GB1315212A - Electroless nickel and or cobalt plating solutions - Google Patents
Electroless nickel and or cobalt plating solutionsInfo
- Publication number
- GB1315212A GB1315212A GB1315212DA GB1315212A GB 1315212 A GB1315212 A GB 1315212A GB 1315212D A GB1315212D A GB 1315212DA GB 1315212 A GB1315212 A GB 1315212A
- Authority
- GB
- United Kingdom
- Prior art keywords
- stabilizer
- ppm
- mercury
- ions
- iodate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1315212 Electroless Co and Ni solutions SHIPLEY CO INC 31 July 1970 37086/70 Heading C7F An aqueous Ni and/or Co plating solution comprises a source of Ni and/or Co ions, a hypophosphite reducing agent therefor, a complexing agent therefor, a pH adjuster, and, as stabilizer, mercury ions. A known stabilizer may be added to act synergistically with the mercury ions, which are provided e.g. in amounts of 1-100 ppm., by mercuric acetate, benzoate, bromide, carbonate chlorate, chloride, iodate, nitrate, sulphate or mercuric ammonium chloride; said known stabilizer may be a divalent sulphur compound, e.g. Na 2 S, K 2 S, Na or K polysulphide, NaCNS, KCNS, K 2 S 2 O 6 , Na 2 S 2 O 3 , K 2 S 2 O 3 , thiourea, 2-mercaptobenzothiazole, 1, 2-ethanedithiol, 1, 2-ben zoiso thiazane, methionine, 2, 2'-thiodiethanol, dithioglycol or thiodiglycollic acid, a watersoluble cyanide, e.g. NaCN, KCN, an α-hydroxy nitrile, iminodiacetonitrile, or 3-3'-iminodipropionitrile (trace to 300 ppm.) or R-C#Ch or R'-C#C-R", R, R' and R" being lower monovalent hydroxyalkyl, cydohydroxyalkyl, or hydroxyalkylether, or alkyl or aryl substituted with a water solubilizing group such as -OH or -COOH. The other stabilizer may also be iodate or Pb<SP>++</SP> ion, up to 50 ppm. The mercury is incorporated into the coating. Plastics or cotton cloth is cleaned, sensitized with SnCl 2 /PdCl 2 or else with precious metal/stannic acid colloid, and then electroless plated in the solution.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3708670 | 1970-07-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1315212A true GB1315212A (en) | 1973-05-02 |
Family
ID=10393611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1315212D Expired GB1315212A (en) | 1970-07-31 | 1970-07-31 | Electroless nickel and or cobalt plating solutions |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1315212A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2671969A1 (en) * | 2012-06-04 | 2013-12-11 | ATOTECH Deutschland GmbH | Plating bath for electroless deposition of nickel layers |
JP2015510042A (en) * | 2012-03-14 | 2015-04-02 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | Alkaline plating bath for electroless plating of cobalt alloy |
WO2017118655A1 (en) * | 2016-01-06 | 2017-07-13 | Atotech Deutschland Gmbh | Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys |
US10513780B2 (en) * | 2015-11-27 | 2019-12-24 | Atotech Deutschland Gmbh | Plating bath composition and method for electroless plating of palladium |
-
1970
- 1970-07-31 GB GB1315212D patent/GB1315212A/en not_active Expired
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015510042A (en) * | 2012-03-14 | 2015-04-02 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | Alkaline plating bath for electroless plating of cobalt alloy |
EP2671969A1 (en) * | 2012-06-04 | 2013-12-11 | ATOTECH Deutschland GmbH | Plating bath for electroless deposition of nickel layers |
WO2013182489A3 (en) * | 2012-06-04 | 2014-07-17 | Atotech Deutschland Gmbh | Plating bath for electroless deposition of nickel layers |
CN104321463A (en) * | 2012-06-04 | 2015-01-28 | 德国艾托特克公司 | Plating bath for electroless deposition of nickel layers |
US9175399B2 (en) | 2012-06-04 | 2015-11-03 | Atotech Deutschland Gmbh | Plating bath for electroless deposition of nickel layers |
US10513780B2 (en) * | 2015-11-27 | 2019-12-24 | Atotech Deutschland Gmbh | Plating bath composition and method for electroless plating of palladium |
WO2017118655A1 (en) * | 2016-01-06 | 2017-07-13 | Atotech Deutschland Gmbh | Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |