JP6157998B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6157998B2
JP6157998B2 JP2013182363A JP2013182363A JP6157998B2 JP 6157998 B2 JP6157998 B2 JP 6157998B2 JP 2013182363 A JP2013182363 A JP 2013182363A JP 2013182363 A JP2013182363 A JP 2013182363A JP 6157998 B2 JP6157998 B2 JP 6157998B2
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Prior art keywords
wiring board
view
plan
semiconductor device
corner
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JP2013182363A
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Japanese (ja)
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JP2015050384A (ja
JP2015050384A5 (enExample
Inventor
高橋　聡
聡 高橋
修一 仮屋崎
修一 仮屋崎
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Renesas Electronics Corp
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Renesas Electronics Corp
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Priority to JP2013182363A priority Critical patent/JP6157998B2/ja
Priority to US14/447,181 priority patent/US9142519B2/en
Priority to CN201410446862.7A priority patent/CN104517907A/zh
Publication of JP2015050384A publication Critical patent/JP2015050384A/ja
Priority to US14/833,341 priority patent/US20150364392A1/en
Priority to HK15109477.6A priority patent/HK1208958A1/xx
Publication of JP2015050384A5 publication Critical patent/JP2015050384A5/ja
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Publication of JP6157998B2 publication Critical patent/JP6157998B2/ja
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
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    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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    • H05K2203/01—Tools for processing; Objects used during processing
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    • H05K2203/0169—Using a temporary frame during processing
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    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
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    • H05K2203/16—Inspection; Monitoring; Aligning
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
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JP2013182363A JP6157998B2 (ja) 2013-09-03 2013-09-03 半導体装置
US14/447,181 US9142519B2 (en) 2013-09-03 2014-07-30 Semiconductor device with covering member that partially covers wiring substrate
CN201410446862.7A CN104517907A (zh) 2013-09-03 2014-09-03 半导体器件
US14/833,341 US20150364392A1 (en) 2013-09-03 2015-08-24 Semiconductor device with covering member that partially covers wiring substrate
HK15109477.6A HK1208958A1 (en) 2013-09-03 2015-09-25 Semiconductor device

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US9799626B2 (en) * 2014-09-15 2017-10-24 Invensas Corporation Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers
TWI545714B (zh) * 2015-03-06 2016-08-11 矽品精密工業股份有限公司 電子封裝件及其製法
US10607958B2 (en) * 2015-08-28 2020-03-31 Texas Instruments Incorporated Flip chip backside die grounding techniques
WO2018088293A1 (ja) 2016-11-14 2018-05-17 株式会社村田製作所 電子部品及び三端子コンデンサ
KR102633142B1 (ko) * 2019-08-26 2024-02-02 삼성전자주식회사 반도체 패키지
FR3109466B1 (fr) 2020-04-16 2024-05-17 St Microelectronics Grenoble 2 Dispositif de support d’une puce électronique et procédé de fabrication correspondant
KR102721233B1 (ko) * 2020-06-03 2024-10-24 삼성전자주식회사 반도체 패키지
JP7528557B2 (ja) * 2020-06-19 2024-08-06 日本電気株式会社 量子デバイス及びその製造方法

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US5789810A (en) * 1995-12-21 1998-08-04 International Business Machines Corporation Semiconductor cap
JPH10270815A (ja) * 1997-03-21 1998-10-09 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
US5898219A (en) * 1997-04-02 1999-04-27 Intel Corporation Custom corner attach heat sink design for a plastic ball grid array integrated circuit package
JP2861981B2 (ja) * 1997-04-11 1999-02-24 日本電気株式会社 半導体装置の冷却構造
JP3834426B2 (ja) * 1997-09-02 2006-10-18 沖電気工業株式会社 半導体装置
JP3462979B2 (ja) * 1997-12-01 2003-11-05 株式会社東芝 半導体装置
TW388976B (en) * 1998-10-21 2000-05-01 Siliconware Precision Industries Co Ltd Semiconductor package with fully exposed heat sink
US6218730B1 (en) * 1999-01-06 2001-04-17 International Business Machines Corporation Apparatus for controlling thermal interface gap distance
JP3467454B2 (ja) * 2000-06-05 2003-11-17 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
KR100375720B1 (ko) * 2000-10-09 2003-03-15 삼성전자주식회사 반도체 패키지 및 그의 제조 방법
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US8202765B2 (en) * 2009-01-22 2012-06-19 International Business Machines Corporation Achieving mechanical and thermal stability in a multi-chip package
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US20150061104A1 (en) 2015-03-05
US20150364392A1 (en) 2015-12-17

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