JP6161691B2 - ニッケル層の無電解堆積用のめっき浴 - Google Patents

ニッケル層の無電解堆積用のめっき浴 Download PDF

Info

Publication number
JP6161691B2
JP6161691B2 JP2015515485A JP2015515485A JP6161691B2 JP 6161691 B2 JP6161691 B2 JP 6161691B2 JP 2015515485 A JP2015515485 A JP 2015515485A JP 2015515485 A JP2015515485 A JP 2015515485A JP 6161691 B2 JP6161691 B2 JP 6161691B2
Authority
JP
Japan
Prior art keywords
plating bath
nickel
electroless plating
aqueous electroless
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015515485A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015524024A5 (enExample
JP2015524024A (ja
Inventor
ブルナー ハイコ
ブルナー ハイコ
ピツァレク ヤン
ピツァレク ヤン
ベヤン イウリア
ベヤン イウリア
クラウゼ カーステン
クラウゼ カーステン
ベーラ ホルガー
ベーラ ホルガー
リュックブロート スヴェン
リュックブロート スヴェン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of JP2015524024A publication Critical patent/JP2015524024A/ja
Publication of JP2015524024A5 publication Critical patent/JP2015524024A5/ja
Application granted granted Critical
Publication of JP6161691B2 publication Critical patent/JP6161691B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76849—Barrier, adhesion or liner layers formed in openings in a dielectric the layer being positioned on top of the main fill metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2015515485A 2012-06-04 2013-05-31 ニッケル層の無電解堆積用のめっき浴 Active JP6161691B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20120170693 EP2671969A1 (en) 2012-06-04 2012-06-04 Plating bath for electroless deposition of nickel layers
EP12170693.1 2012-06-04
PCT/EP2013/061280 WO2013182489A2 (en) 2012-06-04 2013-05-31 Plating bath for electroless deposition of nickel layers

Publications (3)

Publication Number Publication Date
JP2015524024A JP2015524024A (ja) 2015-08-20
JP2015524024A5 JP2015524024A5 (enExample) 2016-06-30
JP6161691B2 true JP6161691B2 (ja) 2017-07-12

Family

ID=48626419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015515485A Active JP6161691B2 (ja) 2012-06-04 2013-05-31 ニッケル層の無電解堆積用のめっき浴

Country Status (11)

