JP6144495B2 - 加熱接合装置及び加熱接合製品の製造方法 - Google Patents

加熱接合装置及び加熱接合製品の製造方法 Download PDF

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Publication number
JP6144495B2
JP6144495B2 JP2013011040A JP2013011040A JP6144495B2 JP 6144495 B2 JP6144495 B2 JP 6144495B2 JP 2013011040 A JP2013011040 A JP 2013011040A JP 2013011040 A JP2013011040 A JP 2013011040A JP 6144495 B2 JP6144495 B2 JP 6144495B2
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Japan
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temperature
heat
vacuum
buffer
see
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JP2013011040A
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English (en)
Japanese (ja)
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JP2014143304A5 (enExample
JP2014143304A (ja
Inventor
純 松田
純 松田
鈴木　隆之
隆之 鈴木
正己 黒田
正己 黒田
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Origin Electric Co Ltd
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Origin Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to JP2013011040A priority Critical patent/JP6144495B2/ja
Application filed by Origin Electric Co Ltd filed Critical Origin Electric Co Ltd
Priority to CN201480005967.7A priority patent/CN104956780B/zh
Priority to EP14742961.7A priority patent/EP2950622B1/en
Priority to HK16101806.4A priority patent/HK1214072B/xx
Priority to PCT/JP2014/050239 priority patent/WO2014115583A1/ja
Priority to US14/763,150 priority patent/US9919372B2/en
Priority to TW103102421A priority patent/TWI639478B/zh
Publication of JP2014143304A publication Critical patent/JP2014143304A/ja
Publication of JP2014143304A5 publication Critical patent/JP2014143304A5/ja
Application granted granted Critical
Publication of JP6144495B2 publication Critical patent/JP6144495B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2013011040A 2013-01-24 2013-01-24 加熱接合装置及び加熱接合製品の製造方法 Active JP6144495B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2013011040A JP6144495B2 (ja) 2013-01-24 2013-01-24 加熱接合装置及び加熱接合製品の製造方法
EP14742961.7A EP2950622B1 (en) 2013-01-24 2014-01-09 Heat-bonding device and heat-bonded-article manufacturing method
HK16101806.4A HK1214072B (en) 2013-01-24 2014-01-09 Heat-bonding device and heat-bonded-article manufacturing method
PCT/JP2014/050239 WO2014115583A1 (ja) 2013-01-24 2014-01-09 加熱接合装置及び加熱接合製品の製造方法
CN201480005967.7A CN104956780B (zh) 2013-01-24 2014-01-09 加热接合装置及加热接合产品的制造方法
US14/763,150 US9919372B2 (en) 2013-01-24 2014-01-09 Heat-bonding apparatus and method of manufacturing heat-bonded products
TW103102421A TWI639478B (zh) 2013-01-24 2014-01-23 加熱接合裝置及加熱接合製品的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013011040A JP6144495B2 (ja) 2013-01-24 2013-01-24 加熱接合装置及び加熱接合製品の製造方法

Publications (3)

Publication Number Publication Date
JP2014143304A JP2014143304A (ja) 2014-08-07
JP2014143304A5 JP2014143304A5 (enExample) 2016-02-12
JP6144495B2 true JP6144495B2 (ja) 2017-06-07

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JP2013011040A Active JP6144495B2 (ja) 2013-01-24 2013-01-24 加熱接合装置及び加熱接合製品の製造方法

Country Status (6)

Country Link
US (1) US9919372B2 (enExample)
EP (1) EP2950622B1 (enExample)
JP (1) JP6144495B2 (enExample)
CN (1) CN104956780B (enExample)
TW (1) TWI639478B (enExample)
WO (1) WO2014115583A1 (enExample)

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JP5902107B2 (ja) * 2013-01-24 2016-04-13 オリジン電気株式会社 加熱接合装置及び加熱接合製品の製造方法
CN107000092B (zh) 2014-12-09 2019-06-21 平克塞莫系统有限公司 用于制造电子部件的焊接连接部的传热装置
DE102015106298B4 (de) * 2015-04-24 2017-01-26 Semikron Elektronik Gmbh & Co. Kg Vorrichtung, Verfahren und Anlage zur inhomogenen Abkühlung eines flächigen Gegenstandes
JP6720033B2 (ja) * 2016-09-14 2020-07-08 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
JP6215426B1 (ja) * 2016-09-21 2017-10-18 オリジン電気株式会社 加熱装置及び板状部材の製造方法
JP6322746B1 (ja) * 2017-03-30 2018-05-09 オリジン電気株式会社 ワーク処理装置及び処理済ワークの製造方法
JP6803617B2 (ja) * 2017-12-13 2020-12-23 株式会社シンアペックス リフロー装置
CN107855623B (zh) * 2017-12-29 2023-07-18 山东才聚电子科技有限公司 一种真空焊接炉控制系统及其控制方法
CN107931768B (zh) * 2017-12-29 2023-05-16 山东才聚电子科技有限公司 一种真空焊接炉及焊接工艺
CN107838516B (zh) * 2017-12-29 2023-10-03 山东才聚电子科技有限公司 一种真空焊接炉的焊接机构
CN108788363B (zh) * 2018-07-17 2024-05-14 兴宁市光科电子有限公司 电感线圈生产用自动焊锡设备
JP2020064936A (ja) * 2018-10-16 2020-04-23 トヨタ自動車株式会社 半導体装置の製造方法
JP7168430B2 (ja) * 2018-12-04 2022-11-09 株式会社アイシン福井 レーザ溶接装置
JP7239307B2 (ja) * 2018-12-04 2023-03-14 株式会社アイシン福井 レーザ溶接装置
JP6879482B1 (ja) * 2020-01-09 2021-06-02 株式会社オリジン 酸化物除去済部材の製造方法及び酸化物除去装置
CN113492240B (zh) * 2020-03-18 2024-09-03 上海朗仕电子设备有限公司 一种用于真空回流焊炉的传送系统
CN115702489A (zh) * 2020-06-18 2023-02-14 库利克和索夫工业公司 用于如晶粒附接系统、覆晶接合系统、及片夹附接系统之设备的烤箱及相关方法
US20250187093A1 (en) * 2023-12-08 2025-06-12 Hanon Systems Brazed components and improved method of manufacturing them

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Also Published As

Publication number Publication date
US9919372B2 (en) 2018-03-20
HK1214072A1 (zh) 2016-07-15
US20150321278A1 (en) 2015-11-12
EP2950622B1 (en) 2020-08-19
WO2014115583A1 (ja) 2014-07-31
JP2014143304A (ja) 2014-08-07
TWI639478B (zh) 2018-11-01
TW201436908A (zh) 2014-10-01
EP2950622A1 (en) 2015-12-02
CN104956780A (zh) 2015-09-30
EP2950622A4 (en) 2016-09-07
CN104956780B (zh) 2018-05-15

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