JP2018093018A - 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 - Google Patents
接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 Download PDFInfo
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- JP2018093018A JP2018093018A JP2016233985A JP2016233985A JP2018093018A JP 2018093018 A JP2018093018 A JP 2018093018A JP 2016233985 A JP2016233985 A JP 2016233985A JP 2016233985 A JP2016233985 A JP 2016233985A JP 2018093018 A JP2018093018 A JP 2018093018A
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Abstract
【解決手段】上ウェハWUと下ウェハWLを接合する接合装置は、下面に上ウェハWUを真空引きして吸着保持する上チャック140と、上チャック140の下方に設けられ、上面に下ウェハWLを真空引きして吸着保持する下チャック141と、上チャック140に設けられ、上ウェハWUの中心部を押圧する押動部材190と、上チャック140に設けられ、上チャック140からの上ウェハWUの離脱を検出する複数のセンサ175と、を有する。
【選択図】図6
Description
先ず、本実施の形態にかかる接合システムの構成について説明する。図1は、接合システム1の構成の概略を示す平面図である。図2は、接合システム1の内部構成の概略を示す側面図である。
次に、上述した接合装置41の構成について説明する。
接合装置41は、図4及び図5に示すように内部を密閉可能な処理容器100を有している。処理容器100のウェハ搬送領域60側の側面には、ウェハWU、WL、重合ウェハWTの搬入出口101が形成され、当該搬入出口101には開閉シャッタ102が設けられている。
次に、接合装置41の上チャック140の詳細な構成について説明する。
次に、上述したセンサ175の詳細、及び当該センサ175の検査結果を用いた吸引部172〜174の制御方法について説明する。
次に、接合装置41の上チャック保持部150の詳細な構成について説明する。
次に、接合装置41の下チャック141の詳細な構成について説明する。
次に、以上のように構成された接合システム1を用いて行われるウェハWU、WLの接合処理方法について説明する。図10は、かかるウェハ接合処理の主な工程の例を示すフローチャートである。
次に、本発明の他の実施の形態について説明する。
2 搬入出ステーション
3 処理ステーション
30 表面改質装置
40 表面親水化装置
41 接合装置
61 ウェハ搬送装置
70 制御部
140 上チャック
141 下チャック
172 第1の吸引部
173 第2の吸引部
174 第3の吸引部
175 センサ
190 押動部材
300 レーザ変位計
WU 上ウェハ
WL 下ウェハ
WT 重合ウェハ
Claims (19)
- 基板同士を接合する接合装置であって、
下面に第1の基板を真空引きして吸着保持する第1の保持部と、
前記第1の保持部の下方に設けられ、上面に第2の基板を真空引きして吸着保持する第2の保持部と、
前記第1の保持部に設けられ、第1の基板の中心部を押圧する押動部材と、
前記第1の保持部に設けられ、当該第1の保持部からの第1の基板の離脱を検出する複数の基板検出部と、を有することを特徴とする、接合装置。 - 前記基板検出部は、第1の基板に光を反射させ、反射光の受光量を測定することを特徴とする、請求項1に記載の接合装置。
- 前記基板検出部は、第1の基板との間の静電容量を測定することを特徴とする、請求項1に記載の接合装置。
- 前記基板検出部は、前記第1の保持部と第1の基板との距離を測定することを特徴とする、請求項1に記載の接合装置。
- 前記基板検出部は、前記第1の保持部と同心円周上に設けられていることを特徴とする、請求項1〜4のいずれか一項に記載の接合装置。
- 前記基板検出部は、複数の円周上に設けられていることを特徴とする、請求項5に記載の接合装置。
- 前記第1の保持部は、第1の基板に接触し、当該第1の基板を真空引きして吸着する複数の吸引部を有し、
前記接合装置は、前記基板検出部の検出結果に基づいて、前記吸引部を制御する制御部をさらに有することを特徴とする、請求項1〜6のいずれか一項に記載の接合装置。 - 前記制御部は、一の前記基板検出部が第1の基板の離脱を検出するタイミングと、他の前記基板検出部が第1の基板の離脱を検出するタイミングとの時間差を算出し、当該時間差が所定の閾値内になるように前記吸引部を制御することを特徴とする、請求項7に記載の接合装置。
- 前記押動部材の変位を測定する変位計をさらに有することを特徴とする、請求項1〜8のいずれか一項に記載の接合装置。
- 請求項1〜9のいずれか一項に記載の接合装置を備えた接合システムであって、
前記接合装置を備えた処理ステーションと、
第1の基板、第2の基板又は第1の基板と第2の基板が接合された重合基板をそれぞれ複数保有可能で、且つ前記処理ステーションに対して第1の基板、第2の基板又は重合基板を搬入出する搬入出ステーションと、を備え、
前記処理ステーションは、
第1の基板又は第2の基板の接合される表面を改質する表面改質装置と、
前記表面改質装置で改質された第1の基板又は第2の基板の表面を親水化する表面親水化装置と、
前記表面改質装置、前記表面親水化装置及び前記接合装置に対して、第1の基板、第2の基板又は重合基板を搬送するための搬送装置と、を有し、
前記接合装置では、前記表面親水化装置で表面が親水化された第1の基板と第2の基板を接合することを特徴とする、接合システム。 - 基板同士を接合する接合方法であって、
第1の保持部の下面に保持された第1の基板と第2の保持部の上面に保持された第2の基板とを対向配置する配置工程と、
その後、前記第1の保持部に設けられ、第1の基板の中心部を押圧する押動部材を下降させ、当該押動部材によって第1の基板の中心部と第2の基板の中心部を押圧して当接させる押圧工程と、
その後、第1の基板の中心部と第2の基板の中心部が当接した状態で、第1の基板の中心部から外周部に向けて、第1の基板と第2の基板を順次接合する接合工程と、を有し、
前記接合工程において、前記第1の基板に設けられた複数の基板検出部によって、当該第1の保持部からの第1の基板の離脱を検出し、接合処理の状態を検査することを特徴とする、接合方法。 - 前記基板検出部は、第1の基板に光を反射させ、反射光の受光量を測定することを特徴とする、請求項11に記載の接合方法。
- 前記基板検出部は、第1の基板との間の静電容量を測定することを特徴とする、請求項11に記載の接合方法。
- 前記基板検出部は、前記第1の保持部と第1の基板との距離を測定することを特徴とする、請求項11に記載の接合方法。
- 前記第1の保持部は、第1の基板に接触し、当該第1の基板を真空引きして吸着する複数の吸引部を有し、
前記基板検出部の検出結果に基づいて、前記吸引部を制御することを特徴とする、請求項11〜14いずれか一項に記載の接合方法。 - 一の前記基板検出部が第1の基板の離脱を検出するタイミングと、他の前記基板検出部が第1の基板の離脱を検出するタイミングとの時間差を算出し、当該時間差が所定の閾値内になるように前記吸引部を制御することを特徴とする、請求項15に記載の接合方法。
- 前記接合工程において、変位計によって前記押動部材の変位をさらに測定し、前記変位計による測定結果と前記基板検出部による検出結果に基づいて、接合処理の状態を検査することを特徴とする、請求項11〜16のいずれか一項に記載の接合方法。
- 請求項11〜17のいずれか一項に記載の接合方法を接合装置によって実行させるように、当該接合装置を制御する制御部のコンピュータ上で動作するプログラム。
- 請求項18に記載のプログラムを格納した読み取り可能なコンピュータ記憶媒体。
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US10985132B2 (en) | 2021-04-20 |
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