前記第2の保持部の移動距離以上であり、
且つ前記反射板の鉛直方向の長さは、鉛直方向に移動する前記第1の保持部又は前記第2の保持部の移動距離以上である。 - 基板同士を接合する接合装置を備えた接合システムであって、
前記接合装置は、
下面に第1の基板を真空引きして吸着保持する第1の保持部と、
前記第1の保持部の下方に設けられ、上面に第2の基板を真空引きして吸着保持する第2の保持部と、
前記第1の保持部と前記第2の保持部を相対的に水平方向に移動させる移動部と、
前記移動部によって移動する前記第1の保持部又は前記第2の保持部の位置を測定するレーザ干渉計と、
前記移動部の位置を測定するリニアスケールと、
前記レーザ干渉計の測定結果と前記リニアスケールの測定結果を用いて、前記移動部を制御する制御部と、を有し、
前記接合装置を備えた処理ステーションと、第1の基板、第2の基板又は第1の基板と第2の基板が接合された重合基板をそれぞれ複数保有可能で、且つ前記処理ステーションに対して第1の基板、第2の基板又は重合基板を搬入出する搬入出ステーションと、を備え、
前記処理ステーションは、
第1の基板又は第2の基板の接合される表面を改質する表面改質装置と、
前記表面改質装置で改質された第1の基板又は第2の基板の表面を親水化する表面親水化装置と、
前記表面改質装置、前記表面親水化装置及び前記接合装置に対して、第1の基板、第2の基板又は重合基板を搬送するための搬送装置と、を有し、
前記接合装置では、前記表面親水化装置で表面が親水化された第1の基板と第2の基板を接合する、接合システム。 - 接合装置を用いて基板同士を接合する接合方法であって、
前記接合装置は、
下面に第1の基板を真空引きして吸着保持する第1の保持部と、
前記第1の保持部の下方に設けられ、上面に第2の基板を真空引きして吸着保持する第2の保持部と、
前記第1の保持部と前記第2の保持部を相対的に水平方向に移動させる移動部と、
前記移動部によって移動する前記第1の保持部又は前記第2の保持部の位置を測定するレーザ干渉計と、
前記移動部の位置を測定するリニアスケールと、を有し、
前記接合方法では、前記レーザ干渉計の測定結果と前記リニアスケールの測定結果を用いて前記移動部を制御し、前記第1の保持部と前記第2の保持部の相対的な位置を調節する、接合方法。 - 請求項7に記載の接合方法において、
前記レーザ干渉計を用いて、前記第1の保持部又は前記第2の保持部の位置を測定する工程と、
前記リニアスケールを用いて前記移動部の位置を測定する工程と、
その後、前記レーザ干渉計の測定結果を位置ループに用いるとともに、前記リニアスケールの測定結果を速度ループに用いて、前記移動部をサーボ制御する工程と、を有する。 - 請求項7に記載の接合方法において、
前記リニアスケールを用いて前記移動部の位置を測定する工程と、
その後、前記リニアスケールの測定結果を用いて前記移動部をサーボ制御する工程と、
その後、前記レーザ干渉計を用いて、前記第1の保持部又は前記第2の保持部の位置を測定する工程と、
その後、前記レーザ干渉計の測定結果から前記移動部の水平方向位置の補正量を算出し、当該補正量に基づいて前記移動部をサーボ制御する工程と、を有する。 - 基板同士を接合する接合方法を接合装置によって実行させるように、当該接合装置を制御する制御部のコンピュータ上で動作するプログラムを格納した読み取り可能なコンピュータ記憶媒体であって、
前記接合装置は、
下面に第1の基板を真空引きして吸着保持する第1の保持部と、
前記第1の保持部の下方に設けられ、上面に第2の基板を真空引きして吸着保持する第2の保持部と、
前記第1の保持部と前記第2の保持部を相対的に水平方向に移動させる移動部と、
前記移動部によって移動する前記第1の保持部又は前記第2の保持部の位置を測定するレーザ干渉計と、
前記移動部の位置を測定するリニアスケールと、を有し、
前記接合方法では、前記レーザ干渉計の測定結果と前記リニアスケールの測定結果を用いて前記移動部を制御し、前記第1の保持部と前記第2の保持部の相対的な位置を調節する。
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