Country Link
US (1) US9175399B2 (enExample)
EP (2) EP2671969A1 (enExample)
JP (1) JP6161691B2 (enExample)
KR (1) KR101930585B1 (enExample)
CN (1) CN104321463B (enExample)
BR (1) BR112014028715B1 (enExample)
CA (1) CA2875317C (enExample)
ES (1) ES2688547T3 (enExample)
MY (1) MY168645A (enExample)
TW (1) TWI560316B (enExample)
WO (1) WO2013182489A2 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103952687B (zh) * 2014-05-05 2017-02-15 广东东硕科技有限公司 印制线路板化学镀镍的防止渗镀方法
US11685999B2 (en) * 2014-06-02 2023-06-27 Macdermid Acumen, Inc. Aqueous electroless nickel plating bath and method of using the same
US9708693B2 (en) 2014-06-03 2017-07-18 Macdermid Acumen, Inc. High phosphorus electroless nickel
JP6352079B2 (ja) * 2014-07-03 2018-07-04 奥野製薬工業株式会社 無電解めっき液、めっき皮膜、めっき品及びめっき皮膜の形成方法
EP3026143A1 (en) * 2014-11-26 2016-06-01 ATOTECH Deutschland GmbH Plating bath and method for electroless deposition of nickel layers
ES2639300T3 (es) 2014-12-16 2017-10-26 Atotech Deutschland Gmbh Composiciones de baño de chapado para el chapado no electrolítico de metales y aleaciones metálicas
KR102513653B1 (ko) 2015-03-20 2023-03-23 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 실리콘 기판의 활성화 방법
CN113215626A (zh) * 2015-06-30 2021-08-06 麦德美乐思公司 微电子电路中的互连部的钴填充
TWI707061B (zh) * 2015-11-27 2020-10-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
CN105624656B (zh) * 2015-12-30 2018-05-01 大连大学 一种化学镀Ni-P/Ni-Mo-P-PTFE复合结构镀层及其制备方法
EP3190208B1 (en) 2016-01-06 2018-09-12 ATOTECH Deutschland GmbH Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys
TWI713737B (zh) 2016-05-04 2020-12-21 德商德國艾托特克公司 沉積金屬或金屬合金至基板表面及包含基板表面活化之方法
US10577692B2 (en) * 2017-01-05 2020-03-03 International Business Machines Corporation Pretreatment of iron-based substrates for electroless plating
CN107313034A (zh) * 2017-06-27 2017-11-03 佛山科学技术学院 一种高磷化学镀镍钴锰磷合金溶液及其制备方法
CN107475699A (zh) * 2017-08-28 2017-12-15 中石化炼化工程（集团）股份有限公司 气液分配器的防腐涂层、制备方法及其应用
EP3456870A1 (en) * 2017-09-13 2019-03-20 ATOTECH Deutschland GmbH A bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
KR102036329B1 (ko) * 2017-09-20 2019-10-25 한국기계연구원 무전해 도금액, 무전해 도금 방법 및 이를 이용하여 형성된 도금층
KR102036334B1 (ko) * 2017-09-20 2019-10-25 한국기계연구원 무전해 도금액 및 무전해 도금 방법
KR101932963B1 (ko) * 2018-02-20 2018-12-27 한국기계연구원 촉매-프리 무전해도금용 조성물 및 이를 이용한 무전해도금 방법
CA3092257C (en) * 2018-02-26 2023-01-24 Graphene Leaders Canada (Glc) Inc. Electroless plating of objects with carbon-based material
CN108607586B (zh) * 2018-04-28 2021-02-05 重庆长安汽车股份有限公司 一种镍磷化物、其制备方法及电解水制氢的方法
JP7375009B2 (ja) * 2018-11-06 2023-11-07 アトテック ドイチュラント ゲー・エム・ベー・ハー ウント コー． カー・ゲー 無電解ニッケルめっき溶液
KR102250500B1 (ko) * 2019-03-18 2021-05-12 (주)엠에스씨 자동차 lds 전장 부품용 무전해 중성-중온 니켈도금액
CN110079794A (zh) * 2019-05-08 2019-08-02 深圳市长裕环保有限公司 一种纳米易焊高硬耐磨防腐装饰合金催化液及其制备方法
DE102019112883B4 (de) * 2019-05-16 2024-05-16 Pac Tech - Packaging Technologies Gmbh Beschichtungsbad zur stromlosen Beschichtung eines Substrats
CN115867695A (zh) * 2020-05-08 2023-03-28 朗姆研究公司 电镀钴、镍及其合金
LT6899B (lt) * 2020-08-27 2022-04-11 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Vario paviršiaus cheminio nikeliavimo būdas, nenaudojant aktyvavimo paladžiu
US11505867B1 (en) 2021-06-14 2022-11-22 Consolidated Nuclear Security, LLC Methods and systems for electroless plating a first metal onto a second metal in a molten salt bath, and surface pretreatments therefore
US20230103643A1 (en) * 2021-10-04 2023-04-06 Applied Materials, Inc. ADVANCED BARRIER NICKEL OXIDE (BNiO) COATING DEVELOPMENT FOR THE PROCESS CHAMBER COMPONENTS

