JP6138503B2 - チャックテーブル - Google Patents

チャックテーブル Download PDF

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Publication number
JP6138503B2
JP6138503B2 JP2013019400A JP2013019400A JP6138503B2 JP 6138503 B2 JP6138503 B2 JP 6138503B2 JP 2013019400 A JP2013019400 A JP 2013019400A JP 2013019400 A JP2013019400 A JP 2013019400A JP 6138503 B2 JP6138503 B2 JP 6138503B2
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JP
Japan
Prior art keywords
suction
glass plate
holding
composite glass
chuck table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013019400A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014150219A (ja
Inventor
佐藤　淳
佐藤　　淳
龍吾 大庭
龍吾 大庭
雄輝 小川
雄輝 小川
信康 北原
信康 北原
洋司 森數
洋司 森數
義則 堀口
義則 堀口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2013019400A priority Critical patent/JP6138503B2/ja
Priority to TW103100369A priority patent/TWI606549B/zh
Priority to CN201410039747.8A priority patent/CN103962729B/zh
Publication of JP2014150219A publication Critical patent/JP2014150219A/ja
Application granted granted Critical
Publication of JP6138503B2 publication Critical patent/JP6138503B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
JP2013019400A 2013-02-04 2013-02-04 チャックテーブル Active JP6138503B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013019400A JP6138503B2 (ja) 2013-02-04 2013-02-04 チャックテーブル
TW103100369A TWI606549B (zh) 2013-02-04 2014-01-06 Suction cup table
CN201410039747.8A CN103962729B (zh) 2013-02-04 2014-01-27 卡盘工作台

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013019400A JP6138503B2 (ja) 2013-02-04 2013-02-04 チャックテーブル

Publications (2)

Publication Number Publication Date
JP2014150219A JP2014150219A (ja) 2014-08-21
JP6138503B2 true JP6138503B2 (ja) 2017-05-31

Family

ID=51232992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013019400A Active JP6138503B2 (ja) 2013-02-04 2013-02-04 チャックテーブル

Country Status (3)

Country Link
JP (1) JP6138503B2 (zh)
CN (1) CN103962729B (zh)
TW (1) TWI606549B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI559433B (zh) * 2015-01-09 2016-11-21 旭東機械工業股份有限公司 乾燥劑黏貼裝置
JP2019521254A (ja) * 2016-07-01 2019-07-25 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 処理システム、フレキシブル基板を処理するための方法、及び堆積装置
JP2018126830A (ja) * 2017-02-09 2018-08-16 株式会社ディスコ 加工装置
JP6994852B2 (ja) * 2017-06-30 2022-01-14 株式会社ディスコ レーザー加工装置及びレーザー加工方法
KR102089584B1 (ko) * 2018-02-06 2020-03-17 주식회사 비에스피 유리기판 레이저 용접장치
CN109822476B (zh) * 2019-02-12 2020-09-01 永康市杰地希机器人科技有限公司 防盗门门框加工拼装夹紧机构及其夹紧方法
JP7465670B2 (ja) * 2020-02-18 2024-04-11 株式会社ディスコ 保持テーブル機構及び加工装置
JP2022079812A (ja) * 2020-11-17 2022-05-27 株式会社ディスコ チャックテーブル及びレーザー加工装置
JP7555676B2 (ja) * 2020-12-16 2024-09-25 株式会社ディスコ 保持テーブルの製造方法
US11955363B2 (en) * 2021-05-12 2024-04-09 Rockley Photonics Limited Bonding fixture
WO2023162616A1 (ja) * 2022-02-24 2023-08-31 三菱電機株式会社 光学部品およびレーザ加工機

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102850A (ja) * 1989-09-18 1991-04-30 Fujitsu Ltd ウェハホルダ
JPH05344284A (ja) * 1992-06-04 1993-12-24 Asahi Optical Co Ltd 画像読取装置
US20020109775A1 (en) * 2001-02-09 2002-08-15 Excellon Automation Co. Back-lighted fiducial recognition system and method of use
JP4655406B2 (ja) * 2001-05-11 2011-03-23 株式会社東京精密 面発光式吸着テーブル
JP2003197581A (ja) * 2001-10-18 2003-07-11 Fujitsu Ltd 板状物支持部材及びその使用方法
JP4102101B2 (ja) * 2002-05-14 2008-06-18 株式会社ディスコ 撮像ユニット
JP4119170B2 (ja) * 2002-06-10 2008-07-16 株式会社ディスコ チャックテーブル
JP2007115961A (ja) * 2005-10-21 2007-05-10 Tecdia Kk 基板保持装置
JP2007201433A (ja) * 2005-12-27 2007-08-09 Nidec-Read Corp 基板保持台
JP2008254132A (ja) * 2007-04-05 2008-10-23 Tokyo Seimitsu Co Ltd チャックテーブル
CN101609786B (zh) * 2008-06-17 2011-01-05 旺硅科技股份有限公司 晶粒取放系统及顶针器
KR101145240B1 (ko) * 2010-06-15 2012-05-24 주식회사 씨엔디플러스 웨이퍼 지지장치
JP5291687B2 (ja) * 2010-10-05 2013-09-18 三星ダイヤモンド工業株式会社 吸着テーブル
JP5632313B2 (ja) * 2011-03-15 2014-11-26 リンテック株式会社 光照射装置および光照射方法

Also Published As

Publication number Publication date
JP2014150219A (ja) 2014-08-21
TW201438142A (zh) 2014-10-01
CN103962729B (zh) 2017-05-03
CN103962729A (zh) 2014-08-06
TWI606549B (zh) 2017-11-21

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