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2658841A (en) 1950-11-08 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2658842A (en) 1951-01-04 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2762723A (en) 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
US2847327A (en) 1954-10-25 1958-08-12 Gen Am Transport Processes of chemical nickel plating and baths therefor
US2935425A (en) 1954-12-29 1960-05-03 Gen Am Transport Chemical nickel plating processes and baths therefor
US2841602A (en) * 1955-10-04 1958-07-01 Udylite Res Corp Alkynoxy acids
US3338726A (en) 1958-10-01 1967-08-29 Du Pont Chemical reduction plating process and bath
US3457089A (en) * 1967-04-07 1969-07-22 Shipley Co Electroless copperplating
US3597266A (en) 1968-09-23 1971-08-03 Enthone Electroless nickel plating
US3915716A (en) 1969-04-17 1975-10-28 Schering Ag Chemical nickel plating bath
US3649308A (en) * 1970-05-21 1972-03-14 Shipley Co Stabilized electroless plating solutions
JPS504327B1 (enExample) * 1970-06-03 1975-02-18
DE2028950B2 (de) 1970-06-12 1976-05-13 Shipley Co., Inc., Newton, Mass. (V.SLA.) Waessrige loesung zum stromlosen abschneiden von nickel, kobalt oder legierungen davon
GB1315212A (en) * 1970-07-31 1973-05-02 Shipley Co Electroless nickel and or cobalt plating solutions
US3953654A (en) 1973-08-13 1976-04-27 Rca Corporation Temperature-stable non-magnetic alloy
US4016051A (en) * 1975-05-02 1977-04-05 Starlite Chemicals, Inc. Additives for bright plating nickel, cobalt and nickel-cobalt alloys
US4435254A (en) * 1978-11-01 1984-03-06 M&T Chemicals Inc. Bright nickel electroplating
US4466233A (en) 1982-09-30 1984-08-21 Thesman Industries, Inc. Mower drive assembly
US4467067A (en) 1982-12-27 1984-08-21 Shipley Company Electroless nickel plating
US4600609A (en) * 1985-05-03 1986-07-15 Macdermid, Incorporated Method and composition for electroless nickel deposition
US4699811A (en) * 1986-09-16 1987-10-13 Macdermid, Incorporated Chromium mask for electroless nickel or copper plating
US4780342A (en) 1987-07-20 1988-10-25 General Electric Company Electroless nickel plating composition and method for its preparation and use
JP3115095B2 (ja) * 1992-04-20 2000-12-04 ディップソール株式会社 無電解メッキ液及びそれを使用するメッキ方法
DE10327374B4 (de) * 2003-06-18 2006-07-06 Raschig Gmbh Verwendung von propansulfonierten und 2-Hydroxy-propansulfonierten Alkylaminaloxylaten als Hilfsmittel zur elektrolytischen Abscheidung von metallischen Schichten und galvanische Bäder enthaltend diese
US7223299B2 (en) 2003-09-02 2007-05-29 Atotech Deutschland Gmbh Composition and process for improving the adhesion of a siccative organic coating compositions to metal substrates
JP2005126734A (ja) 2003-10-21 2005-05-19 C Uyemura & Co Ltd 無電解ニッケルめっき浴及びそれを用いためっき方法
WO2005078163A1 (en) * 2004-02-05 2005-08-25 Taskem, Inc. Ternary and quaternary alloys to replace chromium
WO2007002070A2 (en) * 2005-06-20 2007-01-04 Pavco, Inc. Zinc-nickel alloy electroplating system
JP5158320B2 (ja) 2007-03-30 2013-03-06 上村工業株式会社 無電解ニッケルめっき方法、リンクチェーン及びその製造方法
CN102272356A (zh) * 2008-11-07 2011-12-07 克斯塔里克公司 电沉积液、系统及方法
EP2639335B1 (en) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys

Also Published As

Publication number Publication date
CA2875317A1 (en) 2013-12-12
TWI560316B (en) 2016-12-01
WO2013182489A2 (en) 2013-12-12
KR101930585B1 (ko) 2018-12-18
CN104321463B (zh) 2016-12-28
EP2855732A2 (en) 2015-04-08
KR20150024317A (ko) 2015-03-06
TW201406992A (zh) 2014-02-16
CN104321463A (zh) 2015-01-28
BR112014028715A2 (pt) 2017-06-27
US20150110965A1 (en) 2015-04-23
EP2855732B1 (en) 2018-07-18
EP2671969A1 (en) 2013-12-11
CA2875317C (en) 2020-03-31
WO2013182489A3 (en) 2014-07-17
ES2688547T3 (es) 2018-11-05
BR112014028715B1 (pt) 2022-01-25
MY168645A (en) 2018-11-27
US9175399B2 (en) 2015-11-03
JP2015524024A (ja) 2015-08-20

Similar Documents

Publication Publication Date Title
JP6161691B2 (ja) ニッケル層の無電解堆積用のめっき浴
TWI814822B (zh) 無電解銅或銅合金鍍浴及用於鍍覆之方法
TW201720955A (zh) 用於金之無電電鍍之鍍浴組合物及沉積金層之方法
JP6099678B2 (ja) コバルト合金無電解めっき用アルカリ性めっき浴
JP2013108170A (ja) 無電解パラジウムめっき液
JP6569026B1 (ja) 無電解パラジウムめっき液、およびパラジウム皮膜
TW201723226A (zh) 鈀之電鍍浴組合物及無電電鍍方法
CN100480425C (zh) 化学镀金液
CN106399981B (zh) 化学镀镍浴
TW201932476A (zh) 無電鍍金鍍浴
JP2005126734A (ja) 無電解ニッケルめっき浴及びそれを用いためっき方法
CN114729455A (zh) 无电镍合金镀覆浴、沉积镍合金的方法、镍合金沉积物和此些形成的镍合金沉积物的用途

Legal Events

Date Code Title Description
A529 Written submission of copy of amendment under article 34 pct

Free format text: JAPANESE INTERMEDIATE CODE: A529

Effective date: 20150203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150604

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160513

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160513

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170214

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170220

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170508

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170605

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170613

R150 Certificate of patent or registration of utility model

Ref document number: 6161691

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250